Circuits Assembly Online Magazine - New Products

New Products

Ablestik brand die attach materials known as self-filleting die attach use capillary force to control flow and deliver complete wetting. A dot is deposited and the die placed; capillary force then draws it out to the edge of the die where it forms a small fillet. No excessive placement force is said to be required. Available in Ablestik AAA3300 non-conductive paste for die to substrate laminate-based devices; Ablestik AAA3320 non-conductive material for die to die attachment, and Ablestik 3900 conductive adhesive designed for die to substrate leadframe packages.

Henkel Corp., www.henkel.com/electronics

This site offers new features and updated information about services and solutions, as well as information about the company’s portfolio of desktop and inline AOI products. The site features customer testimonials, articles, video news clips and a customer service section dedicated to support. Information about upcoming events and recent industry awards is also included.

Mirtec, www.mirtecusa.com

The Unicon 108XL high-power soldering iron is for high mass soldering applications, including printed circuit assembly, industrial and solar cell manufacturing. Is available in 150 and 300 W versions. Uses a high mass soldering tip. Features are said to include precision control, fast recovery time, and the ability to use solder wire up to 2 mm diameter.

Christopher Associates, www.christopherweb.com

LPKF Stencil Laser P 6060, for SMT stencils production, is fully enclosed. Uses a lightweight motion system said to permit excellent positioning accuracy, while maintaining high cutting speeds. Can cut all stencils, both framed and frameless; can be adjusted to fit any stencil size up to 29.1" x 37.4". Requires minimum setup. Features a fiducial camera for automatic reload. Can cut with compressed air and oxygen. Can be remotely serviced via Internet.

LPKF Laser & Electronics, http://www.lpkfusa.com

The RO06-PLUS batch oven offers Pb-free soldering capability and curing programs with durations up to 18 hrs. Features integrated microprocessor control and fully automatic processing. Applications include prototyping, small batch manufacturing and testing. Integrated microprocessor control provides a large set of predefined soldering and curing programs. Includes free memory for other temperature profiles; temperatures up to 300°C can be stored. Large-view window permits observation. Has process pausing function. Process can be extended manually. Can measure temperatures directly on the processed materials by thermocouples. Zone and material temperatures are shown on LCD or transmitted via an RS232 interface to external software. Consists of two process zones: a sealed heat chamber and an open cooling section. A motorized drawer drives the substrates between the two zones. Hot process chamber includes a full convection heating system.

Essemtec USA, www.essemtec-usa.com

The RFID Smart Storage Cart for Juki feeders complements the IFS-X2 intelligent feeder system. Provides the capability to automatically detect all Juki intelligent feeders in offline storage carts. Come in a range of feeder storage options, with or without intelligence.

Cogiscan, www.cogiscan.com
Juki Automation Systems, www.jas-smt.com