Featuring a fully shielded structure, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing EMI. The 0.35mm-pitch connector combines power and signal contacts in a compact 0.6mm stacking-height design, providing four 2.5A power contacts and a fully armored housing for high-reliability, space-constrained applications such as smartphones, tablets, wearables and notebook PCs.

Available with new high-power (-HP) and ultra-high-power (-UP) options, the RMCA Series automotive grade thick-film chip resistors provide greater power density without increasing component footprint. Designed for automotive, industrial, transportation and power management applications, the AEC-qualified resistors deliver stable performance, long service life and improved thermal capability for current sensing, voltage division, biasing and circuit protection in space-constrained designs.

Combining 90W laser power with LPKF's Tensor Technology, the CuttingMaster 3290 laser depaneling system processes FR-4 substrates 2.4 mm thick and greater, along with ceramic, flex and rigid-flex materials, while delivering more than twice the throughput of conventional laser depaneling systems. The system provides clean cuts without carbonization or heat-affected zones, accommodates components up to 40 mm tall on both sides of the board, and features an extended laser service life to reduce maintenance and operating costs.

Designed for placement of the Hirose DF40C-80DP-0.4V female socket, the Custom Universal IL7 Nozzle (Part No. 2026-5682) features a 0.70 x 4.0 mm blade for secure handling during pick-and-place operations. Manufactured to customer specifications, the nozzle supports precise placement of fine-pitch components in high-density SMT assemblies and is compatible with Universal pick-and-place systems.

Surface mount assembly and inspection platform enhancements that add AI-assisted programming, defect classification and inspection capabilities to the YRi-V AOI system, along with automatic nozzle testing and pre-placement component verification for YRM mounters. Includes updates to YSUP software for automated printer setup, line programming, production monitoring, troubleshooting and traceability to improve SMT productivity and accelerate new product introduction.

One-part, epoxy-based UV-curable adhesive with an integrated fluorescent dye for visual inspection of bond lines, overflow and voids in medical device assemblies. Meets ISO 10993-5 requirements for non-cytotoxicity and offers optical clarity, low viscosity, resistance to chemicals and sterilization processes, and compatibility with plastics, glass, ceramics and metals for bonding, sealing, coating and spin-coating applications.

Digital microscope firmware update that adds QR-based preset sharing, Spot Focus and expanded preset management to improve inspection consistency and setup efficiency. Supports export and import of up to 50 presets, QR code-based configuration loading, Z-axis position storage, shortcut key assignments, image flip controls, ring light glare reduction, and DXF Overlay and PNG Reference applications for PCB inspection, component identification and work instruction display.

High-power metal alloy current sense resistors with new 0.5mΩ and 20mΩ resistance options while maintaining a 5 W rating in a 2512 package. Features low resistance, low TCR, long-term stability and AEC-Q200 qualification for battery management systems, automotive electronics, motor drives, industrial power supplies, DC-DC converters, renewable energy equipment and other high-current power control applications.

Supply chain management software that monitors product change notifications (PCNs) throughout the sourcing lifecycle, automatically identifying end-of-life notices, obsolescence alerts, supplier changes and compliance updates from BOM import through procurement. Provides continuous BOM monitoring, component-level risk alerts, lifecycle data, last-time-buy and last-time-ship information, and links to original documentation to help EMS companies identify supply chain risks before quoting, purchasing and production.

Desktop ECU test platform for automotive control unit development and validation featuring an integrated programmable power supply, switchable terminal signals, current measurement, residual bus simulation with diagnostics and SecureOnboardCommunication (SecOC), support for CAN-FD, LIN, FlexRay and Automotive Ethernet, expandable fault modules, onboard SSD-based communication logging, and integration with external test instruments for functional, network, infotainment, quality and endurance testing.

Digital torque wrench for assembly applications with torque ranges from 10Nm to 650Nm. Features IP54 protection, 2.3m drop resistance, point-of-load insensitive torque measurement, OLED display, 360° status light ring, vibration and audible feedback, interchangeable Auto-ID wrench heads with automatic length compensation, and storage for up to 200 readings. Supports RF, Bluetooth or Wi-Fi connectivity for integration with TorqueStar Pro, IQVu, TCI-2, MES platforms and third-party software. Includes rechargeable quick-change battery system with charging cradle or optional USB-C charging and is available in FOD-compliant versions.

Candeo is a post-CMP cleaning chemistry designed to remove residual particles and ionic contamination, reducing defectivity and increasing usable wafer area for silicon, silicon carbide and advanced packaging applications. Compatible with Entrepix DSS-200 cleaning platforms without hardware modifications, the formulation provides a wider process window, supports stable, repeatable cleaning performance, and is free of the strong odors associated with conventional ammonium hydroxide-based chemistries. The chemistry is available for process evaluation through Intersurface Dynamics and Entrepix.