Genesis Series 2 surface mount placement platform places passives down to 01005, 20mm sq., 0.4mm-pitch µBGAs; QFNs; and high-density, low-profile connectors. Part sensor verifies part presence immediately prior to placement. Reduces changeover up to a reported 75% with dual-platform tray feeder and flexible feeders. Max. board length 1016mm. Has linear motors with closed-loop 1µm positioning. Features dual on-the-head cameras that provide high magnification and wide field of view to vision components up to 30 x 30mm and up to 6mm tall. Digital upward-looking camera provides a 55mm field-of-view. Includes  1-, 2-, and 4-beam configurations  and three placement head options for throughputs  of up to 140,000 cph on the 4-beam version.                                                        

Universal Instruments Corp., www.uic.com

SD 903 semiautomatic stencil printer is modular and features defined squeegee pressure. Automatic squeegee feed guarantees each squeegee operation is done in a predefined speed. Accepts all stencils, fixed frames or quick-clamping devices. Tiltable double-squeegee reportedly is easier to clean. Reportedly can be configured in minutes without tools. Upgrades to automatic version.

Fristch SMT, www.fritsch-smt.de

V810 automated optical inspection caters to different sizes of printed circuit boards. Vision Handler is for surface, marking or dimensional defect inspection. Standalone manual loading/unloading. Inspects double-sided panels. Detects shorts, opens, missing component, non-wetting, billboards, tombstones, lifted leads, solder balls, voiding, insufficient solder, reversed tantalum capacitors and excess solder. Features offline programming SW; virtual live image for troubleshooting; adjustable image quality tools and a component library. Inspects boards with a max. size of 457 x 609mm. Typical image acquisition rate is 32.3cm²/sec.

Vitrox, www.vitrox.com

EPM-2890 is a thermally conductive, non-corrosive silicone adhesive. Provides moderate heat transfer between electrical components and heat sinks. Exhibits less than or equal to 1% weight loss when heated for 30 min. at 275ºC to withstand Pb-free solder reflow. Is a one-part, white silicone adhesive that will room-temperature vulcanize, with moisture, in 72 hr. Can be used as an adhesive, sealing, caulking or potting material. Offers 100 psi min. primer-less adhesion on aluminum. Provides thermal conductivity at 0.6 W/(mK). Has an extrusion rate of 40 gm per min. Is ROHS-compliant. Has low sodium, potassium and chloride content.

NuSil Technology, www.nusil.com