Workbench configurator platform supports design and visualization of modular workstation environments using Treston and IAC solutions. Enables users to configure workbenches, storage systems and accessories through an interactive interface with real-time layout adjustments. Supports selection of standard and custom configurations to align with production requirements and facility constraints. Provides visualization tools to compare layouts and assess integration into existing manufacturing lines. Designed to streamline workstation planning, reduce design time and support coordination across engineering, production and procurement teams.

Cumberland Electronics Strategic Supply Solutions

ce3s.com

Omnyx PCBA test platform supports detection of structural, parametric, high-speed interconnect and functional defects in printed circuit board assemblies used in AI servers and data center systems. Combines synchronized analog and digital subsystems with mission-mode and software-directed testing to identify at-speed and operational defects earlier in the manufacturing process. Supports single-site, multi-site and large-format test architectures with pin capacity from 2,560 to more than 10,000 pins. Accommodates PCB sizes up to 900×750mm and weights up to 15kg. Includes no-touch high-speed conveyance with SMEMA compatibility and supports automated or manual fixture configurations. Designed to improve yield, product quality and test coverage in high-performance computing hardware production.

EHS-222M-L highly accelerated stress test chamber supports reliability testing of large multilayer PCBs and high-density electronic assemblies. Accommodates board sizes up to 290×460mm with increased internal depth and expanded fixture capacity for high specimen volumes. Provides up to 120 bias terminals at up to 1,000V to support complex testing configurations. Operates across temperature range of +105.0°C to +142.9°C, humidity range of 75%–100%RH and pressure range of 0.019–0.193MPa. Supports accelerated reliability testing for AI hardware, automotive electronics and data center systems requiring high-temperature, high-humidity and pressure conditions.

The Mydata Midas tool 2026-5652 supports placement of the N61381US component in SMT assembly processes. The tool features a 0.125" outside diameter and 0.047" inside diameter with a 90° V-cut profile designed to align and seat components during placement. It is pinned to D121 to maintain alignment and positioning consistency during pick-and-place operations. The geometry supports stable handling of specialized components and consistent vacuum performance for automated assembly environments. The tool is designed for use on MYDATA systems and supports applications requiring precise component placement and handling of non-standard geometries.

Boardera API PCB project analyzer automates fabrication analysis, BOM processing, assembly planning and project pricing for electronics manufacturing workflows. The system extracts fabrication requirements including layer stackup, board dimensions, copper area, drill data and pad features from design files. BOM tools map component data, generate procurement links, assess availability and end-of-life risk and flag compliance with RoHS and REACH. Assembly planning functions calculate part counts, placement volumes, and package classifications to support process planning. Pricing modules support PCB-only, assembly-only, and turnkey configurations with models aligned to fabrication and EMS operations. The API integrates into manufacturer systems to support design analysis, quoting and production planning across PCB fabricators, assemblers and OEMs.

Custom extra-large format BGA packages support high I/O-count applications requiring expanded footprints up to 100mm×100mm. The devices provide increased ball-grid density and accommodate designs where standard off-the-shelf BGA formats are insufficient. The packages are intended for applications that require larger interconnect areas and higher signal counts, supporting design flexibility for complex electronics systems. Expanded footprints allow engineers to integrate additional I/O while maintaining compatibility with ball grid array interconnect structures commonly used in advanced electronic assemblies. The custom BGA formats are available through TopLine for specialized applications requiring nonstandard package dimensions and high-density interconnect capability.

Print Param Decision Assist software tool evaluates PCB data to generate printing parameters for Yamaha surface-mount printers during new product introduction (NPI). The tool analyzes board dimensions, component types, solder-paste type, stencil thickness and aperture geometry to calculate settings including system pressure, printing speed, squeegee angle and stencil cleaning frequency. Integrated into the latest release of YSUP-PG, the programming environment within Yamaha’s YSUP intelligent factory software suite. A graphical interface allows operators to review recommended parameters and adjust settings before production. Intended to support faster NPI setup and parameter verification during stencil printing processes. 

Rigol DNA5000 and DNA6000 Series vector network analyzers support RF and microwave analysis across a frequency range from 5kHz to 26.5GHz. Available in 2-port and 4-port configurations, the instruments support testing of passive components including filters, antennas, cables, dielectric materials, and high-speed interconnects. The analyzers offer dynamic range up to 127dB and low trace noise to support characterization of high-rejection devices and stable measurement performance. Fixture removal and de-embedding functions allow measurement correction for test fixtures, adapters, and cables, enabling direct S-parameter analysis of the device under test. Built-in analysis tools include limit testing, standing wave ratio (SWR) measurement, Smith chart display, and time domain reflectometry (TDR). An integrated calibration wizard guides setup procedures to support measurement repeatability across laboratory and production environments. The instruments feature a touchscreen interface and support HDMI, LAN, USB, and GPIB connectivity for integration with automated test systems. The compact DNA5000 Series targets bench-space-constrained environments, while the benchtop DNA6000 Series supports long-duration testing and automated production test configurations.

Summit LT150 rework system supports rework of components up to 150mm on large, high-density electronics assemblies. Platform includes a 150×150mm vision area that allows full-component viewing while enabling corner-level alignment during placement. System accommodates board sizes up to 24×36in, with optional configuration for larger formats. Rework platform provides up to 100mm top- and bottom-side clearance to allow access around tall connectors, heat sinks, and power modules commonly used in high-power assemblies. Thermal system combines a 4.4kW top heater with up to 11.2kW of bottom-side heating to support temperature uniformity across large component footprints. Dual PID control, programmable airflow, and a 1.5kW spot heater support thermal profile adjustment during rework operations. System developed for electronics manufacturing environments addressing large components used in AI and power electronics assemblies.

Custom Samsung nozzle (Part #2026-5654) supports placement of LiteOn TLMH4TGVADA LEDs on Samsung CP45 and SM10–SM421 pick-and-place platforms. Design incorporates a Samsung-style nozzle base with a standard reflector size for machine recognition and a precision plastic tip measuring 4.50mm × 4.50mm to match the LED package geometry. Tip construction is intended to maintain stable vacuum pickup while protecting sensitive LED surfaces during high-speed SMT placement. Component is designed for application-specific SMT assembly where nonstandard component shapes require specialized nozzle tooling.

MCJ Series surface-mount jumper chip resistors use a solid metal element construction to provide low resistance and higher current capacity in standard chip sizes. Supports current ratings from 8A in 0201 packages to 122A in 2512 sizes, with overload capability up to 244A. Designed for applications where conventional thick-film jumpers are limited to lower current levels. Available in chip sizes 0201, 0402, 0805, 1206 and 2512. Sizes 0402, 0603 and 0805 are AEC compliant for automotive applications.

SolderKing released SAC0307, a low-silver alloy option within its SK P2-5 solder paste family designed to support flexible alloy selection while maintaining the same established flux chemistry and process settings. The paste enables manufacturers to evaluate alternative alloy compositions without modifying existing production parameters. Designed for surface-mount assembly applications requiring reliable stencil printing and consistent wetting across common PCB finishes including OSP, ENIG, immersion silver, tin and HASL. The flux formulation is designed to reduce voiding and head-in-pillow defects while leaving minimal residue after reflow. The material complies with J-STD-004B and Bellcore ECM requirements. Available in Type 4 (20–38µm) and Type 5 (15–25µm) powder grades to support fine-pitch and high-density assemblies. Extended tack and open times exceeding three days provide flexibility for longer production runs or staged builds, while a 12-month refrigerated shelf life supports material inventory management.

SolderKing Assembly Materials

solderking.com