iSpector JUz CCI system is for automatic inspection of conformal coating and defect detection.

Delolux 504 LED lamp is for curing UV adhesives. Features UV LEDs that reportedly achieve 3x the intensity of previous model.

ER6006 and ER7006 Bio epoxy resins provide good flow characteristics to allow potting of difficult and complex geometries. ER6006 is two-part high thermally conductive epoxy encapsulation resin primarily developed for encapsulation of LED driver units.

Siplace SX pick-and-place machine has new placement head versions, a more powerful vision system, open interfaces for special feeders and new software functions.

Viscom X7056-II BO inspects bond wires optically and radiographically in an inline system that reportedly ensures inspection of power semiconductors and encapsulated sensor elements.

With Microfactory, manufacturers can now deploy and operate automated assembly lines with fewer people.

Master Bond MasterSil 151S is a two-part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material.

CX90MW waterproof USB 3.2 Gen 1 Type-C connector is for applications that require miniaturization with resistance to liquid, vibration and/or shock.

MRSI-705 high-volume configuration 5μm die bonder offers horizontal turret feature to increase speed and throughput without sacrificing flexibility, accuracy, or reliability.

DryBox cabinet is designed to store and protect 3-D printing filaments in a humidity-controlled environment.

ICCON Block and ICCON Insert connectors address high current rating demands from high-speed board-to-board and board-to-busbar data communication applications.

Palomar 8100 automated, thermosonic high-speed ball-and-stitch wire bonder performs ball bumping and customized looping profiles.