HiTech CF31-4010 is a one-component, high filler content, heat-curable cornerfill.

HiTech CU21-3240 and CU31-2030 are one-component capillary underfills designed to protect assembled chip packages on printed circuit boards.

18KLF solder recovery system has a 40lb pot.

Low-ESD polyimide masking tape has width options ranging from 0.125" to 3.000".

High-precision TR77000QM SII 3-D AOI has 5.5µm high-res 12mp imaging technology for semiconductor and packaging industry and other industries.

RMCP thick-film chip resistor with high power capability now comes in resistance values up to 10mΩ.

OM-372 Pb-free, no-clean solder paste is designed to provide ultra-high electrochemical reliability on fine-pitched, low-standoff components.

Ant-i2 offline selective soldering machine is designed for high-volume offline production for small printed circuit boards and good flexibility for large PCBs.

D.FL75 75 ohm, 4K/UHD transmission coaxial connector supports 12G-SDI standard and SMPTE ST 2082-1.

IPC-CFX Self-Validation and Equipment Qualification System is a cloud-based test bed for equipment vendors and manufacturing facilities to self-validate CFX messaging.

FH72 flexible printed circuit connector has single-action lock for portable electronic applications.

800G test systems are for validating electrical and optical interfaces to speed development of data center technologies.