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GenX-90P and GenX-130P large cabinet x-ray systems now accommodate PCB sizes up to 21" (533 mm) x 17.5" (445 mm) with oblique angle viewing up to 70°.
GoReflow-plus convection reflow soldering system has eight heating zones and active heated area of 2,980mm.
TR7700QE-S 3-D AOI inspects and detects defects in wire bonds, die bonds, SMD, bumps, wafer IC/chip, underfill, and solder joints.
Seho PlasmaFluxer uses cold-active plasma to melt micrometer-sized powder of adipic acid and deposit it on PCB.
MT-200 MiniTweez thermal tweezer is designed to rework tightly spaced micro-components such as 0201s, 0402s and 0603s.
Net Signal Wave (NSW) technology enables flying probe testing of PCBAs for large or small and single- or double-sided PCBs.
Multi-reflection suppression-enabled 3-D MX3000 final vision inspection system is for memory modules.