Summit LT150 rework system supports rework of components up to 150mm on large, high-density electronics assemblies. Platform includes a 150×150mm vision area that allows full-component viewing while enabling corner-level alignment during placement. System accommodates board sizes up to 24×36in, with optional configuration for larger formats. Rework platform provides up to 100mm top- and bottom-side clearance to allow access around tall connectors, heat sinks, and power modules commonly used in high-power assemblies. Thermal system combines a 4.4kW top heater with up to 11.2kW of bottom-side heating to support temperature uniformity across large component footprints. Dual PID control, programmable airflow, and a 1.5kW spot heater support thermal profile adjustment during rework operations. System developed for electronics manufacturing environments addressing large components used in AI and power electronics assemblies.

Custom Samsung nozzle (Part #2026-5654) supports placement of LiteOn TLMH4TGVADA LEDs on Samsung CP45 and SM10–SM421 pick-and-place platforms. Design incorporates a Samsung-style nozzle base with a standard reflector size for machine recognition and a precision plastic tip measuring 4.50mm × 4.50mm to match the LED package geometry. Tip construction is intended to maintain stable vacuum pickup while protecting sensitive LED surfaces during high-speed SMT placement. Component is designed for application-specific SMT assembly where nonstandard component shapes require specialized nozzle tooling.

MCJ Series surface-mount jumper chip resistors use a solid metal element construction to provide low resistance and higher current capacity in standard chip sizes. Supports current ratings from 8A in 0201 packages to 122A in 2512 sizes, with overload capability up to 244A. Designed for applications where conventional thick-film jumpers are limited to lower current levels. Available in chip sizes 0201, 0402, 0805, 1206 and 2512. Sizes 0402, 0603 and 0805 are AEC compliant for automotive applications.

SolderKing released SAC0307, a low-silver alloy option within its SK P2-5 solder paste family designed to support flexible alloy selection while maintaining the same established flux chemistry and process settings. The paste enables manufacturers to evaluate alternative alloy compositions without modifying existing production parameters. Designed for surface-mount assembly applications requiring reliable stencil printing and consistent wetting across common PCB finishes including OSP, ENIG, immersion silver, tin and HASL. The flux formulation is designed to reduce voiding and head-in-pillow defects while leaving minimal residue after reflow. The material complies with J-STD-004B and Bellcore ECM requirements. Available in Type 4 (20–38µm) and Type 5 (15–25µm) powder grades to support fine-pitch and high-density assemblies. Extended tack and open times exceeding three days provide flexibility for longer production runs or staged builds, while a 12-month refrigerated shelf life supports material inventory management.

SolderKing Assembly Materials

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OE in a Box packages the key materials required to generate IPC J-STD-001 objective evidence reports for electronics manufacturing reliability validation. Kit includes B-52 Legacy 2 test cards, taped components, a stencil offering from Metal Etch Services, ESD bags and other materials needed to perform surface insulation resistance (SIR) testing preparation. Simplifies the process by shipping all required items in a single kit with return logistics so manufacturers can quickly send completed boards to Magnalytix for third-party testing and validation reports. Platform is designed to accelerate reliability verification, support compliance documentation and streamline testing workflows.

TNC Series NTC thermistors expand Stackpole’s passive component portfolio into temperature sensing applications using thick-film construction for improved mechanical robustness compared with multilayer NTC designs. Thick-film technology reduces susceptibility to cracking and thickness variation across resistance values. Devices are available in 0402, 0603 and 0805 chip sizes with resistance values from 50Ω to 2MΩ and B values from 2410K to 4800K. Components support temperature sensing, monitoring and control applications up to 150°C, offering fast thermal response in compact footprints. Target markets include automotive systems, battery monitoring, and industrial and medical temperature sensing equipment. Pricing varies by size, resistance, B value and tolerance, with volume options available through distribution partners.

