Custom extra-large format BGA packages support high I/O-count applications requiring expanded footprints up to 100mm×100mm. The devices provide increased ball-grid density and accommodate designs where standard off-the-shelf BGA formats are insufficient. The packages are intended for applications that require larger interconnect areas and higher signal counts, supporting design flexibility for complex electronics systems. Expanded footprints allow engineers to integrate additional I/O while maintaining compatibility with ball grid array interconnect structures commonly used in advanced electronic assemblies. The custom BGA formats are available through TopLine for specialized applications requiring nonstandard package dimensions and high-density interconnect capability.

Print Param Decision Assist software tool evaluates PCB data to generate printing parameters for Yamaha surface-mount printers during new product introduction (NPI). The tool analyzes board dimensions, component types, solder-paste type, stencil thickness and aperture geometry to calculate settings including system pressure, printing speed, squeegee angle and stencil cleaning frequency. Integrated into the latest release of YSUP-PG, the programming environment within Yamaha’s YSUP intelligent factory software suite. A graphical interface allows operators to review recommended parameters and adjust settings before production. Intended to support faster NPI setup and parameter verification during stencil printing processes. 

Rigol DNA5000 and DNA6000 Series vector network analyzers support RF and microwave analysis across a frequency range from 5kHz to 26.5GHz. Available in 2-port and 4-port configurations, the instruments support testing of passive components including filters, antennas, cables, dielectric materials, and high-speed interconnects. The analyzers offer dynamic range up to 127dB and low trace noise to support characterization of high-rejection devices and stable measurement performance. Fixture removal and de-embedding functions allow measurement correction for test fixtures, adapters, and cables, enabling direct S-parameter analysis of the device under test. Built-in analysis tools include limit testing, standing wave ratio (SWR) measurement, Smith chart display, and time domain reflectometry (TDR). An integrated calibration wizard guides setup procedures to support measurement repeatability across laboratory and production environments. The instruments feature a touchscreen interface and support HDMI, LAN, USB, and GPIB connectivity for integration with automated test systems. The compact DNA5000 Series targets bench-space-constrained environments, while the benchtop DNA6000 Series supports long-duration testing and automated production test configurations.

Summit LT150 rework system supports rework of components up to 150mm on large, high-density electronics assemblies. Platform includes a 150×150mm vision area that allows full-component viewing while enabling corner-level alignment during placement. System accommodates board sizes up to 24×36in, with optional configuration for larger formats. Rework platform provides up to 100mm top- and bottom-side clearance to allow access around tall connectors, heat sinks, and power modules commonly used in high-power assemblies. Thermal system combines a 4.4kW top heater with up to 11.2kW of bottom-side heating to support temperature uniformity across large component footprints. Dual PID control, programmable airflow, and a 1.5kW spot heater support thermal profile adjustment during rework operations. System developed for electronics manufacturing environments addressing large components used in AI and power electronics assemblies.

Custom Samsung nozzle (Part #2026-5654) supports placement of LiteOn TLMH4TGVADA LEDs on Samsung CP45 and SM10–SM421 pick-and-place platforms. Design incorporates a Samsung-style nozzle base with a standard reflector size for machine recognition and a precision plastic tip measuring 4.50mm × 4.50mm to match the LED package geometry. Tip construction is intended to maintain stable vacuum pickup while protecting sensitive LED surfaces during high-speed SMT placement. Component is designed for application-specific SMT assembly where nonstandard component shapes require specialized nozzle tooling.

MCJ Series surface-mount jumper chip resistors use a solid metal element construction to provide low resistance and higher current capacity in standard chip sizes. Supports current ratings from 8A in 0201 packages to 122A in 2512 sizes, with overload capability up to 244A. Designed for applications where conventional thick-film jumpers are limited to lower current levels. Available in chip sizes 0201, 0402, 0805, 1206 and 2512. Sizes 0402, 0603 and 0805 are AEC compliant for automotive applications.

