Multicore MF210 no-clean, sustained activity flux is compatible with Pb-free and SnPb processes.  Halide-free, resin-free material is effective with a range of solder resists, as well as rosin and OSPs. Has a wide process window and a preheat temperature range of 80° to 130°C; has a one- to three-sec. contact time on the wave. Can be used in single- and dual-wave processes. Reduces solder microballing.

Henkel Electronic Materials, www.henkel.com/electronics

Cobra pick-and-place machine is a three-step SMEMA inline system, with an octagonal placement head, up to two dispensing valves, customizable machine finishing, up to 240 feeder slots, a mineral cast chassis, and ePlace software. Motion system is constructed as a real-time system that reduces the number of cables in the machine. Mounts device packages from 01005s, QFPs, complex BGAs, QFNs, CSPs, bare dies, and connectors to odd shapes up to 10 x 150 mm.

Essemtec, www.essemtec.com

SRT Micra benchtop rework platform is designed for rework of small, high-density electronic devices. SierraMate V9 software simplifies process definition; reportedly ensures consistent, repeatable results between facilities. Offers Auto-Run feature, an automated process setup tool, and virtual process engineer; minimizes rework setup and profiling times. Can accommodate 01005 passives and 0.3 mm pitch area array devices. Removes residual solder. |

VJ Electronix, www.vjelectronix.com

Seitec Bravo STS-2533 IN H & SJ soldering system is for inline and modular selective soldering. Programmable system features a special nozzle design and a spray fluxer unit. Features include a conveyor with roller, a specially designed solder pot, and a drawer-type solder pot. Is for mass production.

Seika Machinery Inc., www.seikausa.com