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NEWS

Foxconn Among Investors in Next-Gen Touch Controller Company

Foxconn Among Investors in Next-Gen Touch Controller Company

AUSTIN, TX – Foxconn is among a handful of investors pumping in $22 million to an Austin-based company that makes semiconductor and software...  Read More...

ZVEI Among Firms Starting Industrial Digital Twin Association

ZVEI Among Firms Starting Industrial Digital Twin Association

FRANKFURT – ZVEI is among 20-plus companies from the mechanical engineering and electrical industry to start the Industrial Digital Twin Ass...  Read More...

Sept. ECIA Survey Reveals ‘Renewed Surge’ in Supply Chain Health

Sept. ECIA Survey Reveals ‘Renewed Surge’ in Supply Chain Health

ATLANTA – Positive developments in both economic progress and battling the pandemic have buoyed the manufacturing world, including participa...  Read More...

Jabil Reports Fiscal Q4 Net Revenue Up 11%

Jabil Reports Fiscal Q4 Net Revenue Up 11%

ST. PETERSBURG, FL – Jabil reported fiscal fourth quarter net revenue of $7.3 billion, up 11.1% year-over-year.  Read More...

Georgia Tech Student Wins 2020 Charles Hutchins Educational Grant

Georgia Tech Student Wins 2020 Charles Hutchins Educational Grant

MINNEAPOLIS, MN – Chidinma Imediegwu, a graduate student at the Georgia Institute of Technology, has been selected as the winner of the 2020...  Read More...

Electronica India, Productronica India and MatDispens 2020 Will Not Take Place

Electronica India, Productronica India and MatDispens 2020 Will Not Take Place

BANGALORE – Due to Covid-19 in India and stringent travel restrictions, Electronica India, Productronica India and MatDispens 2020 have been...  Read More...

Report: Pegatron to Invest $1B in Vietnam

Report: Pegatron to Invest $1B in Vietnam

HANOI – Pegatron plans to invest $1 billion in Vietnam as part of a three-phase implementation of computing, communication and consumer prod...  Read More...

Katek Reports Sales Up 40% YTD

Katek Reports Sales Up 40% YTD

MUNICH – Katek Group reported sales growth of 40% for the first eight months of 2020.  Read More...

ASM PT in Talks to Go Private?

ASM PT in Talks to Go Private?

HONG KONG – ASM Pacific Technology is talking to potential investors to take the company private, according to reports.  Read More...

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FEATURES

Test Methods to Identify Counterfeit MLCCS

Test Methods to Identify Counterfeit MLCCS

Electrical and physical characteristics play a role in high-accuracy detection. Most multilayer ceramic capacitors (MLCC) have no marking and cannot easily be ...  Read More...

The Case for a 1.1mm BGA/CGA Package

The Case for a 1.1mm BGA/CGA Package

A marginally larger package would cut design times and improve PCB yields and performance. Most electronics engineers know there is no 1.1mm BGA or CGA package...  Read More...

5 Things for Better Program Transfer from Prototype to Volume

5 Things for Better Program Transfer from Prototype to Volume

Is manufacturing at scale a building block of your development plan? Beyond conception, bringing a new product to life is a challenge. From the saying that “h...  Read More...

SMTAI Women’s Leadership Program Shows ‘Drive’

SMTAI Women’s Leadership Program Shows ‘Drive’

Annual career development program features talks on automotive safety systems and quality. In the wake of Covid-19, SMTA International is virtual this year, a...  Read More...

Conformal Coating Challenges: Detection, Rework and Failure Analysis

Conformal Coating Challenges: Detection, Rework and Failure Analysis

A DoE shows optimal removal strategies with various package styles.  Read More...

Using Cross-Sectioning for PCB Assembly Qualification

Using Cross-Sectioning for PCB Assembly Qualification

While destructive, slicing can best x-ray for failure detection and analysis.  Read More...

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

ESD Concerns with PCB Assembly: Barcode Labeling and Masking

Overcoming charges and decreasing risks introduced by humans or machines.  Read More...

New Requirements for SIR Measurement

New Requirements for SIR Measurement

Requirements for no-clean solder paste to increase device chemical, thermal and electrical reliability.  Read More...

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PRODUCTS

ASM Updates DEK TQ Stencil Printer

ASM Updates DEK TQ Stencil Printer

DEK TQ stencil printer can operate for up to 8 hr. without operator assist.  Read More...

TT Electronics Introduces APC Series Thin-Film Chip Resistors

TT Electronics Introduces APC Series Thin-Film Chip Resistors

APC Series surface mount resistors have been qualified for use in environments exposed to sulphur-bearing gasses.  Read More...

Espec Rolls Out 4 New AR Series Environmental Stress Chambers

Espec Rolls Out 4 New AR Series Environmental Stress Chambers

Four new models of AR series environmental stress chambers for rapid-rate temperature cycling provide temp. cycling and humidity performance needed to validate ...  Read More...

Vishay Updates EP1 Wet Tantalum Capacitor

Vishay Updates EP1 Wet Tantalum Capacitor

EP1 wet tantalum capacitor has new ratings in B and C case codes.  Read More...

Würth Elektronik Introduces WE-MK Multilayer Ceramic Inductors

Würth Elektronik Introduces WE-MK Multilayer Ceramic Inductors

WE-MK multilayer ceramic inductors have resonant frequency > 10GHz.  Read More...

Emil Otto Debuts EO-MC-001 Liquid Flux

Emil Otto Debuts EO-MC-001 Liquid Flux

EO-MC-001 liquid flux can be mixed with water or alcohol and can be used for tinning process in electronics industry and mechanical engineering.  Read More...

Tektronix Rolls Out 6 Series B Mixed Signal Oscilloscope

Tektronix Rolls Out 6 Series B Mixed Signal Oscilloscope

6 series B mixed signal oscilloscope extends performance to 10GHz and 50GS/sec.  Read More...

Hitachi High-Tech Launches EA1400 XRF Analyzer

Hitachi High-Tech Launches EA1400 XRF Analyzer

EA1400 XRF uses detection technology coupled with x-ray optics designed for rapid screening of RoHS substances.  Read More...

BEST Delivers EZReball 6,000 Ball Count Reballing Preform

BEST Delivers EZReball 6,000 Ball Count Reballing Preform

EZReball 6,000 ball count BGA preforms consist of 4,000 solder balls on a 0.4mm pitch over a 45mm x 45mm package.  Read More...

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Tweets by Mike Buetow

Tweets by Mike Buetow