SolderKing released SAC0307, a low-silver alloy option within its SK P2-5 solder paste family designed to support flexible alloy selection while maintaining the same established flux chemistry and process settings. The paste enables manufacturers to evaluate alternative alloy compositions without modifying existing production parameters. Designed for surface-mount assembly applications requiring reliable stencil printing and consistent wetting across common PCB finishes including OSP, ENIG, immersion silver, tin and HASL. The flux formulation is designed to reduce voiding and head-in-pillow defects while leaving minimal residue after reflow. The material complies with J-STD-004B and Bellcore ECM requirements. Available in Type 4 (20–38µm) and Type 5 (15–25µm) powder grades to support fine-pitch and high-density assemblies. Extended tack and open times exceeding three days provide flexibility for longer production runs or staged builds, while a 12-month refrigerated shelf life supports material inventory management.

SolderKing Assembly Materials

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OE in a Box packages the key materials required to generate IPC J-STD-001 objective evidence reports for electronics manufacturing reliability validation. Kit includes B-52 Legacy 2 test cards, taped components, a stencil offering from Metal Etch Services, ESD bags and other materials needed to perform surface insulation resistance (SIR) testing preparation. Simplifies the process by shipping all required items in a single kit with return logistics so manufacturers can quickly send completed boards to Magnalytix for third-party testing and validation reports. Platform is designed to accelerate reliability verification, support compliance documentation and streamline testing workflows.

TNC Series NTC thermistors expand Stackpole’s passive component portfolio into temperature sensing applications using thick-film construction for improved mechanical robustness compared with multilayer NTC designs. Thick-film technology reduces susceptibility to cracking and thickness variation across resistance values. Devices are available in 0402, 0603 and 0805 chip sizes with resistance values from 50Ω to 2MΩ and B values from 2410K to 4800K. Components support temperature sensing, monitoring and control applications up to 150°C, offering fast thermal response in compact footprints. Target markets include automotive systems, battery monitoring, and industrial and medical temperature sensing equipment. Pricing varies by size, resistance, B value and tolerance, with volume options available through distribution partners.

630900-1001-801 polyimide adhesive material is designed for high-temperature industrial environments including printed circuit board marking applications exposed to soldering and aggressive cleaning processes. Construction features a 50µm polyimide base film with a 20µm white silk-matt coating optimized for thermal transfer printing of 1D/2D codes, serial numbers and variable data. High-performance acrylate adhesive 801 supports bonding to PCBs, paired with a white standard glassine liner. Material withstands short-term temperatures up to 300°C and resists common soldering cycles and harsh cleaning agents. Available from 200m² with 1,000mm working width; 170mm narrow rolls at 400 running meters offered on request. Additional thicknesses and colors available upon request with immediate supply targeting electronics manufacturing, mechatronics and component marking sectors.

Electrovert EcoWave wave soldering option designed to enhance solder performance, reduce dross formation and extend maintenance intervals in electronics assembly operations. Patented single-wave nozzle integrates DwellFlex 4.0 adjustable contact length and Auto Exit Wing defect-mitigation technologies to improve wave stability and process consistency. Nitrogen-directed wave-forming design minimizes oxidation, with reported dross reductions exceeding 50% and reaching up to 75% in some applications. System maintains solder above liquidus throughout the contact sequence to improve plated-through-hole fill and joint integrity without increasing nitrogen consumption. Design reduces mechanical complexity and dross accumulation, with manufacturers reporting maintenance interval extensions of up to 93%.

Vitronics Soltec ProcessGuard option designed for inline thermal monitoring and analytics within reflow soldering processes. System provides real-time visibility into heating and cooling zone performance to reduce routine profiling and support early defect detection. Compatible with third-party data loggers for baseline profile validation. Integrated directly into machine software with MES connectivity for traceability and smart factory integration. Includes redundant thermocouples in heating and cooling zones, quick-connect thermocouples for maintenance, and embedded ProcessGuard analytics interface. Field-upgradeable for Vitronics Soltec Centurion reflow ovens.