Viscom X7056-II BO inspects bond wires optically and radiographically in an inline system that reportedly ensures inspection of power semiconductors and encapsulated sensor elements.

With Microfactory, manufacturers can now deploy and operate automated assembly lines with fewer people.

Master Bond MasterSil 151S is a two-part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material.

CX90MW waterproof USB 3.2 Gen 1 Type-C connector is for applications that require miniaturization with resistance to liquid, vibration and/or shock.

MRSI-705 high-volume configuration 5μm die bonder offers horizontal turret feature to increase speed and throughput without sacrificing flexibility, accuracy, or reliability.

DryBox cabinet is designed to store and protect 3-D printing filaments in a humidity-controlled environment.

ICCON Block and ICCON Insert connectors address high current rating demands from high-speed board-to-board and board-to-busbar data communication applications.

Palomar 8100 automated, thermosonic high-speed ball-and-stitch wire bonder performs ball bumping and customized looping profiles.

VEMD4010X01 and VEMD4110X01 surface-mount automotive-grade silicon PIN photodiodes come in 0805 case size with 0.7mm profile.

DEK TQ stencil printer can operate for up to 8 hr. without operator assist.

APC Series surface mount resistors have been qualified for use in environments exposed to sulphur-bearing gasses.

Four new models of AR series environmental stress chambers for rapid-rate temperature cycling provide temp. cycling and humidity performance needed to validate quality and reliability for automotive, electronics and other products.