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EMAX 903 is a UV/visible light cure, solvent-free conformal coating with a secondary moisture cure mechanism. Dual-cure system is said to ensure complete cure in PCB protection applications where shadow areas on high-density circuit boards are a concern.  Fluoresces vivid blue for black light inspection. Is compliant with RoHS and is MIL-I-46058C and IPC-CC-830B listed and UL 94 V0 approved. 
 
EMAX 904-Gel-SC and EMAX 904-T-SC are high-strength UV/visible light-curing adhesives formulated for securing vulnerable components on circuit boards. Feature Dymax See-Cure technology to monitor curing process. Uncured adhesive is tinted blue; curing changes the adhesive to colorless. EMAX 904-Gel-SC is a non-slumping adhesive for use in applications where post-dispense flow is undesirable. EMAX 904-T-SC is a viscous, flowable adhesive for applications where controlled adhesive flow after dispensing is preferred. Both are single-component materials and compliant with RoHS.
 
Ellsworth Corp., www.ellsworth.com
 
 
This hardware-based mask limit testing application is for general-purpose oscilloscopes. Is said to help test hardware in seconds; is reportedly ideal for engineers working in manufacturing and R&D who need to validate the quality and stability of electronic components and systems. Offers a sustained test rate of up to 89,000 pass/fail mask tests per sec. Maintains a waveform update rate of 100,000 waveforms per sec., decreasing test time to 3.3 sec. Is available as part of InfiniiVision 5.2 software.
 

The Weller WD1000HPT soldering station consists of the WP120 soldering iron, WD1M power unit and WDH10T safety rest. The iron combines a heating element with a replaceable soldering tip. The power unit is a microprocessor-controlled device with a number of built-in functions; is reportedly suited for use in production, rework and laboratory environments. Iron setbacks for time and temperature can be programmed and are automatically activated when the soldering iron is placed into safety rest. When the iron is removed from the rest, tip temperature is said to be restored immediately to the set working level. Is reportedly ideal for soldering on circuit boards with heat sinks that cause dissipation and heat transfer. Target applications include high-density circuit boards, high frequency/radio frequency applications and solar panel production.
 
Cooper Tools, www.coopertools.com
The TS7000 Interchangeable Material Path Series Rotary valve is based on the technology of TS5000 Series Rotary Microvalve. Is designed with “dead fluid volume” field replaceable feed screw/cartridge assembly, interchangeable with TS5000DMP feed screw auger inserts, flexible motor, syringe and a needle mounting option. Is available in three feed screw auger sizes (16-pitch, 8-pitch and high output 8-pitch), all made of precision hardened steel. An encoder motor version is available for applications requiring closed-loop motor control with encoder feedback. Is said to provide fast, repeatable dispensing of medium- to high-viscosity fluids and pastes. Typical applications include small-dot dispensing of dispensable-grade solder pastes, silver epoxies, surface mount adhesives, dispensing beads of structural adhesives, cavity and cam filling, and glob top dispensing.
Techcon Systems, www.techconsystems.com

A How-To training series on the most common PCB repairs is available on CD and includes 10 repair teaching videos. Demonstrates common procedures on how to repair common physical damages seen on PCBs. Includes demonstrations of techniques in PCB pad, trace, eyelet, laminate, corner, mask and other repairs. Features multiple camera angles and clear voice instruction. Sold individually or as a set.
 
BEST Inc., www.solder.net
Ablestik brand die attach materials known as self-filleting die attach use capillary force to control flow and deliver complete wetting. A dot is deposited and the die placed; capillary force then draws it out to the edge of the die where it forms a small fillet. No excessive placement force is said to be required. Available in Ablestik AAA3300 non-conductive paste for die to substrate laminate-based devices; Ablestik AAA3320 non-conductive material for die to die attachment, and Ablestik 3900 conductive adhesive designed for die to substrate leadframe packages.
 

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