Vishay Intertechnology has introduced the DLA 04051 series of vPolyTan polymer surface-mount chip capacitors, engineered to meet Defense Logistics Agency 04051 specifications for aerospace, military, and space systems. Feature ultra-low ESR down to 25 mΩ, enabling improved performance in power supplies, radars, radios, transponders and energy storage modules. Offers capacitance values ranging from 4.7 μF to 680 μF and voltage ratings from 2.5 V to 63 V. Long-term reliability is validated through 2000 hours of testing at 125 °C, while mechanical performance includes 500 g shock resistance, MIL-STD-202-204 Level D vibration compliance and 10 thermal shock cycles per MIL-STD-202-107. As a second-source alternative to Yageo/Kemet components, the DLA 04051 series provides design assurance and supply chain security for mission-critical AMS applications. Samples and production units are available with 35-week lead times, starting at $1.50 per unit for U.S. deliveries.

Dymax has introduced 9773, a ruggedizing and staking adhesive engineered to secure and protect components on printed circuit boards used in satellites, missiles and other space-based systems. The material is certified to NASA ASTM E595 Low Outgassing and Mil-Std 883 Method 5011 Low Ionic Content standards. Offers on-demand UV/visible light curing, which speeds processing and increases throughput by eliminating delays associated with traditional two-part epoxies. It is non-slumping for up to 72 hours on vertical surfaces and is compatible with jet dispensing, making it well-suited for ruggedizing, staking, or encapsulating PCB components. With a one-part, solvent-free and halogen-free formulation, Dymax 9773 also supports sustainability goals while delivering high performance.

Yamaha Robotics has introduced its latest LM placement head, engineered to extend the capabilities of surface-mount machines to handle today’s larger, heavier, and more complex components. The LM head combines enhanced hardware and software features, including extended R-axis and Z-axis control, high-precision placement-force management up to 100N and advanced landing detection, to support accurate alignment and insertion of bulky components such as high pin-count press-fit connectors. A redesigned gripping section and a new suite of interchangeable nozzles allow secure handling of oversized ICs, DIMM sockets and other non-standard parts, while compatibility with existing nozzles ensures seamless placement of standard SMD, SOP, and QFP devices.

ioTech has unveiled the io600, a high-speed, high-resolution inline digital laser material deposition system engineered to bring Continuous Laser Assisted Deposition (CLAD) into full-scale industrial manufacturing. Capable of depositing up to 7.2 million dots per hour with a 600 x 600 mm active work area, the io600 delivers 50µm resolution and ±10µm positional accuracy for high-volume production. Its nozzle-free, non-contact laser design eliminates clogging and maintenance, enabling continuous operation and lower ownership costs. Supporting a wide range of dielectric and conductive materials, including polymers, solder pastes, conductive inks, metals and ceramics, the io600 enables complex multilayer geometries and seamless scaling from prototyping to mass production. 

Inspectis AB has introduced the HD-041, a 360-degree rotating viewer designed to streamline visual inspection processes by eliminating the need for constant Z-axis camera adjustments. Featuring a built-in lens that maintains focus at all tilt angles once the working distance is fixed at 80 mm, the HD-041 enables seamless transitions between oblique and top-view inspection. Its push-pull slide mechanism with spring-loaded ball screws ensures precise positioning, while compatibility with INSPECTIS digital F and U microscopes and ring light mounts enhances system flexibility. The viewer integrates with INSPECTIS Pro Utility and Metrology Software, enabling efficient image capture, measurement, analysis and reporting for a wide range of inspection applications.

Kulicke and Soffa’s ACELON is a high-precision dispensing solution engineered for advanced semiconductor, SMT and automotive manufacturing applications. Built on the company’s machine architecture used in critical high-reliability production environments, ACELON combines enhanced process stability with an expanded working area to accommodate larger substrates and complex assemblies. The system delivers sub-20µm wet accuracy, ensuring precise material placement in applications requiring tight dimensional tolerances. By reducing setup time, improving process consistency and handling complex packaging challenges, ACELON supports next-generation device performance across automotive, computing, industrial, memory and communications sectors.

