Automatic Contactor Cleaning, for MT9510, cleans fast and without manual interruption of the handling process. Is fully automated and software-controlled, and requires no opening, undocking, or downtime of the handler during operation. Permits user-defined cleaning cycles. Requires no modifications to the handler base unit, and is said to be easy to install into any existing MT9510 and MT9510XP equipment.

Multitest, www.multitest.com/MT9510

Galaxy Thin Wafer System offers process capability of Cp>2 @ +/-12.5 µm. A wafer pallet secures wafers as thin as 75 µm during transport and processing. Is approximately 400 mm²; is flat to less than 10 µm; can accommodate wafers as large as 300 mm. Can be held securely while being processed DirEKt Ball Placement, DirEKt Coat wafer backside coating, protective coating imaging, thermal interface materials deposition, wafer bumping and encapsulation. DirEKt Coat process for deposition of 25 µm thick die attach adhesives and other coatings now has process capability of Cp>2 @ +/-12.5 µm and a total thickness variation of 7 µm on 150 µm wafers up to 200 mm in diameter. Said to be capable of first-pass yield ball placement of 200 µm spheres at 3000 µm pitch, thermal interface materials deposition and wafer bumping.

DEK, www.dek.com

Kaleido high-resolution color head enhances definition at the repair station; enabling decisions based on the defect picture. Inspects solder joint and lead defects. With i-lite technology, a color-enhancement solution at the defect viewer station is offered; can see 01005 components, as well as associated solder joint. RGB lighting structure enables rendering of color picture.
 
Vi Technology, www.vitechnology.com