Designed for specialized Fuji pick-and-place applications, the 2026-5679 custom DX S1 base features a spring-loaded nozzle shaft, 8mm bellow suction cup, 16.05mm center spacing and ID dome clearance. Manufactured to customer specifications, the precision-machined component is designed to address specialized component handling and placement requirements not served by standard tooling.

Adding optional camera and monitor configurations to improve visibility during SMT and BGA rework, the TRIDENT benchtop rework station can be equipped with a top-mounted monitor and freestanding camera, while the INTRUDER hot-air BGA rework station adds a monitor capable of switching between split-vision and side-angle camera views. The INTRUDER also features a repositioned top-mounted computer monitor, while both systems are designed for component removal and replacement in precision rework applications.

Supporting large, heavy components for AI server and data center equipment, the NXTR and AIMEXR pick-and-place machines can handle components measuring up to 200 x 200mm and weighing 2.0kg in their standard configurations. The capability targets growing placement requirements for larger GPU, ASIC and HBM packages and co-packaged optics applications.

Designed for advanced electronics and AI hardware, the Dymax 9310 adhesive cures in seconds with light, delivering a streamlined alternative to traditional underfill. A secondary heat cure ensures full polymerization in shadowed areas, supporting consistent performance across complex assemblies.

It is formulated to flex under strain, helping absorb movement caused by thermal expansion and reducing stress on solder joints and components. Its combination of high elongation (145%) and controlled modulus allows the material to accommodate thermal and mechanical strain, helping maintain bond integrity over time in demanding environments.

Featuring a fully shielded design, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing electromagnetic interference in compact electronic systems. The 0.35mm-pitch connector combines power and signal contacts in a 0.6mm stacking-height design, providing four 2.5A power contacts and a fully armored housing for high-frequency, space-constrained applications.

Featuring a fully shielded structure, the BK35 hybrid FPC-to-board connector supports data transmission up to 40Gbps and RF signal transmission up to 40GHz while minimizing EMI. The 0.35mm-pitch connector combines power and signal contacts in a compact 0.6mm stacking-height design, providing four 2.5A power contacts and a fully armored housing for high-reliability, space-constrained applications such as smartphones, tablets, wearables and notebook PCs.

Available with new high-power (-HP) and ultra-high-power (-UP) options, the RMCA Series automotive grade thick-film chip resistors provide greater power density without increasing component footprint. Designed for automotive, industrial, transportation and power management applications, the AEC-qualified resistors deliver stable performance, long service life and improved thermal capability for current sensing, voltage division, biasing and circuit protection in space-constrained designs.

CuttingMaster 3290 laser depaneling system processes FR-4 substrates 2.4mm thick and greater, along with ceramic, flex and rigid-flex materials, while delivering more than twice the throughput of conventional laser depaneling systems.

Designed for placement of the Hirose DF40C-80DP-0.4V female socket, the Custom Universal IL7 Nozzle (Part No. 2026-5682) features a 0.70 x 4.0 mm blade for secure handling during pick-and-place operations. Manufactured to customer specifications, the nozzle supports precise placement of fine-pitch components in high-density SMT assemblies and is compatible with Universal pick-and-place systems.

Surface mount assembly and inspection platform enhancements that add AI-assisted programming, defect classification and inspection capabilities to the YRi-V AOI system, along with automatic nozzle testing and pre-placement component verification for YRM mounters. Includes updates to YSUP software for automated printer setup, line programming, production monitoring, troubleshooting and traceability to improve SMT productivity and accelerate new product introduction.

One-part, epoxy-based UV-curable adhesive with an integrated fluorescent dye for visual inspection of bond lines, overflow and voids in medical device assemblies. Meets ISO 10993-5 requirements for non-cytotoxicity and offers optical clarity, low viscosity, resistance to chemicals and sterilization processes, and compatibility with plastics, glass, ceramics and metals for bonding, sealing, coating and spin-coating applications.

Digital microscope firmware update that adds QR-based preset sharing, Spot Focus and expanded preset management to improve inspection consistency and setup efficiency. Supports export and import of up to 50 presets, QR code-based configuration loading, Z-axis position storage, shortcut key assignments, image flip controls, ring light glare reduction, and DXF Overlay and PNG Reference applications for PCB inspection, component identification and work instruction display.