The Y.Cheetah combines x-ray technology with high-speed flat panel detection. Features synchronized tube and detector motion for constant image contrast at high resolution. Repositions imaging components at constant magnification for higher contrast and power, lower noise, or fast imaging and 3-D scanning. Both are one-click steps. Offers 2-D to high-speed 160 kV, 64W microfocus computed tomography (µCT). Inspection area is 18" x 16" (460 x 410 mm) and can be viewed at ±70° even at the highest geometric magnification.

Yxlon International, www.xylon.com

GoSelective selective soldering system now comes with a fiducial recognition function with automatic PCB alignment. Registers PCB to be soldered optically and compensates for various types of misalignment such as offset, rotational error and linear shrinkage within the PCB. Wrongly placed PCBs are detected and are not soldered. Up to three fiducial marks are selected in a learning procedure. Captures images of these fiducials and memorizes their location. The machine moves to the previously memorized positions automatically and captures PCB image. The correlation between this actual live image and the learned image is calculated and gives a correction value for each fiducial. Can then calculate offset, rotation and linear shrinkage of the PCB compared to the board used for the learning procedure. Generates a position correction for each production board. Contains an error-proof function that checks the loading of the correct soldering program and controls each board for positioning.

SEHO Systems, www.seho.de

 

LMF Series Fiber Laser Markers are capable of making contrasting marks on plastics, and annealing and engraving metals. Pulse waveform of LMF2000 reportedly makes the marker the ideal tool to make fine cuts in copper, steel or aluminum up to 0.02" thick. Enables prototyping of lead frame, other featured sheet parts or steel tubes. Can be used to modify an existing design. Uses no direct assist gas. Can be tuned for speed and quality with an underside burr of less than 0.0005".

Miyachi Unitek, www.muc.miyachi.com

The VT-S700 inline AOI system uses a telecentric lens with a 2-MP camera. Is said to reduce image distortion and improve inspection accuracy at the edges of large field-of-view. Delivers inspection of up to 10 µm for components as small as 01005 and down to -0.012" pitch. Uses three-color highlight system that illuminates PCB in a 360° dome. 3-CCD camera enhances solder shape recognition accuracy. Other features include color-enhancing capability, integrated graphical user interface and logic customization. Optical character verification is available. Resolution can be selected for 10, 15 or 20 µm. Separate models are available to handle 10 x 13" and 18 x 20" boards.

Omron Electronics, <!-- /* Style Definitions */ p.MsoNormal, li.MsoNormal, div.MsoNormal {mso-style-parent:""; margin:0in; margin-bottom:.0001pt; mso-pagination:widow-orphan; font-size:12.0pt; font-family:"Times New Roman"; mso-fareast-font-family:"Times New Roman";} a:link, span.MsoHyperlink {color:blue; text-decoration:underline; text-underline:single;} a:visited, span.MsoHyperlinkFollowed {color:purple; text-decoration:underline; text-underline:single;} @page Section1 {size:8.5in 11.0in; margin:1.0in 1.25in 1.0in 1.25in; mso-header-margin:.5in; mso-footer-margin:.5in; mso-paper-source:0;} div.Section1 {page:Section1;} --> www.omron247.com