Model 27E magnet wire stripper is designed to strip magnet wire, coils and resistor leads to within 0.031" from the component body. Rotating slotted stripping insert removes the film insulation. Strip lengths with stop rod installed are up to 0.625" or up to 2.87" with stop rod removed. Changes easily for various wire gauges and available in tool steel or carbide. Optional P/N 1939D Flexible Shaft Assembly; converts from benchtop to portable unit, capable of processing leads on heavy coils.
Carpenter Manufacturing Co. Inc., www.carpentermfg.com
Supra-E AOI uses iPro and comes standard with a 5-MP camera with Tri-Color illumination. Has resolutions between 7 and 17 µm; is capable of inspecting 01005 components to solder joint level. Is capable of board handling of 20 x 18". For low- to high-volume and low- to high-mix environments. Can reportedly be placed at any position in the production line without configuration changes. Programming times said to be 10 to 90 min.
Machine Vision Products Inc., www.machinevisionproducts.com
SMP200 Screen Printer includes precision stencil-to-board vision alignment for paste deposition and automatic PCB conveyor width adjustment to reduce setup and changeover time. A PCB alignment and clamping system coupled with advanced stencil separation control compliment the auto-leveling squeegee head system. Is said to have three-sigma accuracy. Has integrated under-stencil stencil wiping system with wet/dry/vacuum capability and second post-print inspection system.
Samsung Techwin, www.samsungtechwin.com
Dynatech Technology, www.dynatechsmt.com
LE40V automated pick-and-place machine is for prototyping and short run, high-mix manufacturing. Uses Cognex Vision. Provides on-the-fly component centering with top and bottom cameras, fiducial correction, bad board mark and pattern recognition. Reportedly provides accurate placement of 0201s, µBGAs, CSPs and 0.015 fine pitch QFPs at up to 3000 cph with ±0.001" placement accuracy. Includes self-contained vacuum.
APS Novastar, www.apsgold.com
SS4/ST4 series narrow body, super fine pitch low-profile board-level interconnects have a 4 mm wide socket strip and 5 mm wide terminal strip, with 0.4 mm pitch. Standard mated stack height is a low profile 4 mm from board-to-board with a choice of applications specific heights from 4.5 mm to 6 mm. Available with up to 40 positions per row in a double row design and rated at 7 GHz in single-ended and 4.5 GHz in differential pair configurations when mated.
Samtec, www.samtec.com