Master Bond's LED422DC90 is a nanosilica-filled, one-component dual cure adhesive designed for high-speed fixturing and bonding of opaque substrates. The system’s side-bonding capability allows rapid polymerization up to 3–4 mm deep using angled 405 nm LED light, with final curing achieved through a secondary heat process at 90–95°C for 30–45 minutes.  Combines dimensional stability with low thermal expansion (30–40 x 10⁻⁶ in/in/°C), and delivers strong mechanical properties, including tensile strength of 6,000–7,000 psi and lap shear strength of 800–900 psi (aluminum-to-aluminum). The adhesive is optically clear with a refractive index of 1.49, Shore D hardness of 85–90, and elongation of 1–3%. Functions as a reliable electrical insulator with a volume resistivity greater than 10¹⁴ ohm-cm and meets NASA low-outgassing requirements.

Serviceable from -80°F to +350°F, LED422DC90 bonds effectively to plastics, glass and metals, making it well suited for electronics, optics and aerospace applications. It is available in EFD syringes as well as ½ pint, pint, and quart containers.

Master Bond

https://www.masterbond.com/newsrelease/led422dc90

• Prev
• Next