MicroLine 1000 E UV laser system is for separating thin or flexible assembled and unassembled panels. Is noncontact and reportedly does not affect conductors or components near the cutting channel. System software imports data directly from popular layout programs. Handles boards up to 229 x 305 mm (9” x 12”). Integrated vacuum table holds boards securely in position, with no need for further clamping devices; an advantage over conventional laser separation techniques for thin and flexible substrates.

LPKF, www.lpkf.com

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