The first conformal coating interactive CD-ROM provides a guide to the use of coatings, their application processes, product benefits, inspection and quality control. Permits users to see defect coating application and user defects. Features engineers answering common questions on coating processes, process defects and quality control in manufacture; features six experts and contributors to national and international standards on coating with IEC and IPC. The first 20 companies to order will receive a set of inspection and quality control wall charts on conformal coating for shop-floor display. 

www.bobwillis.co.uk/videoclips/coatingcdrom.wmv

HyperBGA now packs more power and density with the addition of signal layers, enabling semiconductor devices to run at digital signal speeds surpassing 12 Gb/s. Is said to offer the longest flip-chip BGA life available and outperforms ceramic BGA packages by delivering up to 10 times the reliability. Is made from PTFE material, reportedly eliminating BGA wear out, die cracking, delamination or flip chip bump fatigue. Is assembled using standard SMT processes and materials. Is capable of flip chip, SMT or CSP component attach on both sides. Is Pb-free assembly compatible.

Endicott Interconnect, www.eitny.com

Safewash Total is a blend of nonflammable solvents that form a micro-emulsion when mixed with water. Is for cleaning pastes and adhesives from screens, stencils, circuit boards and accessories and general degreasing applications. Is a low foam cleaner, suitable for use in dishwashers, inline pressure systems, ultrasonics and spray under immersion applications. Comes as a concentrate. Has a corrosion inhibitor allowing for the safe cleaning of sensitive metals, including copper and aluminium. Is surfactant-free, and easy to rinse. Has low toxicity, VOC, odor and foam.

Electrolube, www.electrolube.com

Gold-Tin die attach solder paste can be reflowed in nitrogen environments with up to 200 ppm oxygen. Aurum 2 uses a special treatment to improve the wetting of eutectic 80-20 AuSn solder powder. The flux component of the solder paste remains the same; no requalification testing is needed. Is halide-free and can be applied by stencil printing or dispensing.
 
Heraeus, www.heraeus-contactmaterials.com