RED-E-SET board support reportedly can reduce component damage caused by misaligned bottom-side board support tooling or placement pressures. Is for screen printers, dispensers and automated assembly machines. Can reportedly be configured in fewer than three minutes. Is said to provide zero defects; eliminates board flex using a spring-loaded support pin system.

Production Solutions Inc., www.production-solutions.com

SE500 3-D solder paste inspection system inspects assemblies with a >70 cm²/sec. inspection speed. Can inspect pad sizes down to 01005. Has two models that accommodate different panel sizes. Features a conveyor that can transport panels from 50 x 50 mm up to 510 x 510 mm. SE500X can transport panels from 100 x 100 mm up to 810 x 610 mm. Features for both models include automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using the sensor, and Process Tracker SPC charts with alarm capability.

CyberOptics Corp., www.cyberoptics.com

Friendly green wipes are low-linting, absorbent, soft and said not to scratch. Are for light duty tasks and delicate surfaces. Are chemical extractables made of 100% recycled cellulose. Come as single-ply wipes measuring 15 x 16.6" or 4.4 x 8.3". Presaturated version removes non-reflowed solder pastes. Are biodegradable and made of cotton non-woven fabric. Feature easy-release dispenser for one-at-a-time dispensing.

High-Tech Conversions, www.high-techconversions.com, www.friendlygreen.org

The 10W x-ray tube is said to have submicron feature recognition. Uses sealed-transmissive x-ray tube technology, providing user-selectable choice of 100 nm feature recognition at up to 4W across the tube kV range. Reportedly offers x-ray flux at the best resolution; ideal for imaging slight density variation and for improved computerized tomography analysis. Is available in XD7600NT100 digital x-ray inspection system, which can be equipped with CT providing 3-D modeling, measurements and virtual microsectioning of solder joints; said to be suited for analytical analysis of solder interconnections for stacked die, MEMS, package-in-package and package-on-package.