Siplace Feeder Manager software alerts users to the condition of feeders, locates them in the factory, and controls the entire on-site feeder inventory. Data can be used by Siplace Feeder Care Packages for X-feeders and S-feeders. Include test stations for functional tests and error analysis, and special tooling. Reportedly displays easy and clear instructions for maintenance intervals, test and repair instructions, and each feeder’s history.
Siemens Electronics Assembly Systems, www.siplace.com.
Polyimide stencils for PCB rework are designed stay in place and can accommodate space/traces down to less than 1 mm. Standard stencil thicknesses are 0.004" and 0.008" with an aspect ratio of 1:1. Are designed to peeled away from their adhesive backing and be permanently placed onto the PCB site area to be reworked. Are cut with high-precision lasers. Said to eliminate problems of keeping the stencil in contact with the PCB, releasing the stencil from the board, and cleaning. Have 1:1 aspect ratios and are said to print solder paste consistently. Come in packages of 10.
BEST Inc., www.solder.net
ECD, www.ecd.com
Sarcon GR-H and XR-H thermal interface gap pads are said to simplify board-level maintenance by reducing material tearing during disassembly for rework and repair. Are manufactured with a hardened top surface. One-sided surface treatment is less tacky than the opposing contact side, permitting the thermal pad to consistently adhere to the electrical component or opposing heat sink. Release from component without tearing or damage. Are available in eight different formulations; offer thermal conductivity from 1.2 to 17.0W/m°K. Sarcon Hardened Surface conforms to uneven components. Gap fillers are available in sheets with thicknesses from 0.5 to 5.0 mm to 200 x 300 mm.
Fujipoly America Corporation, www.fujipoly.com