Supply chain management software that monitors product change notifications (PCNs) throughout the sourcing lifecycle, automatically identifying end-of-life notices, obsolescence alerts, supplier changes and compliance updates from BOM import through procurement. Provides continuous BOM monitoring, component-level risk alerts, lifecycle data, last-time-buy and last-time-ship information, and links to original documentation to help EMS companies identify supply chain risks before quoting, purchasing and production.

Desktop ECU test platform for automotive control unit development and validation featuring an integrated programmable power supply, switchable terminal signals, current measurement, residual bus simulation with diagnostics and SecureOnboardCommunication (SecOC), support for CAN-FD, LIN, FlexRay and Automotive Ethernet, expandable fault modules, onboard SSD-based communication logging, and integration with external test instruments for functional, network, infotainment, quality and endurance testing.

Digital torque wrench for assembly applications with torque ranges from 10Nm to 650Nm. Features IP54 protection, 2.3m drop resistance, point-of-load insensitive torque measurement, OLED display, 360° status light ring, vibration and audible feedback, interchangeable Auto-ID wrench heads with automatic length compensation, and storage for up to 200 readings. Supports RF, Bluetooth or Wi-Fi connectivity for integration with TorqueStar Pro, IQVu, TCI-2, MES platforms and third-party software. Includes rechargeable quick-change battery system with charging cradle or optional USB-C charging and is available in FOD-compliant versions.

Candeo is a post-CMP cleaning chemistry designed to remove residual particles and ionic contamination, reducing defectivity and increasing usable wafer area for silicon, silicon carbide and advanced packaging applications. Compatible with Entrepix DSS-200 cleaning platforms without hardware modifications, the formulation provides a wider process window, supports stable, repeatable cleaning performance, and is free of the strong odors associated with conventional ammonium hydroxide-based chemistries. The chemistry is available for process evaluation through Intersurface Dynamics and Entrepix.

The EPC91132 is a compact three-phase brushless DC motor drive reference design built around the EPC33110 monolithic GaN power module for humanoid robotics and drone applications. Supports 10 to 60 V input, delivers up to 11 Arms continuous output current (15 Arms pulsed), and operates at switching frequencies above 100 kHz. Integrates a microcontroller, voltage and current sensing, overcurrent protection, magnetic encoder and RS-485 interface. Complete design resources, including schematics, BOM and Gerber files, are available to accelerate motor drive development.

The AG16xFNxx Series power MOSFETs are designed for automotive 48V power supply systems, offering an 80V rating for applications including inverter control circuits, electric motors and electric water pumps. Available in compact HPLF5060 and DFN3333 packages, the devices are engineered to reduce board space requirements compared with conventional automotive MOSFET packages. The MOSFETs incorporate Copper Clip Junction Technology to improve heat dissipation and support high-current operation. The HPLF5060 package features Gull-Wing leads, while the DFN3333 package incorporates Wettable Flank Technology to enhance PCB solder joint inspection and reliability. All devices are AEC-Q101 qualified for automotive applications.

The IHDV Series power inductors are designed for automotive, energy and industrial applications requiring isolation voltages up to 1.5kV. Available in automotive-qualified and commercial versions, the devices feature powdered iron alloy cores for soft saturation characteristics and support continuous operation at temperatures up to 180°C. Offered in 0808 and 1008 case sizes, the inductors are engineered for onboard chargers, battery charging circuits, power factor correction and high-voltage DC battery filtering. The automotive versions are AEC-Q200 qualified, while all models are RoHS-compliant, halogen-free and include support pins for enhanced shock and vibration resistance.

The TruView Prime SDX combines 2D X-ray, 2.5D imaging and SDX Planar CT capabilities in a benchtop platform designed for electronics manufacturing inspection. Features a fully viewable 20" × 20" inspection area and is engineered to inspect large BGAs, stacked packages, bottom-terminated components and other complex assemblies. AI-powered analysis tools automatically measure solder quality metrics, including BGA and pad voiding, helping improve inspection consistency and reduce operator variability. Designed for quality control, process development and failure analysis, the platform enables users to perform planar CT scans in three steps and save inspection parameters for repeatable workflows.

The Vision AI Label Reader automates label inspection, identification and data capture for goods-in and logistics operations. Designed to process a wide variety of label formats, languages and code types, the system uses AI-based image analysis to extract and interpret printed text, 1D and 2D codes, and handwritten information without requiring predefined label templates. Powered by an IDS uEye CP industrial camera, the solution is engineered to handle reflective packaging, damaged codes and varying lighting conditions while providing structured data output for ERP integration. Supports automated validation, traceability and inventory management workflows, helping manufacturers improve data quality and accelerate receiving operations.

The Decode API provides automated analysis of PCB design and manufacturing data for integration into quoting, ERP and customer-facing workflows. Processes design packages to extract fabrication information, including stackups, board dimensions, drill data and DFM results from Gerber and ODB++ files, while also supporting BOM analysis, component sourcing, assembly planning and pricing. The API returns structured data covering PCB fabrication, assembly requirements and turnkey manufacturing estimates. Additional capabilities include integrated SpeedDFM analysis, version-controlled JSON schema support, BOM sourcing automation and assembly planning tools designed to streamline quoting and manufacturing workflows.

The RNCQ Series thin film chip resistor is designed for RF and microwave circuits operating at frequencies up to 50GHz. Built on a high-purity substrate using advanced thin film technology, the resistor is engineered to provide stable electrical performance in high-frequency applications. Provides impedance-versus-frequency curves for common package sizes and resistance values, as well as S-parameter data for insertion loss and reflection loss. The RNCQ Series is suited for RF and microwave communications, 5G infrastructure, satellite communications and precision test equipment.

The Multi Line Assist 11XX Series combines assembly guidance and automated optical inspection for THT production environments. The system projects assembly instructions directly into the operator's field of view and verifies component placement through integrated AOI inspection, detecting polarity errors, missing components and marking deviations during or after assembly. Features MagicLight technology, which combines top and side lighting with coded illumination to improve visibility of difficult-to-inspect features such as polarity markings and embossed text while reducing reflections and sensitivity to ambient light. Available as a complete workstation, tabletop retrofit system or integration module, the platform is designed to support manual assembly stations and automated production lines. Test results can be documented, analyzed and transferred to MES systems.