WS-829 for printing and pin transfer applications, including LED die-attach, can be used for ball-attach on substrate in a standard BGA process, especially for sphere applications <0.25mm, as well as wafer-/panel-level packaging.

Water-soluble and halogen-free. Cleans with DI water; cleans contamination or pad oxidation from processes before ball mount. Has high tackiness. Ensures consistent flux definition over long periods of time with minimal slump.

Ball attach image 1

Indium Corp.

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