Berquist microTIM mTIM 1000 microthermal interface coatings dissipate heat.

5G device benchmarking toolset automates testing and reporting across device builds and models.

UMT-W pulse-proof SMD ceramic fuse has time-lag tripping characteristics. Is reportedly suitable as fail-safe device in demanding applications.

R&S TS8996 RSE test system measures radiated spurious emissions from 5G components in frequency ranges FR1 and FR2.

Box-shaped Sarcon thermal interface caps are available in standard sizes to fit many transistors and can be custom-ordered to exact specifications.

N9021B MXA X-Series signal analyzer offers an enhanced frequency sweep algorithm, accelerating test time improvements.

Minami MK-D100 screen printer has a new space-saving design (1230 x 1300 x 1400 mm).

S3X58-HF1000 halogen-free solder paste has stabilizers to inhibit oxidation-reduction reaction at room temp.

DM3NW series MicroSD connector enables smaller consumer electronic designs by reducing volumetric space by up to 15%.

R&S NGP800 power supply series includes two- and four-channel models.

XJTAG 3.10 boundary scan tool introduces automated method for dealing with design updates that occur on board being tested.

HP-520SII stencil printer includes three-zone conveyor, 2-D SPI, closed-loop squeegee pressure control, side snuggers/retractable top clamps, autowidth with programmable y axis stopper, easy-to-use GUI.