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The ECO-300 is a small-footprint Pb-free wave solder machine with a 220-lb. titanium solder pot. Reportedly has half the customary solder startup costs of comparable large-pot machines; consumes 40% less energy than single-wave systems. Is just over 8 ft. long. Features include a transducer-controlled pump motor, an automatically re-circulating adjustable titanium finger conveyor for board widths to 11.8", along with a 32" preheat zone with stainless steel sheath-type IR heaters.

F377 SnPb solder paste is said to have wide print and reflow process windows, and has low sensitivity to humidity. Is no-clean, and voiding exceeds IPC Class 3 in typical applications. Has a reported 8-hr. stencil life.
 
F555 Water Wash solder paste, for thick-film hybrids, incorporates activators said to be compatible with the glass, resulting in superior adhesion. Comes in Sn62 and Sn63 alloys.
 
Japan Unix UM-118 Centrifugal Mixer/Defoamer can be used for solder paste, semiconductor materials, solar pastes, epoxies and other materials. Is programmable for duration, cycle profile and up to 1500 rpm centrifugal speed, as well as internal rotational speed. Mixing of materials and defoaming is said to have cycle times half those of conventional mixers. PC-controllable, and has traceability of every program.
 
Japan Unix/Christopher Associates, www.christopherweb.com
 
The Small Part Vacuum Tweezer Kit is for parts as small as 200 µm. Is a general-purpose vacuum handling tool that plugs directly into 110V 50/60 Hz (220V units available). Said to handle a variety of optics, ball lenses and SMT parts, including 0.008"-sized parts, without damage. Long-life diaphragm vacuum pump generates up to 10" of mercury with an open-air flow of 2.3 lpm. Connects to ground automatically with a three-wire power cord. Other features include a push-button release vacuum pickup handle, 5 ft. of coiled vacuum hose, rubber no-skid feet, and a side-mounted handle holder.
  
Virtual Industries Inc., www.vacuumtweezer.com, www.virtual-ii.com  
aSPIre-2 is a fully automated inline solder paste inspection system said to deliver 100% 3-D inspection quickly and accurately. Includes SPC Plus analytical tools and hardware. Processing speed is reportedly up to 50% faster than previous systems. Has 4-axis projection; 3-D volume measurement; short programming time; greater configurability and flexibility; enhanced PCB warpage compensation, and no PCB color sensitivity.
 
Koh Young Technology, www.kohyoung.com

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