caLogo

NEWS

Report: Pegatron to Invest $1B in Vietnam

Report: Pegatron to Invest $1B in Vietnam

HANOI – Pegatron plans to invest $1 billion in Vietnam as part of a three-phase implementation of computing, communication and consumer prod...  Read More...

Katek Reports Sales Up 40% YTD

Katek Reports Sales Up 40% YTD

MUNICH – Katek Group reported sales growth of 40% for the first eight months of 2020.  Read More...

ASM PT in Talks to Go Private?

ASM PT in Talks to Go Private?

HONG KONG – ASM Pacific Technology is talking to potential investors to take the company private, according to reports.  Read More...

IPC Among Trade Groups Urging EC President to Postpone Reporting Deadline for Chemicals Database

IPC Among Trade Groups Urging EC President to Postpone Reporting Deadline for Chemicals Database

BRUSSELS – IPC and almost 40 other groups called on European Commission President Ursula von der Leyen to postpone the January deadline for ...  Read More...

PCB West Virtual 2020 an 'International' Event

PCB West Virtual 2020 an 'International' Event

ATLANTA, GA – UP Media Group Inc. today announced more than one-fourth of attendees of PCB West (http://www.pcbwest.com) Virtual 2020 came f...  Read More...

Note Expects Increased Q3 Operating Margin

Note Expects Increased Q3 Operating Margin

STOCKHOLM – Note expects a continued positive earnings trend, with operating margin for the third quarter estimated to amount to approximate...  Read More...

Aug. N. American Semi Equipment Billings Up Nearly 33%

Aug. N. American Semi Equipment Billings Up Nearly 33%

MILPITAS, CA – North America-based manufacturers of semiconductor equipment posted $2.65 billion in billings worldwide in August, according ...  Read More...

IPC, PSMA Partner on Standards Development, Education, Training

IPC, PSMA Partner on Standards Development, Education, Training

BANNOCKBURN, IL — IPC and Power Sources Manufacturers Association have signed a memorandum of understanding pledging to build a complementar...  Read More...

Salcomp to Start Production at Former Nokia Plant in India

Salcomp to Start Production at Former Nokia Plant in India

CHENNAI, INDIA – The Nokia manufacturing plant that was sold to Salcomp last year after closing in 2014 over a tax dispute will be ready to ...  Read More...

«
»

FEATURES

Test Methods to Identify Counterfeit MLCCS

Test Methods to Identify Counterfeit MLCCS

Electrical and physical characteristics play a role in high-accuracy detection. Most multilayer ceramic capacitors (MLCC) have no marking and cannot easily be ...  Read More...

The Case for a 1.1mm BGA/CGA Package

The Case for a 1.1mm BGA/CGA Package

A marginally larger package would cut design times and improve PCB yields and performance. Most electronics engineers know there is no 1.1mm BGA or CGA package...  Read More...

5 Things for Better Program Transfer from Prototype to Volume

5 Things for Better Program Transfer from Prototype to Volume

Is manufacturing at scale a building block of your development plan? Beyond conception, bringing a new product to life is a challenge. From the saying that “h...  Read More...

SMTAI Women’s Leadership Program Shows ‘Drive’

SMTAI Women’s Leadership Program Shows ‘Drive’

Annual career development program features talks on automotive safety systems and quality. In the wake of Covid-19, SMTA International is virtual this year, a...  Read More...

Conformal Coating Challenges: Detection, Rework and Failure Analysis

Conformal Coating Challenges: Detection, Rework and Failure Analysis

A DoE shows optimal removal strategies with various package styles.  Read More...

Using Cross-Sectioning for PCB Assembly Qualification

Using Cross-Sectioning for PCB Assembly Qualification

While destructive, slicing can best x-ray for failure detection and analysis.  Read More...

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

Overcoming charges and decreasing risks introduced by humans or machines.  Read More...

New Requirements for SIR Measurement

New Requirements for SIR Measurement

Requirements for no-clean solder paste to increase device chemical, thermal and electrical reliability.  Read More...

«
»

PRODUCTS

Espec Rolls Out 4 New AR Series Environmental Stress Chambers

Espec Rolls Out 4 New AR Series Environmental Stress Chambers

Four new models of AR series environmental stress chambers for rapid-rate temperature cycling provide temp. cycling and humidity performance needed to validate ...  Read More...

Vishay Updates EP1 Wet Tantalum Capacitor

Vishay Updates EP1 Wet Tantalum Capacitor

EP1 wet tantalum capacitor has new ratings in B and C case codes.  Read More...

Würth Elektronik Introduces WE-MK Multilayer Ceramic Inductors

Würth Elektronik Introduces WE-MK Multilayer Ceramic Inductors

WE-MK multilayer ceramic inductors have resonant frequency > 10GHz.  Read More...

Emil Otto Debuts EO-MC-001 Liquid Flux

Emil Otto Debuts EO-MC-001 Liquid Flux

EO-MC-001 liquid flux can be mixed with water or alcohol and can be used for tinning process in electronics industry and mechanical engineering.  Read More...

Tektronix Rolls Out 6 Series B Mixed Signal Oscilloscope

Tektronix Rolls Out 6 Series B Mixed Signal Oscilloscope

6 series B mixed signal oscilloscope extends performance to 10GHz and 50GS/sec.  Read More...

Hitachi High-Tech Launches EA1400 XRF Analyzer

Hitachi High-Tech Launches EA1400 XRF Analyzer

EA1400 XRF uses detection technology coupled with x-ray optics designed for rapid screening of RoHS substances.  Read More...

BEST Delivers EZReball 6,000 Ball Count Reballing Preform

BEST Delivers EZReball 6,000 Ball Count Reballing Preform

EZReball 6,000 ball count BGA preforms consist of 4,000 solder balls on a 0.4mm pitch over a 45mm x 45mm package.  Read More...

Hirose Offers CX90B Series Connector

Hirose Offers CX90B Series Connector

CX90B series top-mount USB 2.0 Type-C connector has 16 contacts. Is reportedly ideal for applications susceptible to high-vibration and drop impacts, including ...  Read More...

Master Bond Offers EP21ARVLV Epoxy

Master Bond Offers EP21ARVLV Epoxy

EP21ARLV two-part epoxy may be used as adhesive, sealant, coating or encapsulant. Is capable of withstanding prolonged exposure to 70% sulfuric acid, 10% hydroc...  Read More...

«
»

PCB Chat

Tweets by Mike Buetow

Tweets by Mike Buetow