Tagarno relaunched its Full HD digital microscope line with updated configurations, revised model structure and a new camera system for inspection applications. Now centers on the ZIP+, ZAP+, and TREND+ models, with MOVE and FRONT integrated as configurations within the ZAP+ platform and the Prestige model discontinued. The microscopes incorporate a Sony FCB-EV9520L camera, providing improved dynamic range, reduced image noise,and updated color reproduction for inspection of reflective and fine-detail surfaces such as solder joints. Supports simultaneous zoom and focus adjustments, along with faster image processing for navigation and inspection tasks.

Low-silver wire solder series supports manual and automated soldering applications with reduced silver dependency. The system features 0.1–0.3% Ag content and anti-iron tip erosion properties to extend soldering tip life. Designed to support improved wettability and solder flow, with reduced bridging under challenging conditions. Flux system enables consistent coverage with residues designed for simplified cleaning. Suitable for robotic soldering applications and integration into automated assembly processes. Intended for electronics manufacturing environments seeking cost control while maintaining process stability.

Low-silver solder paste series supports SMT assembly with reduced material cost exposure while maintaining process compatibility. The system features ~0.1–1.1% Ag content compared to ~3.0% in SAC305, enabling lower silver usage. Designed for compatibility with standard SAC305 reflow profiles, minimizing requalification requirements in existing processes. Supports stable wetting performance and controlled voiding behavior, with reliability validated through thermal cycling and mechanical testing. Intended for cost-sensitive SMT applications requiring consistent process performance and long-term reliability.

Wafer inspection and metrology platform supports advanced packaging and back-end semiconductor processes. The system accommodates 6" to 12" wafers and integrates automated visual inspection for detection of particles, scratches, chipping, contamination and foreign materials. Granite-based structure supports system stability, with optional short-wave infrared module enabling detection of subsurface defects within silicon. 3D depth-from-focus module offers imaging at 0.5µm or 1µm resolution for detailed surface analysis. Platform performs metrology for wafer thickness, top-side warpage and surface topography, along with measurement of through-silicon via depth, trench dimensions, thin films and chiplet features. Designed for inspection and measurement applications across advanced packaging workflows.

Collaborative robot supports flexible automation across high-mix, low-volume manufacturing environments. The system offers a 3kg payload and weighs 24lbs, enabling manual repositioning and rapid redeployment between workstations without fixed installation. Designed for applications including welding, part handling, screwdriving, small assembly and inspection. Compact form factor supports use in constrained spaces, with mounting options including floor, wall and ceiling configurations. Part of the CRX platform with expanded capabilities such as dual nut runner operation, high inertia mode for assisted heavy movement and enhanced palletizing support up to 40kg on larger models. Compatible with R-50iA controller, supporting Python scripting, ROS 2 integration and AI-driven motion applications.

Ultrafast rectifiers support power conversion and protection applications across automotive, industrial and electronics systems. The 200V devices provide current ratings from 6A to 15A and are offered in single and dual configurations, including AEC-Q101 qualified versions. Housed in a 6.5mm x 4.6mm DFN6546A package with a 0.88mm profile, enabling compact PCB layouts. Optimized copper mass design and die placement support thermal performance for higher current operation, while wettable flanks enable AOI inspection without X-ray. Operate from -55°C to +175°C and feature low forward voltage drop of 0.75V, fast reverse recovery and low reverse recovery charge to reduce power losses. Applications include inverters, DC/DC converters, freewheeling diodes, protection circuits and automotive systems such as ECUs, ADAS and battery management.

Incoming inspection platform supports traceability and material verification in electronics manufacturing. The MODI WES 5 uses high-resolution imaging to capture and verify component data at receipt, including barcode reading and label analysis. The system records key information to support full traceability from incoming materials through production. Integrates with ERP and MES systems to maintain data continuity across manufacturing workflows. Automated inspection reduces manual errors, improves receiving speed and enhances inventory accuracy. Designed for production environments, the system supports material tracking, documentation and process control before assembly operations begin.

Ring light supports optical inspection of reflective surfaces in electronics manufacturing. The HD-124-LA uses 48 LEDs arranged in a ɸ148mm ring to provide high-angle illumination for reduced glare and improved surface visibility. Designed for use with digital microscopes, it enables uniform lighting across metallic parts and PCB surfaces at lower magnifications. Provides high color rendering at 5700K and supports adjustable brightness through an integrated controller with five repeatable levels. Segmented lighting improves shadow control and enhances visibility of surface topography, supporting inspection of solder joints, scratches and defects.

Traction-grade DC filtering capacitors support high-power applications in electric vehicles and industrial systems. The FFLK series uses metallized polypropylene film to enable high current handling, low ESR and long operating life in compact cylindrical form factors. Designed for demanding environments, the capacitors support applications exposed to high temperature, vibration and electrical stress, including motor drives and traction systems.

Selective soldering platform supports through-hole PCB assembly in batch and in-line configurations. The PHOENIX system provides automated flux application, precision solder control and software-driven process management through EmberX, enabling consistent and repeatable soldering results. Designed for integration into production environments, the platform supports reliable operation and streamlined workflows for electronics assembly applications. Systems are backed by established selective soldering expertise and support infrastructure for ongoing production needs.

Agentic AI platform integrates with manufacturing execution systems to automate reporting, support, modelling and code generation in semiconductor and electronics factories. FabOrchestrator layers large language model capabilities onto MES platforms, enabling engineers to query production data in natural language, streamline support ticket handling and accelerate system configuration and implementation. The platform includes tools for data analysis, automated troubleshooting, system modelling guidance and back-end code generation, supporting more efficient use of factory data and reducing engineering workload.

High-power chip resistors with aluminum nitride substrates support thermally constrained electronics applications. The RMAN series uses aluminum nitride to enable higher thermal conductivity than standard alumina, allowing improved heat dissipation, lower operating temperatures and stable electrical performance. Designed for power-dense environments, the resistors support applications including IGBT, SiC and GaN modules, power supplies, EV systems and RF circuits. Devices deliver power ratings up to 2.4W in 1206 and 3.4W in 2512 packages while maintaining controlled hotspot temperatures.