ITW EAE Vitronics Soltec Centurion reflow oven with CoolClean improves process reliability by removing contaminated gases from the cool zone, reducing flux residue, and extending maintenance intervals.

ITW EAE Electrovert EcoWave wave soldering system integrates two patented technologies to improve hole fill, reduce bridging defects and lower dross production.

Data I/O Corporation expands its Unified Programming Platform Strategy. The Unified Programming Platform supports a transition from design and NPI to automated production. With Data I/O’s refreshed manual programmer product lines, customers can create and validate preprogramming jobs early in the design process, then transfer them directly to an automated PSV programming system for volume manufacturing—all on a single, scalable platform. 

BTU International Aurora 125N convection soldering reflow oven combines flexible zone configurations, precise thermal control, and optimized gas flow for uniform heating for high-mix electronics manufacturing. Enhanced accessibility simplifies maintenance, while optional Aqua Scrub flux management system supports extended uptime and sustainable operation.

Europlacer is set to debut a new software platform at Productronica. The platform is designed to place manufacturers at the center of their production ecosystem, transforming raw factory data into actionable insights that enhance operational agility and uptime. By providing real-time visibility and control over the entire production flow, it supports High-Mix electronics environments where flexibility and efficiency are critical.

Kyzen ANALYST offers manufacturers a process control solution designed to ensure precision and reliability in electronics cleaning applications. Using advanced sonic velocity technology, ANALYST² delivers 0.1% resolution concentration readings in real time, unaffected by variables like conductivity, color or transparency. Provides tight control over cleaning bath chemistry, ensuring stable processes and reducing variability. The system is compatible with more than 60 cleaning chemistries, integrates seamlessly with existing production lines, and helps reduce waste, improve yield and maximize throughput. Ideal for high-reliability sectors such as automotive, aerospace, and medical electronics.

Viscom SE is set to debut vAI ProVision, showcasing a major advancement in AI-driven inspection automation. As part of Viscom’s vAI platform, this new software feature uses artificial intelligence to automate and optimize the creation of 3D AOI and 3D AXI inspection programs, cutting time from hours to minutes. By embedding AI directly into the vVision Software environment, vAI ProVision enables nearly autonomous program generation, delivering deep inspection coverage, exceptional image quality, and consistent results. 

Vishay Intertechnology has introduced the LTA 50, an AEC-Q200 qualified 50 W thick film power resistor in a compact TO-220 package designed for direct mounting on a heatsink. Engineered for exceptional reliability in harsh automotive environments, the LTA 50 withstands temperatures up to +175 °C, high humidity, vibration and electrical stress. With resistance values from 0.010 Ω to 450 kΩ and tolerances down to ± 1 %, the device is ideal for use as a precharge or discharge resistor in on-board chargers, battery management systems and motor controls for EV, HEV and PHEV applications. RoHS-compliant and non-inductive, the LTA 50 features a dielectric strength of 1500 Vrms and limiting element voltage of 500 V.

Shenmao has introduced PF602-P241M-HS, a low-temperature Sn-Bi solder paste engineered for assembling heat sinks and cold plates in AI server cooling systems. Designed to support advanced thermal management architectures, the paste minimizes warpage by soldering below 200 °C and delivers strong mechanical bonding for low-void joints. Its lead-free, halogen-free formulation ensures wetting on copper, aluminum and Ni-plated surfaces. Compatible with stencil printing and dispensing, PF602-P241M-HS enhances cooling efficiency and thermal reliability in both air- and liquid-cooled server designs. 

Telit Cinterion has announced deviceWISE Intelligence Suite, a platform designed to bring AI-powered autonomous control to the factory floor. The suite enables intelligent agents to autonomously observe, analyze and act across every machine, sensor and workflow. Integrating with PLCs, robots, CNCs and enterprise systems, the platform supports use cases including fault detection, workflow guidance, process insights and real-time information retrieval. It also introduces self-mapping factory capabilities, anomaly detection without manual training, and MCP server/client functionality for multi-agent coordination. The suite will be available in January.

Yincae Advanced Materials has launched UF 66L, a next-generation Optical Clear Underfill (OCU) designed for silicon photonics, optoelectronic packaging, image sensors, AR/VR modules and advanced flip-chip assemblies. Engineered to deliver both high transparency and thermal endurance, UF 66L withstands five reflow cycles at 260 °C without cracking, delamination or adhesion loss. It maintains over 95% light transmittance between 400–800 nm, ensuring minimal signal loss in optical pathways, while its non-yellowing stability preserves clarity even after repeated high-temperature exposure. The material offers excellent adhesion to silicon, glass and substrates. Formulated with a controlled modulus that reinforces delicate structures while minimizing stress and warpage, addressing the limitations of conventional epoxy underfills that degrade under thermal cycling. It is optimized for optical interconnect stability, waveguide coupling, photodetectors and other high-density optoelectronic packaging scenarios.

Yamaha Robotics SMT Section has released an upgraded version of YSUP-PG, its program generator designed to accelerate new product introduction (NPI) for surface-mount lines. Features an enhanced user interface and advanced automation that streamlines data conversion from popular EDA formats such as ODB++, enabling faster generation of mounter and inspection programs. Real-time component-placement image updates, clickable task lists and automated workflows. Enables AOI libraries to be created directly from CAD data, allowing mounter and inspection programs to be developed in parallel. Enhanced Gerber image and CAM conversion tools produce accurate simulated board images, with built-in compositing that automatically calculates PCB layer images. By combining Gerber and CAD data, the software digitally determines push-up pin positions.