Chip mounters support high-speed SMT assembly with placement rates up to 95,000 components per hour. The systems reduce board recognition time by approximately 30% and use vision-based alignment and calibration to improve placement accuracy and minimize component loss. They handle a wide range of components and support PCB weights up to 4.5kg. The platforms include updated user interfaces and are designed for integration with smart factory environments and automated material handling systems.

Slot-die coater supports thin-film deposition on rigid substrates and flexible materials for research and development applications. The system integrates a vacuum chuck, syringe pump, and heating for controlled coating and drying in a single unit. It enables film thickness control from nanometer to micrometer scale and supports slot-die, bar, knife, and flexo coating methods. The platform is available in two sizes and can be configured for roll-to-roll processing. It is designed for use in laboratory environments including gloveboxes and fume hoods.

EP6STC-80 is a one-component, non-frozen, silver-filled epoxy designed for bonding, sealing, and coating applications requiring thermal and electrical conductivity. The system provides unlimited working life at room temperature and cures at 80°C. Thermal conductivity is rated at 13–14W/(m·K), with volume resistivity below 0.001ohm-cm. Operates across a temperature range of -60°C to 150°C and bonds to metals, ceramics, composites and plastics. It meets NASA low outgassing requirements and contains no solvents or diluents. The epoxy exhibits a tensile modulus of 1,400,000–1,800,000psi at 25°C and cures in 3–5 hours at 80°C. Formulated as a thixotropic paste with viscosity between 500,000–1,500,000cps, supporting manual and automated dispensing. Packaging options include syringes from 20g to 100g and jars up to 200g.

Compliance Agent automates regulatory data collection, validation and reporting for electronics manufacturing services (EMS) workflows. The system captures compliance data including RoHS and REACH status, material declarations, conflict minerals with smelter information, and other regulatory requirements such as TSCA and Prop 65. Validates incoming supplier data, generates configurable compliance reports, and retrieves missing information through automated supplier communication. Continuously monitors regulatory updates and supplier status changes, alerting users to impacts on bills of materials and incorporating new data as it becomes available. Designed to reduce manual compliance tasks and support ongoing regulatory management across global supply chains.

Workbench configurator platform supports design and visualization of modular workstation environments using Treston and IAC solutions. Enables users to configure workbenches, storage systems and accessories through an interactive interface with real-time layout adjustments. Supports selection of standard and custom configurations to align with production requirements and facility constraints. Provides visualization tools to compare layouts and assess integration into existing manufacturing lines. Designed to streamline workstation planning, reduce design time and support coordination across engineering, production and procurement teams.

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Omnyx PCBA test platform supports detection of structural, parametric, high-speed interconnect and functional defects in printed circuit board assemblies used in AI servers and data center systems. Combines synchronized analog and digital subsystems with mission-mode and software-directed testing to identify at-speed and operational defects earlier in the manufacturing process. Supports single-site, multi-site and large-format test architectures with pin capacity from 2,560 to more than 10,000 pins. Accommodates PCB sizes up to 900×750mm and weights up to 15kg. Includes no-touch high-speed conveyance with SMEMA compatibility and supports automated or manual fixture configurations. Designed to improve yield, product quality and test coverage in high-performance computing hardware production.

EHS-222M-L highly accelerated stress test chamber supports reliability testing of large multilayer PCBs and high-density electronic assemblies. Accommodates board sizes up to 290×460mm with increased internal depth and expanded fixture capacity for high specimen volumes. Provides up to 120 bias terminals at up to 1,000V to support complex testing configurations. Operates across temperature range of +105.0°C to +142.9°C, humidity range of 75%–100%RH and pressure range of 0.019–0.193MPa. Supports accelerated reliability testing for AI hardware, automotive electronics and data center systems requiring high-temperature, high-humidity and pressure conditions.

The Mydata Midas tool 2026-5652 supports placement of the N61381US component in SMT assembly processes. The tool features a 0.125" outside diameter and 0.047" inside diameter with a 90° V-cut profile designed to align and seat components during placement. It is pinned to D121 to maintain alignment and positioning consistency during pick-and-place operations. The geometry supports stable handling of specialized components and consistent vacuum performance for automated assembly environments. The tool is designed for use on MYDATA systems and supports applications requiring precise component placement and handling of non-standard geometries.

Boardera API PCB project analyzer automates fabrication analysis, BOM processing, assembly planning and project pricing for electronics manufacturing workflows. The system extracts fabrication requirements including layer stackup, board dimensions, copper area, drill data and pad features from design files. BOM tools map component data, generate procurement links, assess availability and end-of-life risk and flag compliance with RoHS and REACH. Assembly planning functions calculate part counts, placement volumes, and package classifications to support process planning. Pricing modules support PCB-only, assembly-only, and turnkey configurations with models aligned to fabrication and EMS operations. The API integrates into manufacturer systems to support design analysis, quoting and production planning across PCB fabricators, assemblers and OEMs.

Custom extra-large format BGA packages support high I/O-count applications requiring expanded footprints up to 100mm×100mm. The devices provide increased ball-grid density and accommodate designs where standard off-the-shelf BGA formats are insufficient. The packages are intended for applications that require larger interconnect areas and higher signal counts, supporting design flexibility for complex electronics systems. Expanded footprints allow engineers to integrate additional I/O while maintaining compatibility with ball grid array interconnect structures commonly used in advanced electronic assemblies. The custom BGA formats are available through TopLine for specialized applications requiring nonstandard package dimensions and high-density interconnect capability.

Print Param Decision Assist software tool evaluates PCB data to generate printing parameters for Yamaha surface-mount printers during new product introduction (NPI). The tool analyzes board dimensions, component types, solder-paste type, stencil thickness and aperture geometry to calculate settings including system pressure, printing speed, squeegee angle and stencil cleaning frequency. Integrated into the latest release of YSUP-PG, the programming environment within Yamaha’s YSUP intelligent factory software suite. A graphical interface allows operators to review recommended parameters and adjust settings before production. Intended to support faster NPI setup and parameter verification during stencil printing processes. 

Rigol DNA5000 and DNA6000 Series vector network analyzers support RF and microwave analysis across a frequency range from 5kHz to 26.5GHz. Available in 2-port and 4-port configurations, the instruments support testing of passive components including filters, antennas, cables, dielectric materials, and high-speed interconnects. The analyzers offer dynamic range up to 127dB and low trace noise to support characterization of high-rejection devices and stable measurement performance. Fixture removal and de-embedding functions allow measurement correction for test fixtures, adapters, and cables, enabling direct S-parameter analysis of the device under test. Built-in analysis tools include limit testing, standing wave ratio (SWR) measurement, Smith chart display, and time domain reflectometry (TDR). An integrated calibration wizard guides setup procedures to support measurement repeatability across laboratory and production environments. The instruments feature a touchscreen interface and support HDMI, LAN, USB, and GPIB connectivity for integration with automated test systems. The compact DNA5000 Series targets bench-space-constrained environments, while the benchtop DNA6000 Series supports long-duration testing and automated production test configurations.