WS-829 for printing and pin transfer applications, including LED die-attach, can be used for ball-attach on substrate in a standard BGA process, especially for sphere applications <0.25mm, as well as wafer-/panel-level packaging.
Water-soluble and halogen-free. Cleans with DI water; cleans contamination or pad oxidation from processes before ball mount. Has high tackiness. Ensures consistent flux definition over long periods of time with minimal slump.