A boundary scan-VTEP hybrid is said to offer in-circuit test users a way to test assemblies in a limited access environment. Combines standardized, limited access, digital stimulus capability of boundary scan with vectorless VTEP. Permits boards to be designed with less electrical test access. Available to Agilent customers with valid software upgrade contracts for i3070 and VTEP-equipped fixtures.
The 0.050" pitch Micro Mate Discrete Wire Cable Terminal includes a socket assembly. Provides cable-to-board solutions for the TFM/SFM Series board-to-board interconnect system and features the Tiger Eye contact system. Includes Power Mate and Mini Mate, which provide isolated power/wire-to-board solutions. The 0.165" pitch Power Mate system provides up to 5.5A per power contact while the 0.100" pitch Mini Mate system offers 3.6A per contact. Assemblies are available with polarization, guide pins, and friction latching system.
EnviroGuard 100% closed-loop stencil cleaner is said to clean all types of solder paste with a 100% closed-loop process: wash and rinse. Matched properties of 440-R SMT detergent to a specifically designed filtration/UV system that facilitates zero VOCs of wash and rinse solutions. Reportedly captures for recycling 99% of the waste paste from stencils and misprinted PCBs. The remaining 1% is said to be removed by the filtration system. Is zero discharge, with no venting requirements. Retrofits to the company’s existing stencil cleaners.
MG-1R and MG-8R pick-and-place machines now permit easier maintenance access and better maintainability of the placement heads. The maximum board size has increased to 510 x 440 mm, and the operating panel, LCD monitor and keyboard have been relocated to improve ergonomics. Are for high-mix production, and place a range of components, including chips and complex and odd-form components. Can be used as standalone or inline. Placement rates are said to be up to 24,000 cph. A 3-D coplanarity camera and a side-view camera help eliminate placement defects. High-resolution vision systems reportedly recognize, dip-flux, and place the smallest balls and tightest-pitch flip-chips. Modules verify the correct condition of the placement nozzles, have a standard nozzle cleaning system, and self-calibrate.
The KISS-104F inline fluxer is said to flux only the specific components to be selectively soldered. The board enters on the (SMEMA) edge conveyor, located in a known position, and flux applied via X-Y motion under programmable control. The board proceeds to the next station: the inline preheater module or directly into the KISS-104 for selective soldering. Reportedly will reach all areas of a PCB panel up to 18" x 24". Features standard precision aerosol flux applicator with a deposition range of 4 to 25 mm, and an optional drop-jet applicator with dot size as small as 1.5 mm. Can be configured with multiple applicators to apply mixed flux chemistry. Options include an airless drop jet fluxing system and multiple nozzles. Accepts all conventional flux chemistries.
OptiCon AOI now includes standard inspection of 01005 components and 0.3-mm pitch solder joints. Is achieved with an increase in lens resolution in the camera module. Is said to improve detail recognition for the inspection of the smallest structures. The telecentric lens reportedly offers faultless image recording independent from the components’ position; height extension has been retained. Is enabled by the use of a pixel-adapted lens; design has been adjusted to the pixel geometry of the CCD matrix. A resolution of 10.5µm per pixel is achieved.