XF-300 is a 0.005" coated polyamide, pressure-sensitive label material, designed for barcode or alphanumeric identification of connectors, wires and cables. Is coated with a high opacity, matte white topcoat specifically designed for thermal transfer printing. Can be printed using dot matrix printers and certain felt-tip or ballpoint pens. Is for labeling curved parts and surfaces. Is coated with a permanent pressure-sensitive acrylic adhesive that will adhere to most clean, dry surfaces. Has a temperature rating up to 293°F.

XF-596 (0.001") and XF-597 (0.002") high-gloss polyimide label materials for higher barcode print density are coated with a high opacity, gloss white topcoat specifically designed for thermal transfer printing. High-gloss topcoat permits high barcode printing densities when using 600 dpi thermal transfer printers. Label sizes can be reduced compared to standard density barcodes. 2-D barcodes, such as IDMatrix or PDF417, are said to be easily printed on these materials. The temperature resistance (rated up to 932°F) is critical for the dimensional stability of the label required for efficient barcode scanning. Come laminated with a high-temperature, permanent, pressure-sensitive acrylic adhesive.

XF-509 is a 0.001" polyimide film coated with a high opacity, black topcoat. Is designed for thermal transfer printing with white resin-based ribbons. Is laminated with a high-temperature permanent pressure-sensitive acrylic adhesive designed for industrial environments. Labels can withstand chemicals and temperature extremes up to 932°F. Is used in situations where reflected light from standard white labels can cause “ghosting.” Also offers aesthetic advantages when the label is used on a dark surface. Retains high dimensional stability at high temperatures.

All comply with ROHS, REACH, and halogen-free.

Polyonics, www.polyonics.com

Dross-B-Gone powder separates dross from molten solder. Applicable for wave soldering and other processes involving considerable volumes of solder. Is claimed to recover in several minutes almost 90% of the pure solder originally used. Is effective with both Pb-free and SnPb solders. Eliminates dross by quickly oxidizing it into an easily removable powder that is discarded, while pure molten solder remains in the pot and becomes reusable. Is sprinkled on the molten solder at an approx. ratio of 10 g per 1000 g of solder dross. The pure solder recovery rate is 880 g.
 
Manncorp, www.manncorp.com/wave-solder/dross-b-gone/.

ZelFlex Protect is a reusable stencil frame system that is an alternative to glued stencil frames. Stencil foil can be stored as a flat sheet if not in use. Can stay on the stencil to permit safe handling and quick changeover. Changing a stencil is said to take 30 sec. or less. Comes in industry standard form factors and reportedly is compatible with virtually any stencil printer. Outer dimension is 23" x 23" and total thickness is 1".
 
LPKF Laser & Electronics, www.lpkfusa.com
 

The Modular Compact platform consists of MC-12, MC-1 and MC-8. Packs up to 126 ultra-thin (12-mm) feeders into each machine. A side-view camera prevents placement defects. Has full-featured graphical programming tools and common family setups and production scheduling. Incorporates intelligent and lightweight feeders that reportedly can be changed in seconds. Includes offline preparation, online loading units and Feeder Exchange Systems. Standard equipped with tape cutting. MC-12 has vision recognition that uses a moving side-view scan camera with advanced optics; simultaneously takes X and Y component measurements; helps prevent misplaced or missing components, and rejects components with bent leads, damaged bumps or that have been picked upside down. A chipshooter places up to 36,000 cph with 50µm accuracy at 3 sigma. With up to 120 feeder positions, space productivity is 20,000 cph/m2. MC-1 multifunctional mounter (19,100 cph and 126 feeder positions) and MC-8 fine-pitch mounter (8,900 cph and 119 feeder positions) both have 30 µm accuracy. All have automatic nozzle cleaning procedures. Platform accepts component range from 0.4 x 0.2 mm up to 100 x 45 mm, or 55 x 55 mm with component heights up to 25.5 mm, and programmable placement forces from 10 to 30N for press-fitting complex components. Accepts boards up to 510 x 460 mm. On-board tools enable teaching of placement locations, fiducials and component shapes.
 
Assembléon, www.assembleon.com