Stackpole Electronics introduced the HCC series high-current busbar shunts for battery electric and hybrid vehicle current sensing applications. Designed for battery management systems, DC bus measurement and inverter output current monitoring, the series supports current handling above 1400A with resistance values of 100, 50 and 25µOhm. Features all-welded construction for mechanical durability and linear current measurement output across high-current EV subsystems. Available in multiple package sizes and resistance values, the shunts are intended for scalable EV and hybrid power system designs. Stackpole also offers custom sizes, shapes and resistance values through its vertically integrated manufacturing operations.

Henkel expanded its Technomelt portfolio with the PA 6370 low-pressure molding material for electronic assemblies requiring fine-gap filling and environmental protection. Polyamide-based hot melt formulation supports gap penetration down to 0.5mm with ultra-low melt viscosity from 2700–3000mPa·s at 210°C and 1065–1180mPa·s at 240°C. Material provides adhesion stability across multiple substrates and passed lap shear testing after 1,200hr exposure to 85°C/85% RH conditions. Technomelt PA 6370 meets UL 94 V-0 flame retardancy requirements and offers electrical insulation properties with a coefficient of thermal expansion of 175ppm. Operating temperature range spans -20°C to 140°C. Henkel said the material supports low-pressure molding processes with cycle times as low as 30 sec., targeting faster encapsulation compared to conventional potting approaches.

RVCU series high-voltage chip resistors support voltage divider, sensing and measurement circuits requiring stable high-voltage performance. Features voltage coefficient of resistance values from 25ppm–50ppm, lower than conventional high-voltage chip resistors, for improved precision in voltage divider applications. Available in 1206, 2010 and 2512 package sizes with working voltages from 800V–3000V, tolerances to 0.5% and 100ppm TCR. Includes anti-sulfur construction per ASTM-B-905-5 and IEC-62368 compliance for values from 75kΩ–27MΩ. Intended for LED lighting, medical equipment, communications systems, test and measurement instruments and high-voltage control applications.

Hirose launched the IT18 Series COM-HPC compatible BGA mezzanine connector supporting PCIe Gen5 (32GT/s), PCIe Gen6 (64GT/s PAM4) and 100Gb Ethernet (4×25Gb) transmission for high-density embedded and industrial applications. Connector features 400 positions on a 0.635mm pitch in a low-profile design with 5mm and 10mm stacking heights. Open pin field grid array design enables flexible routing of signals, grounds, and power for signal integrity optimization and varying layout requirements. Connector incorporates crosstalk suppression technology, including far-end crosstalk cancellation and utilizes a metal cap structure to reduce warpage and protect contacts during reflow. Additional features include retention tabs to reduce solder ball cracking risk, pin-in-ball soldering structure, and alignment guides for mating reliability. Designed for industrial automation, medical imaging, and test and measurement equipment applications.

Magnalytix introduced its MGX Mixed Technology SIR Test Board, designed for SIR testing and electronics reliability characterization across mixed-component assemblies. The double-sided board features four channels per side and combines fine-pitch, bottom-terminated, through-hole, and passive components into a single standardized platform. Supports cleanliness testing and reliability characterization aligned with J-STD-001 Section 8 requirements. Intended to evaluate flux behavior, assess cleaning effectiveness and measure process robustness across a range of component geometries and electrochemical risk conditions.

Göpel electronic expanded its Multibus Controller 6281 platform with support for up to eight independent 10BASE-T1S automotive ethernet interfaces for parallel ECU communication testing. Adds 10BASE-T1S capability alongside existing support for 100BASE-T1 and 1000BASE-T1, enabling the 62 Series to support multiple automotive communication technologies within a single hardware platform. The system is designed for ECU testing, communication analysis and rest bus simulation applications across automotive electronics environments. Allows simultaneous parallel testing of up to eight devices under test (DUTs), The Multibus Controller 6281 also includes eight digital I/O interfaces consisting of four digital inputs and four digital outputs.

KashTech TrackMate manufacturing software platform, designed for SMT electronics manufacturing environments, provides real-time production visibility, traceability, and analytics across production lines, machines, and operators. Features end-to-end SMT line tracking, KPI dashboards for yield, downtime, and throughput monitoring, and configurable alerts for identifying production bottlenecks. Supports integration with ERP platforms including Odoo and is designed to improve equipment utilization, reduce downtime, and increase manufacturing efficiency through real-time analytics and automation.

Samtec mPOWER ultra micro connector system, now available with through-hole PCB termination options, is designed for enhanced mechanical strength and reliability in industrial, military, and aerospace applications. Available for UMPS and UMPT vertical board connectors and UMPT-RA right-angle board connectors. Supports up to 18A per power blade while reducing board space requirements by 40% compared with conventional power connectors. Supports board-to-board, wire-to-board, and wire-to-wire applications with vertical and right-angle configurations, stack heights from 5mm to 20mm, rugged latching features, and 2 to 10 power positions. PVC and Teflon fluoropolymer cable assembly options available in multiple wire gauges.

Tagarno relaunched its Full HD digital microscope line with updated configurations, revised model structure and a new camera system for inspection applications. Now centers on the ZIP+, ZAP+, and TREND+ models, with MOVE and FRONT integrated as configurations within the ZAP+ platform and the Prestige model discontinued. The microscopes incorporate a Sony FCB-EV9520L camera, providing improved dynamic range, reduced image noise,and updated color reproduction for inspection of reflective and fine-detail surfaces such as solder joints. Supports simultaneous zoom and focus adjustments, along with faster image processing for navigation and inspection tasks.

Low-silver wire solder series supports manual and automated soldering applications with reduced silver dependency. The system features 0.1–0.3% Ag content and anti-iron tip erosion properties to extend soldering tip life. Designed to support improved wettability and solder flow, with reduced bridging under challenging conditions. Flux system enables consistent coverage with residues designed for simplified cleaning. Suitable for robotic soldering applications and integration into automated assembly processes. Intended for electronics manufacturing environments seeking cost control while maintaining process stability.

Low-silver solder paste series supports SMT assembly with reduced material cost exposure while maintaining process compatibility. The system features ~0.1–1.1% Ag content compared to ~3.0% in SAC305, enabling lower silver usage. Designed for compatibility with standard SAC305 reflow profiles, minimizing requalification requirements in existing processes. Supports stable wetting performance and controlled voiding behavior, with reliability validated through thermal cycling and mechanical testing. Intended for cost-sensitive SMT applications requiring consistent process performance and long-term reliability.

Wafer inspection and metrology platform supports advanced packaging and back-end semiconductor processes. The system accommodates 6" to 12" wafers and integrates automated visual inspection for detection of particles, scratches, chipping, contamination and foreign materials. Granite-based structure supports system stability, with optional short-wave infrared module enabling detection of subsurface defects within silicon. 3D depth-from-focus module offers imaging at 0.5µm or 1µm resolution for detailed surface analysis. Platform performs metrology for wafer thickness, top-side warpage and surface topography, along with measurement of through-silicon via depth, trench dimensions, thin films and chiplet features. Designed for inspection and measurement applications across advanced packaging workflows.