BPWin 5.0 software platform has intellectual property protection, featuring BPWin job protection. Enables viewing and editing only with password, and permits full control of programming parameters. Additional features include COM serialization – external serialization server and a free serialization software development kit; process monitoring and control features automation control and supports SPC, verification, auditing and logging; process monitoring permits customer-defined functionality. Has software version control with BPWinLauncher. Device programming features a NAND management utility and data pattern compression. Has JobMaster integrity check, enhanced buffer utilities and an image format tool.

BPM Microsystems, www.bpmmicro.com

Universal holder and blade assemblies are available to fit the following SMT printing equipment: Yamaha, Tenryu-Sieki, Hitachi, Milara, Speed-Print, Samsung, Misuzu and Minami. Feature lightweight design, sliding paste retainers, and flat, secure screw locking of blade. Options include colors (-red, -blue, -green or -silver) and squeegee angle.

Transition Automation Inc., www.transitionautomation.com

Zebra Gold 8000 Series elastomeric connectors reportedly provide excellent board-to-component electrical contact for broad-ranging commercial and military applications. Deliver current carrying capacity of 250-500 mA amps per wire; exhibit electrical resistance of 25-50 milliohms. Are constructed from a low durometer silicone core covered with parallel rows of flat, gold-plated conductors ranging from 100 to 166 wires per inch. Pad spacing as close as 0.020" centers.

Fujipoly America Corporation, www.fujipoly.com

Therm-A-Gap T652 thermally conductive dispensable gap filler is a fully cured, single-component material suitable for filling variable gaps between multiple components and a common heatsink. Has a high thermal conductivity of 3W/m-k and an operating temperature range of -50ºC to +150ºC. Applications include automotive ECUs, electrical drives, light-emitting-diode modules and power semiconductors. Is conformable at low assembly pressures and is said to be suitable for providing a filler for gaps between 0.2 mm and 4 mm. Is RoHS-compliant and has a shelf life of 18 months. Can be applied manually using a syringe or via automated processes. Package sizes range from 10 cc syringes to 5 kg pails.

Chomerics, www.chomerics.com