Inspectis AB has introduced the HD-041, a 360-degree rotating viewer designed to streamline visual inspection processes by eliminating the need for constant Z-axis camera adjustments. Featuring a built-in lens that maintains focus at all tilt angles once the working distance is fixed at 80 mm, the HD-041 enables seamless transitions between oblique and top-view inspection. Its push-pull slide mechanism with spring-loaded ball screws ensures precise positioning, while compatibility with INSPECTIS digital F and U microscopes and ring light mounts enhances system flexibility. The viewer integrates with INSPECTIS Pro Utility and Metrology Software, enabling efficient image capture, measurement, analysis and reporting for a wide range of inspection applications.

Kulicke and Soffa’s ACELON is a high-precision dispensing solution engineered for advanced semiconductor, SMT and automotive manufacturing applications. Built on the company’s machine architecture used in critical high-reliability production environments, ACELON combines enhanced process stability with an expanded working area to accommodate larger substrates and complex assemblies. The system delivers sub-20µm wet accuracy, ensuring precise material placement in applications requiring tight dimensional tolerances. By reducing setup time, improving process consistency and handling complex packaging challenges, ACELON supports next-generation device performance across automotive, computing, industrial, memory and communications sectors.

Yincae's Diamond Underfill UF 158D is engineered to deliver exceptional thermal management in advanced semiconductor applications, achieving 8 W/m·K thermal conductivity through nano-engineered diamond particles. Designed for flip-chip, 2.5D/3D integration and high-density interconnects, UF 158D reduces solder fatigue, mitigates CTE mismatch and enhances long-term device reliability. Its strong adhesion and mechanical robustness make it well-suited for next-generation packaging demands. Available in both dispensable and jettable formulations, UF 158D has passed JEDEC reliability standards.

Metcal PT4-4000 and PT4-8000 Series 4-Zone Circuit Board Preheaters deliver thermal control for advanced electronics manufacturing and rework applications. Using Resistive Radiant Heat Technology, the systems radiate heat from a ceramic plate through a tempered glass surface, eliminating hot spots and ensuring consistent temperature distribution across the board. Each unit features four independently controlled temperature zones to accommodate a wide range of PCB sizes and thermal profiles, with real-time feedback from external thermocouples that continuously monitor and adjust heat output for maximum accuracy.

Advanced temperature control modes and programmable thermal profiles enable repeatable, application-specific performance, while enhanced flexibility makes the preheaters ideal for high-density assemblies, multilayer boards, and thermally demanding components. Designed to support both production and repair workflows, the PT4 Series integrates seamlessly into processes ranging from consumer electronics and data center hardware to aerospace, defense, and medical devices. The series is compatible with Metcal’s premium circuit board holders, which provide stable, adjustable support during heating and rework operations. 

Mectal

https://www.metcal.com/

Master Bond's LED422DC90 is a nanosilica-filled, one-component dual cure adhesive designed for high-speed fixturing and bonding of opaque substrates. The system’s side-bonding capability allows rapid polymerization up to 3–4 mm deep using angled 405 nm LED light, with final curing achieved through a secondary heat process at 90–95°C for 30–45 minutes.  Combines dimensional stability with low thermal expansion (30–40 x 10⁻⁶ in/in/°C), and delivers strong mechanical properties, including tensile strength of 6,000–7,000 psi and lap shear strength of 800–900 psi (aluminum-to-aluminum). The adhesive is optically clear with a refractive index of 1.49, Shore D hardness of 85–90, and elongation of 1–3%. Functions as a reliable electrical insulator with a volume resistivity greater than 10¹⁴ ohm-cm and meets NASA low-outgassing requirements.

Keysight's NA5305A Frequency Extender (up to 170 GHz), NA5307A Frequency Extender (up to 250 GHz), and 85065A Precision Calibration Kit 0.5 mm expands the capabilities of its PNA/PNA-X VNA solutions. Delivers calibrated single-sweep broadband S-parameter measurements from 100 kHz to 250 GHz, enabling faster testing for high-speed interconnects, next-generation semiconductors and sub-THz wireless devices. Designed to reduce design cycles and enhance accuracy, the offering provides up to 105 dB system dynamic range and differential measurement capabilities, while partnerships with FormFactor, MPI, Spinner and Junkosha bring advanced probes, adapters and cables to complement the test ecosystem.

Cybord's fully air-gapped Visual AI platform brings advanced inspection and traceability capabilities on-premises for industries with strict data security requirements such as aerospace, defense and aviation. Integrated with Siemens’ Opcenter Execution Electronics, the platform inspects 100% of components during SMT processes, authenticating parts by lot and origin, enforcing BOM and AVL compliance and detecting tampering or defects. By eliminating reliance on cloud connectivity, the solution ensures data sovereignty while safeguarding against counterfeit or defective components, reducing recalls and strengthening hardware cybersecurity in highly restricted environments.

Shenmao Technology's SMF-WC58 is a halogen-free, water-soluble tacky flux. Engineered for ultra-fine bump pitch flip-chip and BGA/CSP processes. Designed for advanced semiconductor packaging. Delivers wettability on a broad range of pad finishes, including Bare Cu, Cu-OSP, NiAu, ENEPIG and ImSn. Offers a work life of 12 hours or more. After reflow, residues are removed using deionized water. Compatible with printing, transfer and dipping applications.

Data I/O FlashCORE III-M4 universal manual programmer is built on the FlashCORE III programming engine. Has read/write speeds greater than 10MBytes per second (80Mbits/s) for capable devices. Fast downloads over 100 Base-T Ethernet connection. Configurable FPGA for optimized programming now and in future.

Data I/O LumenX-M8 manual programmer supports applications transitioning from eMMC Flash memory to universal flash storage (UFS). Is designed for programming performance during the design/NPI process.

Asscon VP 2200 vapor phase reflow system comes in single- or dual-lane inline configuration and with or without vacuum, for faster reflow processing and greater flexibility. Replaces four previous inline systems with one fully retrofittable solution. While in dual-lane mode, accepts boards from single-lane upstream production and uses a modular shuttle to double throughput. Novel permanent filter system is said to reduce Galden filter change time by 90%. Filters are positioned inside cooling zone without a housing, and the simplified design maintains full effectiveness while halving the number of parts. Enhanced flux management improves operational uptime. Software platform and HMI are intuitive and offer consistent programming across batch and inline systems.

Kyocera AVX's DSCC 25007 Mini BME Stacks is a series of miniature, high-capacitance stacked X7R capacitors designed for military, aerospace and space applications requiring high reliability under extreme operating conditions. Built on proven MIL-PRF-32535 X7R capacitor technology. Delivers combination of compact size, high-CV performance and weight savings. Offers 100% Group A testing and full traceability. Features two horizontally stacked X7R MLCCs in an EIA 2220 package. Features low ESR, low impedance, high current handling and shock and vibration resistance, with lead frame options including J and L styles, paddle or single bar foot configurations, all with tin/lead plating. Rated for -55°C to +125°C, the series supports three voltage ratings (25, 50, and 100V) and nine capacitance values (8.2–47µF).