New Products
SMP200 Screen Printer includes precision stencil-to-board vision alignment for paste deposition and automatic PCB conveyor width adjustment to reduce setup and changeover time. A PCB alignment and clamping system coupled with advanced stencil separation control compliment the auto-leveling squeegee head system. Is said to have three-sigma accuracy. Has integrated under-stencil stencil wiping system with wet/dry/vacuum capability and second post-print inspection system.
Samsung Techwin, www.samsungtechwin.com
Dynatech Technology, www.dynatechsmt.com
LE40V automated pick-and-place machine is for prototyping and short run, high-mix manufacturing. Uses Cognex Vision. Provides on-the-fly component centering with top and bottom cameras, fiducial correction, bad board mark and pattern recognition. Reportedly provides accurate placement of 0201s, µBGAs, CSPs and 0.015 fine pitch QFPs at up to 3000 cph with ±0.001" placement accuracy. Includes self-contained vacuum.
APS Novastar, www.apsgold.com
SS4/ST4 series narrow body, super fine pitch low-profile board-level interconnects have a 4 mm wide socket strip and 5 mm wide terminal strip, with 0.4 mm pitch. Standard mated stack height is a low profile 4 mm from board-to-board with a choice of applications specific heights from 4.5 mm to 6 mm. Available with up to 40 positions per row in a double row design and rated at 7 GHz in single-ended and 4.5 GHz in differential pair configurations when mated.
Samtec, www.samtec.com
FMPS/FMPT is a hinged, 25A version of the PowerStrip/25 family. Is for blind mating or tight PCB real estate applications. Permits 90° or horizontal (planar) board-to-board interfaces and a 90° mating radius. Can be mated at an angle convenient for production and rotated to the permanent required orientation. Comes with up to 8 power pins on 0.200" and achieves a current rating up to 25A per contact at 75°C. Locking clips and screw down configuration for the socket are optional.
Samtec, www.samtec.com
Ultra IV AOI system large format inline AOI inspects boards up to 20 x 24". Comes standard with a 5-MP camera with Tri-Color illumination. Has resolutions between 7-17 µm; is capable of inspecting 01005 components to solder joint level. Can be configured for multiple positions in the production line, including 2-D/3-D paste inspection, pre- and post-reflow, or wave solder. Is capable of metrology-based reporting. iPro software permits programming times within 10 to 90 min.
Machine Vision Products, www.machinevisionproducts.com
The Zero Point Clamping System is a quickchange fixture that combines ease of alignment, accurate positioning, and high clamping forces with hydraulic or pneumatic actuation. Is said to reduce machine setup procedures into one step. Unlocking and removing the clamping device is simpler; the system eliminates the need to search for the bore. Is compact but reportedly provides holding and pull-in forces. Balls are 784% larger than those used in competitive locking systems. Balls roll freely in the form-fitting ball channel. Stainless steel components.
Jergens Inc., www.jergensinc.com