Yincae's Diamond Underfill UF 158D is engineered to deliver exceptional thermal management in advanced semiconductor applications, achieving 8 W/m·K thermal conductivity through nano-engineered diamond particles. Designed for flip-chip, 2.5D/3D integration and high-density interconnects, UF 158D reduces solder fatigue, mitigates CTE mismatch and enhances long-term device reliability. Its strong adhesion and mechanical robustness make it well-suited for next-generation packaging demands. Available in both dispensable and jettable formulations, UF 158D has passed JEDEC reliability standards.

Metcal PT4-4000 and PT4-8000 Series 4-Zone Circuit Board Preheaters deliver thermal control for advanced electronics manufacturing and rework applications. Using Resistive Radiant Heat Technology, the systems radiate heat from a ceramic plate through a tempered glass surface, eliminating hot spots and ensuring consistent temperature distribution across the board. Each unit features four independently controlled temperature zones to accommodate a wide range of PCB sizes and thermal profiles, with real-time feedback from external thermocouples that continuously monitor and adjust heat output for maximum accuracy.

Advanced temperature control modes and programmable thermal profiles enable repeatable, application-specific performance, while enhanced flexibility makes the preheaters ideal for high-density assemblies, multilayer boards, and thermally demanding components. Designed to support both production and repair workflows, the PT4 Series integrates seamlessly into processes ranging from consumer electronics and data center hardware to aerospace, defense, and medical devices. The series is compatible with Metcal’s premium circuit board holders, which provide stable, adjustable support during heating and rework operations. 

Mectal

https://www.metcal.com/

Master Bond's LED422DC90 is a nanosilica-filled, one-component dual cure adhesive designed for high-speed fixturing and bonding of opaque substrates. The system’s side-bonding capability allows rapid polymerization up to 3–4 mm deep using angled 405 nm LED light, with final curing achieved through a secondary heat process at 90–95°C for 30–45 minutes.  Combines dimensional stability with low thermal expansion (30–40 x 10⁻⁶ in/in/°C), and delivers strong mechanical properties, including tensile strength of 6,000–7,000 psi and lap shear strength of 800–900 psi (aluminum-to-aluminum). The adhesive is optically clear with a refractive index of 1.49, Shore D hardness of 85–90, and elongation of 1–3%. Functions as a reliable electrical insulator with a volume resistivity greater than 10¹⁴ ohm-cm and meets NASA low-outgassing requirements.

Keysight's NA5305A Frequency Extender (up to 170 GHz), NA5307A Frequency Extender (up to 250 GHz), and 85065A Precision Calibration Kit 0.5 mm expands the capabilities of its PNA/PNA-X VNA solutions. Delivers calibrated single-sweep broadband S-parameter measurements from 100 kHz to 250 GHz, enabling faster testing for high-speed interconnects, next-generation semiconductors and sub-THz wireless devices. Designed to reduce design cycles and enhance accuracy, the offering provides up to 105 dB system dynamic range and differential measurement capabilities, while partnerships with FormFactor, MPI, Spinner and Junkosha bring advanced probes, adapters and cables to complement the test ecosystem.

Cybord's fully air-gapped Visual AI platform brings advanced inspection and traceability capabilities on-premises for industries with strict data security requirements such as aerospace, defense and aviation. Integrated with Siemens’ Opcenter Execution Electronics, the platform inspects 100% of components during SMT processes, authenticating parts by lot and origin, enforcing BOM and AVL compliance and detecting tampering or defects. By eliminating reliance on cloud connectivity, the solution ensures data sovereignty while safeguarding against counterfeit or defective components, reducing recalls and strengthening hardware cybersecurity in highly restricted environments.

Shenmao Technology's SMF-WC58 is a halogen-free, water-soluble tacky flux. Engineered for ultra-fine bump pitch flip-chip and BGA/CSP processes. Designed for advanced semiconductor packaging. Delivers wettability on a broad range of pad finishes, including Bare Cu, Cu-OSP, NiAu, ENEPIG and ImSn. Offers a work life of 12 hours or more. After reflow, residues are removed using deionized water. Compatible with printing, transfer and dipping applications.