ITW EAE's Edison II ACT stencil printer is integrated with automated changeover technology that is fast and consistent with reduced operator requirement resulting in error-free changeover, and increased yield and throughput.

Vishay Intertechnology's STH series capacitors are wet tantalum capacitors with hermetic glass-to-metal seals.

ViTrox's V9i ARV XL features a six-axis COBOT design to enable adjustable angle inspections up to 90° and accommodates PCB dimensions of up to 840mm x 620mm

PVA's PathMaster X programming software is designed for its Direct Series Delta line.

Mycronic's MYPro A40 pick-and-place platform increases top placement speeds by 48% while handling a significantly wider range of component types and sizes.

ITW EAE's Electrovert Heavy Duty Conveyor is designed to handle heavier loads of up to 91kg (200lb) while still maintaining the benefits of a single continuous conveyor.

Molex's KickStart is an OCP-compliant connector system that combines low-speed and high-speed signals, as well as power circuits, into a single cable assembly.

Shenmao's PF606-P276 is an ultra-low void no-clean zero-halogen lead-free solder paste.

BTU International Aurora 200N convection reflow oven has closed-loop convection control, and 200" of heat to support faster line speeds up to 25% faster than those supported by Aurora 150N.

Würth Elektronik USB 3.1 Type-C High-Rise SMT Connector is a 24-pin fully-configured horizontal receptacle for SMT assembly.

Solderstar Reflow Shuttle O2 measurement module is a repeatable verification tool that combines O2 ppm, vibration levels in three axes, vacuum, temperature profiles, and conveyor speed on a single platform.

Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications.