The SQ5000Pro combines AOI, SPI and CMM-grade metrology in a single in-line system designed for advanced electronics production. The platform captures dimensional, positional and volumetric data in seconds. Two new 500-series Multi-Reflection Suppression (MRS) sensors –HR and HS variants – deliver distortion-free imaging on reflective and complex surfaces. Unified architecture is suited for applications including fine-pitch SMT, advanced packaging, 0201 metric components, sockets and connectors and precision geometry measurement. Coordinate measurement software suite enables CMM-level accuracy at production throughput, while the updated AutoProgram tool leverages AI to reduce setup time and identify features and inspection regions.

The i7090 from Keysight integrates in-circuit flash programming, LED and boundary-scan test methods within a single platform for high-volume PCBA lines. Up to 20 parallel test cores permit simultaneous testing of multiple boards, and the 600mm footprint is suited for dense factory layouts. Modular expansion supports shifts in production scale without major line changes.

Mycronic introduces the MYPro A41 series, a new pair of placement systems developed for manufacturers assembling large printed circuit boards. The MYPro A41DX-17 and MYPro A41SX-17 extend the capabilities of the MYPro A40 platform with support for substrates up to 1000×609 mm and thicknesses up to 12.5 mm when used with the T1000 conveyor. The A41DX-17 offers a rated speed of 49 000 components per hour and includes electrical component verification as standard. An MX7 high-speed mount head supports heavy or oversized boards up to 10 kg. Setup and programming follow the same interface as earlier Mycronic models, allowing operators to adopt larger-format production with minimal retraining.

Molex has released the Quad-Row Shield Connector, a board-to-board interface that incorporates an integrated metal EMI shield within a four-row signal structure. Uses an internal shielding element to limit electromagnetic and RF interference without external shielding components. The design supports up to 80 signal pins with two power-pin sets. It retains the company’s quad-row layout while adding EMI control at 2.4–6GHz. The connector is intended for compact devices such as wearables, mobile systems, AR and VR units, and other consumer hardware requiring space-efficient board-to-board connections.

Stackpole Electronics HCSK1216 high current four terminal shunt resistor separates supply current and voltage sensing paths, minimizing power loss and eliminating lead resistance errors.

Essemtec Tarantula Dual Lane dispensing platform supports up to three valve heads, and Jet-on-the-Fly achieves up to 1.1 million dph at maximum frequency, and an average of 350,000 dph for complex boards in high-speed paste jetting or 2 million dph for glue jetting applications.

Vision Engineering ProteQ VISO 3-D digital stereo microscope features fully integrated autostereo display.

Shenmao PF606-P279L ultra-fine pitch solder paste is for mini-LED manufacturing.

Mek's ISO-Spector X1 3D THT Bottom-Up AOI combines 3D optics and projection technology with inspection algorithms to measure through-hole solder-joint volume and pin height. Supports bottom-up verification for wave and selective-solder processes, with data capture for volume, height and pin extension. System target SMT and THT inspection in electronics manufacturing and process verification.

Solderstar WaveShuttle O₂ verification tool. Builds on the original WaveShuttle by adding real-time oxygen measurement to wave soldering process control. Captures seven parameters in a pass, including temperature profile, wave contact, wave height, line speed, inclination angle, vibration and oxygen concentration. Features titanium contact sensors for wave height and line speed measurement, plus a three-axis vibration sensor that detects mechanical instability caused by worn parts or misaligned tooling. Inclination sensors track PCB entry and exit angles at the wave. ESD composite and titanium construction, with custom production sizes available. Integrates with SLX datalogger to separate machine-level variation from PCB-specific issues.

Hirose DF22 Series of power connectors now comes with DF22B branch adapter, designed to simplify wiring and reduce cabling and installation time. Enables branch wiring and supports up to 30A per contact at 1000V AC/DC with a four-point contact design and highly conductive materials. Offers multiple configurations, straight, right-angle, and in-line wire-to-board, with three housing types featuring different guide keys and color variations to prevent mis-mating in systems using multiple connectors. For harsh environments, a straight header variant supports potting up to 10mm. Is for compact, high-current branching applications such as semiconductor equipment, industrial robots, conveyors, mounting machines and service robots.

Henkel has introduced Loctite TCF 14001, a high thermal conductivity silicone liquid TIM designed to meet the thermal control requirements of 800G and 1.6T optical transceivers. A thermal conductivity of 14.5 W/m-K. The two-part silicone formulation features low volatility and minimal outgassing. Its filler technology allows for automated dispensing with stable flow, strong adhesion and tolerance for gap variations. Beyond AI data centers, Loctite TCF 14001 is also suitable for other high-power applications in telecom, automotive, power generation and industrial automation.