The Wrist Strap and Ground Monitor 773 is said to provide effective workstation monitoring in applications with two metal ground requirements. Grounds and monitors two operators and monitors two metal grounds. Measures ground impedance in automated tools while in operation. Has real-time communication and audio alarm, for immediate shut down should impedance values exceed facility standards. Is miniature, easy to install and unobtrusive on the product floor. ANSI/ESD S6.1 and ANSI/ESD S20.20 compliant.
3M Electronic Solutions Division, www.3mstatic.com
The Easy Flow Blue Pistonis part of the 700 Series premier dispensing line, has close tolerances to fit neatly inside the syringe barrel, ensuring consistent fluid deposition. Prevents air entrapment within dispensed fluid, reportedly providing drip-free dispensing and improved repeatability. Is silicone- and chloride-free, and comes in bulk quantity and packs of 50 pieces.
Techcon Systems, www.techconsystems.com
Hysol UF3800 is said to provide room temperature fast flow, low temperature cure and reworkability. Is for use with CSPs and BGAs; is suited for handheld communication and entertainment applications. Is halogen-free, with less than 900 ppm chlorine and bromine. Is compatible with a variety of Pb-free and halogen-free solder pastes. Offers a high glass transition temperature. Reportedly offers stable electrical performance under temperature humidity bias.
Henkel, www.henkel.com/electronics
Cobar MCI-2330 is a stencil-cleaning agent for removal of solder paste and adhesive residues from all types of stencils. For used in immersion and ultrasonic cleaning equipment for removal of paste or flux residues on stencils and assemblies. Is nonhazardous and has a low odor.
Balver Zinn Group, www.balverzinn.com
Cobar Europe, www.cobar.com
Araldite EP1000 A/B epoxy adhesive is a two-part, thixotropic paste with a convenient 2:1 mix ratio and low viscosity that accommodates handling. Comes in dual-barrel cartridge mixing kits for waste-free application. Cures at temperatures ranging from ambient to 212ºF. Achieves a stable maximum Tg after gelling at room temperature, followed by a mild heat cure. Requires no autoclave cycling. Reportedly has high lap shear strength and good peel strength.
Huntsman Advanced Materials, www.huntsman.com/advancedmaterials