FT Series digital infrared sensors are for non-contact detection of surface temperature. Have a broad IR spectrum and temperature sensing range from 32 to 2462ºF. Measure IR from distances of up to 3000 mm; sensor head can be mounted far from harsh environments. An optional air purge enclosure eliminates dust buildup. Amplifiers can be panel-mounted for temperature viewing and setup, or cabinet mounted on a DIN rail. Have a high-speed response of 10 ms. FT-H10 sensor is ideal for thin, fast-moving targets, including heat seals, hot melts, heat-treated or hot-formed parts. Analog output (4 mA to 20 mA) can be scaled to a user-defined range. Up to four sets of discrete upper and lower-limit outputs and emissivities can be stored.

Keyence, www.keyence.com/ft

The SonoLab division is now offering a service that provides enhanced acoustic microscope imaging of stacked die assemblies. The service, available immediately, uses the firm’s software, which images die stacks for internal defect analysis. It can assign a defect or other feature to a specific layer within the stack. Sonoscan develops and manufactures acoustic microscopes and acoustic micro imaging systems.

Sonoscan, www.sonoscan.com

HTCX and HTCPX thermal management solutions are enhanced versions of HTC and HTCP. Feature improved thermal conductivity, lower oil bleed, and lower evaporation weight loss. Have been specially formulated by using a proprietary additive to provide a significant increase in thermal conductivity without sacrificing viscosity, consistency or film thicknesses. HTCPX uses various metal oxide (ceramic) powders; reportedly ensure leakage currents cannot be formed if the paste should come into contact with other parts of the assembly. Both contain no silicones and cannot migrate onto electrical contacts.

Electrolube, www.electrolube.com

Rapid Prototyping Services are designed to support the need for faster validation of IC and package designs and speed the transition to full production. Specifically developed to address prototype speed, offering a path to rapidly validate ASIC designs by providing access to advanced interconnect capabilities. Within the medical, communications, defense and measurement markets, three services levels were identified for rapid prototyping-BGA build-to-print, advanced build-to-print and process evaluation build. Entry-level prototyping is offered via BGA build-to-print, assembling JEDEC-standard BGAs in as little as three business days.

Maxtek Components Corporation, www.maxtek.com