PF606-RT35 room temperature solder paste is designed for SMT processes.
No-clean paste reportedly provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. Has wide reflow window. Is Pb-free and has low melting point. Can be used to perform soldering with low peak reflow profiles in air or nitrogen atmospheres. Features excellent solderability, ICT testability and high-speed printability. Is suitable for pin-in-paste.