New Products

Omano OMPCB-23/99 electronic inspection microscope enables continuous 3-D inspection, across the length and breadth of a PCB without the need to constantly check positioning. Features a choice of 7-45X or 6.5-45X zoom stereo microscope body. Includes oblique viewing attachment with integrated 0.3X Barlow lens; enables the operator, with fingertip adjustments, to view PCB vertically as well as from all sides. Features a built-in, rotatable, light mount that will fit most brands of fiber optic illuminators and a large sliding stage that enables quick scans across PCB length and breadth. Weighs 46 lbs.
The Microscope Store, 
Omano OM2300/V3 combines the OM2300 7-45X zoom stereo microscope body with a new V3 base. The base is made of solid metal alloys and designed for ergonomic, repetitive inspection and soldering procedures. Measures 12" x 12" with beveled edges for operator comfort and a black/white contrast plate. Options include Omano OM99 6.5-45X microscope body. Weighs 18 lbs.
The Microscope Store, 
Trek Model 900 is a diagnostic tool for identifying or investigating suspected ESD incidents. Includes a voltage-sensitive antenna that can be positioned near potential problem areas to monitor ESD events. Detection is conveyed via an audible buzzer and/or a visual color-coded light display that depicts intensity. Is compact, portable and powered by batteries or continuous AC. CE compliant.
The YTX X3 3-D x-ray inspection system is for PCBs with BGAs and other hidden solder joints. Proprietary imaging technology gathers oblique images to construct a 3-D rendering used to identify solder and component-related defects on both single and double-sided boards. Selectively uses 2-D or 3-D to inspect specific regions on a board. Programming is said to be fast and intuitive, with a typical complete inspection program created in fewer than 30 min. Is suited for in- or offline applications and reportedly offers fast throughput and low false calls. Included are remote programming and real-time SPC software.

YESTech Inc., 
Press-Fit, Solderless Interconnect Technology permits assembly of a terminal or electrical lead with a plated through-hole to create a solderless electrical connection. Reportedly is fully tested to meet operating requirements, and has passed standard automotive testing requirements for vibration and for temperatures up to 125°C. Material thicknesses for eye-of-the-needle-based press fit designs are 0.64 and 0.80 mm.

Interplex Industries,

The SM400 Series is designed on the SMART platform. Integrated software features a common operating interface, which is said to provide a stable base platform that is scalable and modular with a space-efficient design. Includes flying-vision centering with individual cameras for each spindle. Identifies component centers during travel from the feeder to the placement location. Head is designed for simultaneous component pickup from the SM feeders. The SM411 Dynamic Chip Shooter is said to place at a rate of 42,000 cph with placements accurate to ±50 µm at 3-sigma (Cpk ≤ 1.0). Dual gantry system includes a dual-lane PCB transport with three on-demand production configurations. The SM421 Advanced Flexible Mounter is reportedly capable of handling up to 72 mm SMT connectors. Is said to reach placement speeds up to 21,000 cph with accuracy of ±30 µm at 3-Sigma (Cpk ≤ 1.0). Has optional external side tray handler and intelligent feeder system.

Dynatech Technology,    

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