The YRH10W hybrid placer is a wide-type placement system designed to support both semiconductor die bonding and surface-mount component placement within one platform. Expands capability to accommodate 12-inch wafers and large-format printed circuit boards up to L510 × W460mm. Combines bare-die handling and SMT placement functions, delivering a bare-chip placement speed of up to 14,000 components per hour when supplied with wafers, along with placement accuracy of ±15µm. Designed for flexible production environments. 

The TR7600FB SII is a 3D automated X-ray inspection system. Optimized for specialized substrates, fine-pitch BGAs, multilayer boards and system-in-package (SiP) devices. Incorporates a newly developed X-ray imaging structure that allows the X-ray tube to operate in close proximity to the board surface without structural interference. This architecture supports detailed inspection of critical components requiring precise internal visibility. Powered by TRI’s AI Ecosystem, combining AI-driven inspection algorithms with metrology-based measurement capabilities. Supports AI Smart Programming.

PF606-P266J is a solder paste developed for high-speed jet dispensing applications in advanced electronics manufacturing. Designed for non-contact solder deposition. The formulation meant to maintain process stability across a broad range of jetting parameters. The solder paste uses a halogen-free flux system that supports strong wetting behavior and low residue levels. PF606-P266J supports ultra-fine solder powders from Type 5 through Type 7. The product is available in multiple alloy options, including SAC305, high-reliability alloys for automotive and industrial electronics and low-temperature alloys.

The VALID SL in-circuit and functional test system is designed for high-channel-count testing in demanding electronics manufacturing environments. Introduces a cable-free architecture with new 128-channel scanner cards, supporting configurations exceeding 4,480 channels for complex test requirements. Offers an expanded test area with both single-stage and dual-stage configurations and supports multi-job operation through Seica’s latest VIVA software interface. Integrates streamlined internal hardware access. Built to support scalable automation and intelligent test strategies for high-volume and high-reliability applications.

The VT171P single-channel and VT172U dual-channel transmissive sensors are surface-mount devices designed for position sensing in industrial, consumer and telecom applications. Housed in a 5.5mm × 4mm × 5.7mm package with a 42% increased dome height compared to previous-generation industrial devices. Supports greater mechanical design flexibility and increased vertical clearance for large code wheels in turn-and-push applications. Both devices integrate an infrared emitter with phototransistor detection and operate at a wavelength of 950nm. Deliver a typical output current of 1.5mA with a 3mm gap width, 0.3mm apertures, and rise and fall times of 14ms and 21ms. The VT172U adds dual-channel detection for direction sensing, while both devices support motion and speed detection for encoders, automation systems, consumer electronics, appliances, health and care devices, switches, relays, antennas, and mobile broadband equipment. 

The InoHD ultra-high-density smart storage system is designed to maximize SMT and electronic component storage while reducing factory floor space requirements. Eliminates traditional storage aisles by combining servo-driven mobile shelving with smart sensing and pick-to-light guidance. Supports storage densities of up to 310 SMT reels per square foot while maintaining guided access and real-time inventory verification. The system enables direct point-of-use material access with built-in verification to reduce picking errors. Accommodates more than 10,500 SMT reels within a 4ft × 8ft footprint, supporting space reduction compared with conventional stockroom layouts. Modular and scalable architecture designed for integration with existing MES and ERP platforms to reduce labor time and unnecessary material handling.

The SelectaFlux 3 selective ultrasonic flux spray system is designed for controlled flux application in selective solder machine environments. Delivers ultrasonic spray fluxing to support top-side solder fillet formation while reducing overspray and splatter associated with jet fluxing methods. Offered as a ready-to-integrate retrofit solution compatible with major selective solder platforms. The SonoFlux Servo Flow Monitoring option adds non-contact flux volume measurement for process control and traceability. Provides real-time flow monitoring with ±15% accuracy, per-board flux volume recording, data logging for historical review and active alarms when flow rates fall outside defined limits. 

The LTX1260A 3D Inspection and Measurement and TMX Profile System is designed for non-contact inspection of delicate and high-precision components. Combines a Keyence LJ-X8020 3D scanner with the TMX-5006 profile measurement platform to deliver automated inspection of surface condition and geometric profiles. Supports applications including hypodermics, catheters, stents, guidewires, micro fasteners, fuel injector nozzles, optical fibers and precision spray and inkjet components. Features dual-station operation for 3D contamination detection and profile measurement, semi-automated fixturing with rotary and linear stages, integrated data capture with CSV and Excel export, and automation-ready architecture for future production integration. 

XQuik V is for fast, accurate X-ray-based component counting and inventory control. High-resolution X-ray imaging with enhanced source power. Automatic load drawer for simplified operation. Integrated barcode camera links reel IDs to count data. Designed to reduce manual entry errors, improve material accuracy, and speed inventory verification.

Summit LT150 is for rework of large, high-density electronic assemblies and next-generation components. Supports components up to 150mm. Large field-of-view vision system with full-component visibility. Scaled top and bottom heating with dual PID control. Supports board sizes up to 24×36in, with optional larger formats. Increased clearance for tall connectors, heat sinks, and power modules. Designed to maintain uniform thermal performance while reducing thermal stress.

Photonics Systems InnoLas DP10X0 laser depaneling system is specifically designed for PCB assembly operations.

Flip Chips with Daisy Chain dummy components are for developing electrical test expertise.