630900-1001-801 polyimide adhesive material is designed for high-temperature industrial environments including printed circuit board marking applications exposed to soldering and aggressive cleaning processes. Construction features a 50µm polyimide base film with a 20µm white silk-matt coating optimized for thermal transfer printing of 1D/2D codes, serial numbers and variable data. High-performance acrylate adhesive 801 supports bonding to PCBs, paired with a white standard glassine liner. Material withstands short-term temperatures up to 300°C and resists common soldering cycles and harsh cleaning agents. Available from 200m² with 1,000mm working width; 170mm narrow rolls at 400 running meters offered on request. Additional thicknesses and colors available upon request with immediate supply targeting electronics manufacturing, mechatronics and component marking sectors.

Electrovert EcoWave wave soldering option designed to enhance solder performance, reduce dross formation and extend maintenance intervals in electronics assembly operations. Patented single-wave nozzle integrates DwellFlex 4.0 adjustable contact length and Auto Exit Wing defect-mitigation technologies to improve wave stability and process consistency. Nitrogen-directed wave-forming design minimizes oxidation, with reported dross reductions exceeding 50% and reaching up to 75% in some applications. System maintains solder above liquidus throughout the contact sequence to improve plated-through-hole fill and joint integrity without increasing nitrogen consumption. Design reduces mechanical complexity and dross accumulation, with manufacturers reporting maintenance interval extensions of up to 93%.

Vitronics Soltec ProcessGuard option designed for inline thermal monitoring and analytics within reflow soldering processes. System provides real-time visibility into heating and cooling zone performance to reduce routine profiling and support early defect detection. Compatible with third-party data loggers for baseline profile validation. Integrated directly into machine software with MES connectivity for traceability and smart factory integration. Includes redundant thermocouples in heating and cooling zones, quick-connect thermocouples for maintenance, and embedded ProcessGuard analytics interface. Field-upgradeable for Vitronics Soltec Centurion reflow ovens.

Morita Tech WM7000 Series robotic EMC noise scanners designed for near-field magnetic probe analysis and visualization of electromagnetic noise sources during product development and troubleshooting. Series includes WM7400 for A4-size PCB-level measurement and WM7300 for larger assemblies up to W420×D297×H200mm. Standard frequency range spans 150kHz to 3GHz with optional extension to 8GHz. Systems support minimum scan steps of 0.1mm with positional accuracy of ±0.01mm (X, Y, Z). Laser rangefinder-based scanning enables high-resolution mapping of noise distribution. WM7300 includes patent-pending features and is designed with CISPR22 compatibility considerations. Operates on 100–240V AC power to support lab and manufacturing environments.

550/560 Series ultra-broadband multilayer ceramic capacitors engineered for high-speed optical communication systems operating from 7kHz to 110GHz. Series now includes 15 part numbers with new 0402 capacitance values of 1nF, 10nF, 22nF and 47nF, extending working voltage ratings up to 100V. Capacitance range spans 1–220nF with ±10–100% tolerance and operating temperature from -55°C to +125°C. Devices feature one-piece rugged construction in 01005, 0201 and 0402 case sizes with tin- or gold-plated nickel barrier terminations compatible with reflow soldering. Designed for ultra-low insertion loss, flat frequency response and strong return loss performance in RF, microwave and mmWave applications. Supplied RoHS compliant on tape and reel in quantities from 500 to 20,000.

B43655 and B43656 aluminum electrolytic capacitor series designed for DC link stages in electric vehicle on-board chargers supporting 800V battery architectures and forced cooling operation. B43655 offers 475V and 500V ratings with capacitance from 110µF to 880µF, ripple current up to 3.29A at +105°C, ESR down to 100mΩ and useful life exceeding 3,000hours at +105°C. B43656 rated at 450V supports ripple current up to 4.42A at +105°C for higher-power OBC topologies. Available in snap-in packages from 22mm to 35mm diameter and 25mm to 60mm length, with pressure relief device and select ±0.5mm length tolerance. Qualified to AEC-Q200 Rev.E and RoHS compliant. Integrated into TDK’s AlCap Useful Life Calculation Tool for lifetime estimation.