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NEWS

9 French Firms Launch I4.0 Alliance

9 French Firms Launch I4.0 Alliance

PARIS – The Industrial Alliance (TIA) was officially launched Sept. 16. Nine French companies from the world of Industry 4.0 created a netwo...  Read More...

Register for CIRCUITS ASSEMBLY's NPI Awards by Oct. 22

Register for CIRCUITS ASSEMBLY's NPI Awards by Oct. 22

ATLANTA – Registration for CIRCUITS ASSEMBLY's 2022 New Product Introduction Awards (NPI) for printed circuit board assembly is open until O...  Read More...

V.S. Industry Berhad Reports Fiscal Q4 Revenue Up 7%

V.S. Industry Berhad Reports Fiscal Q4 Revenue Up 7%

SENAI, MALAYSIA – V.S. Industry Berhad reported fiscal fourth quarter revenue of MYR 941.1 million (US$224.7 million), an increase of 6.6% y...  Read More...

Creation Technologies, IEC Electronics Extend Tender Offer

Creation Technologies, IEC Electronics Extend Tender Offer

NEWARK, NY – Creation Technologies’ cash tender offer deadline to purchase IEC Electronics has been pushed back to Sept. 30, the electronics...  Read More...

N. American EMS Orders Up 28% in August

N. American EMS Orders Up 28% in August

BANNOCKBURN, IL – Total North American EMS orders in August rose 27.5% year-over-year and 29.3% sequentially, according to IPC.  Read More...

N. American PCB Orders Up 22% in August

N. American PCB Orders Up 22% in August

BANNOCKBURN, IL — North American year-to-date printed circuit board orders in August were up 21.9% year-over-year and down 16.7% sequentiall...  Read More...

Report: Autos, EVs Experiencing ‘Profound Impact’ of Semi Shortage

Report: Autos, EVs Experiencing ‘Profound Impact’ of Semi Shortage

CAMBRIDGE, UK – A massive shortage of semiconductors across all categories, according to some industry executives, is having a profound impa...  Read More...

Vanilla Electronics Acquires EMS Firm Interconics

Vanilla Electronics Acquires EMS Firm Interconics

THETFORD, ENGLAND -- Vanilla Electronics announced the acquisition of Wiltshire-based electronics manufacturing services company Interconics...  Read More...

Component Shortages Driving Delays, Higher Costs Survey Says

Component Shortages Driving Delays, Higher Costs Survey Says

BANNOCKBURN, IL — A new global survey found that electronics manufacturers continue to be harmed by the global shortage in semiconductors an...  Read More...

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FEATURES

Inventing Your Own Path

Inventing Your Own Path

The annual Women’s Leadership Program at SMTA International features two leading engineers. SMTA International returns to an in-person format this year, with a...  Read More...

AOI Operation Control by MES Using IPC-CFX

AOI Operation Control by MES Using IPC-CFX

A connected factory automates the AOI validation process. Automated optical inspection (AOI) is typically used after solder reflow to detect missing components...  Read More...

The Interaction of 2 Solder Paste Alloys with 5 Surface Finishes, Part 2

The Interaction of 2 Solder Paste Alloys with 5 Surface Finishes, Part 2

SAC 305 shows faster shear strength degradation than Innolot, while the surface finish has no effect. When a solder joint is exposed to cyclic stresses, therma...  Read More...

Conformal Coating Challenges: Detection, Rework and Failure Analysis

Conformal Coating Challenges: Detection, Rework and Failure Analysis

A DoE shows optimal removal strategies with various package styles.  Read More...

Using Cross-Sectioning for PCB Assembly Qualification

Using Cross-Sectioning for PCB Assembly Qualification

While destructive, slicing can best x-ray for failure detection and analysis.  Read More...

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

Overcoming charges and decreasing risks introduced by humans or machines.  Read More...

New Requirements for SIR Measurement

New Requirements for SIR Measurement

Requirements for no-clean solder paste to increase device chemical, thermal and electrical reliability.  Read More...

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PRODUCTS

Master Bond Offers LED405FL3 LED Curing Adhesive

Master Bond Offers LED405FL3 LED Curing Adhesive

LED405FL3 is a one-component LED curing adhesive with optical clarity and a refractive index of 1.51.  Read More...

ABB Rolls out IRB 920T Scara Robot

ABB Rolls out IRB 920T Scara Robot

IRB 920T Scara robot is designed for high-speed production.  Read More...

Mek Launches VeriSpector Manual AOI

Mek Launches VeriSpector Manual AOI

VeriSpector is an AOI for use on manual and semiautomated SMD and THT assembly stations.  Read More...

Vishay Enhances Draloric RCC1206 e3 Chip Resistor

Vishay Enhances Draloric RCC1206 e3 Chip Resistor

Draloric RCC1206 e3 thick-film chip resistor in 1206 case size now has higher power rating of 0.5W.  Read More...

Lloyd Instruments Launches NexygenPlus 4.1 Materials Testing Software

Lloyd Instruments Launches NexygenPlus 4.1 Materials Testing Software

NexygenPlus 4.1 materials testing software is for testing physical properties of raw material prior to processing, and for development of new electronics design...  Read More...

Palomar Releases 3880-II Die Bonder

Palomar Releases 3880-II Die Bonder

3880-II die bonder includes options to maximize productivity, reduce programming time by up to 95% and improve bonder productivity.  Read More...

Vishay Offers PHPA Series Resistors

Vishay Offers PHPA Series Resistors

Thin film wraparound PHPA series resistors have power ratings of 1.0W and 2.5W in 1206 and 2512 case sizes, respectively, with a self-passivated tantalum nitrid...  Read More...

Dymax Releases  9771 Conformal Coating

Dymax Releases 9771 Conformal Coating

9771 conformal coating is for use on printed circuit boards in missiles, satellites, and spacecraft. Is dual-cure and reworkable, and cures with light and moist...  Read More...

Saki Develops 3Di-LS2-CASE 3-D AOI

Saki Develops 3Di-LS2-CASE 3-D AOI

3Di-LS2-CASE 3-D AOI has unique, highly rigid gantry structure and AI-based inspection automation functionality reduce false calls for solder defects (non-wetti...  Read More...

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