YRM20 chipshooter uses two head types: a high-speed, multi-purpose rotary head that, when combined with the high-speed feeder, delivers performance under optimal conditions of 115,000cph, as well as a one-head solution via inline (HM) head.

Design and test workflow reduces product development time for double-data rate dynamic random-access memory (DDR5 DRAM) systems.

Micro-Mini (SMP/SMPM) extreme frequency subminiature RF/coaxial push-on solderless PCB compression mount connectors are for high-frequency printed PCBs.

LX-1000 inline large-area optical inspection system offers 630mm x 630mm inspection area with single-or dual-sided imaging.

FlexiCoat EMI ultrasonic coating is designed for conformal spraying of EMI shielding material onto semiconductor packages.

Kyzen E5631 stencil cleaner is formulated to clean flux and uncured adhesives from stencils and misprints.

PCU-285 Spiral Viscometer is designed to measure solder paste viscosity.

Overlay assisted inspection is for digital camera inspection systems.

PQ50 series rugged high-power connector for industrial environments is available in lightweight plated plastic resin or Zinc die cast shell.

Master Bond EP30DPBFMed is a two-part, flexibilized epoxy-urethane hybrid for bonding, sealing, coating, and encapsulation.

KP13B Nano SIM card connector reportedly reduces required PCB mounting space by up to 26%.

IHDF-1300AE-10 through-hole inductor is comprised of an edge-wound coil. Features low loss ferrite core for high-performance designs with minimal AC power losses.