FLIR C5 compact thermal camera has built-in FLIR Ignite cloud connectivity and wi-fi features.
S3X70-G811 type 5 solder paste is for micro-pattern applications that can be reflowed in an air atmosphere.
GT90 and GT120 soldering systems use inductive heating technology and have adjustable temperature.
Hand squeegee stand improves handling of solder paste for mission-critical R&D and hand solder paste printing environments.
CalceSARA software uses physics-of-failure-based reliability principles to assess time to failure of part/system/failure site.
TR7007DQ Plus 3-D solder paste inspection is equipped with improved motion controller (EtherCat) and enhanced 2-D light module.