RO-VARIO reflow and curing oven is expandable up to 14 zones. Is designed in modular system. Can be used as full convection reflow oven, IR curing oven with special slow forward feed, or UV hardness system. Optional transport systems. A mesh belt has an operation width of 600 mm; can be configured with pin chain drive or as chain over belt. Up to five separate tracks can be fed through the oven at the pin chain drive. Chain profiles can be configured as center supports. All tracks and/or center supports adjusted individually and automatically to various transportation widths. Parallelism of the individual tracks reportedly is ensured for 14 zone ovens. Heating chambers have been redeveloped and are floating mounted.
 
Essemtec, www.essemtec.com 
 

Sarcon SPG-15A form-in-place thermal interface compound now comes in 30 and 50cc pneumatic syringes, said to permit faster and more accurate dispensing. The single-component gap filler compound offers near-zero compression force with conformability. Is reportedly ideal for filling gaps around PCB solder points. Requires no heat curing; will not cause corrosion on metal surfaces, and maintains all initial properties across a temperature range of -40° to + 150°C.
 
Fujipoly America Corp., www.fujipoly.com
 

XSD Series desiccant cabinet is said to reduce device drying times by as much as 75%. Deploy self-regenerating desiccant. Zeolite drying unit is said to achieve humidity levels under 0.5% RH. Cabinets are heavily insulated, reportedly consume a fraction of the energy of baking or vacuum ovens, and are equipped with precision measurement, 24/7 data logging and an ergonomic touch-screen operator interface. Is reportedly proven to dry components at speeds competitive with traditional methods, without oxidation problems associated with traditional baking. Designed to exceed J-STD-033B requirements for handling moisture sensitive devices.
 
Totech Super Dry, www.superdry.info 
 

HM-2520 is a neutral-cure, low-VOC sealant that enables parts to be moved immediately upon application. Has a tensile strength of 700 psi and service temperatures ranging from -50° to 300°F (-45° to 150°C). Is formulated for automated assembly. Is said to combine the immediate green strength of a hot melt adhesive with the long-term performance of a reactive silicone sealant and improved resistance to movement during cure and at high temperatures under load.
Dow Corning, www.dowcorning.com