RF741 No-Clean Gel Flux, for electronics component rework and repair applications, is high viscosity and has a gel-like consistency. Is said to be easily applied by syringe dispensing. Stays in place until soldering. Is compatible with most no-clean chemistries and leaves solder joints bright and shiny after reflow. Is classified as ROL0 per J-STD-004 and Bellcore GR-78 compliant.

Easy Spheres, www.easyspheres.com

DSP 866 no-clean, Pb-free solder paste reportedly has 0% ppm total halogens and comes in a variety of alloys. Has flux classification of ROL0 per J-STD-004. Exhibits excellent printing characteristics and will perform during continuous printing for up to 8 hr. Abandon time of at least 1 hr. said to be is possible. Characterized by brick-like prints. Good release seen on 0.0012 to 0.0009 apertures with print speeds in the range of 1" to 6" per sec. Has nonconductive, noncorrosive and highly insulated residues. Nitrogen not required.

Qualitek International, www.qualitek.com

FLX2011-MK now comes with with a dual dispensers. One, a jet valve dispenser, for 0603 or smaller surface mount components and LEDs on flexible circuits, is said to quickly and accurately dispenses small glue dots, and is contactless. Also has Archimedean screw type for dispensing solder paste or conductive adhesives; or time/pressure dispenser, Piezoflow valve or jet valve, depending on the specific application.

Assembly head features optical centering system that can align SMD components, LEDs and metal domes, permitting flexible circuit production all on one system. Foils are held in position by a vacuum table. Working area is 500 x 300 mm; support area is 800 x 300 mm. Smaller foils can be clustered and be produced like a single foil. Integrated vision system automatically finds reference marks and corrects offset and distortion.

Essemtec, www.essemtec.com

Static pressure soldering technology is for Pb-free soldering large, high-density products. Enables Pb-free (SnAg3.0Cu0.5) soldering for products up to 490 x 510 mm in size and 6 mm in thickness. Ensures a decent soldering fill without damaging the PWB; enables partial soldering for insertion components.
 
OKI, www.oki.com