New Products
Extra Fine Solder Wire SN100C (030) reportedly provides sharp spreading and good separation. Is said to reduce bridging in soldering extra fine coaxial harnessing in cellphones. Has a diameter of 0.1 mm. Properties include inhibition of growth of intermetallic layer and low copper erosion.
Nihon Superior Co. Ltd., www.nihonsuperior.co.jp
Nihon Superior Co. Ltd., www.nihonsuperior.co.jp
X5Pro printer is an updated release of the X5 platform. Provides an expanded board size capability and updated I/O system. Is compatible with IPAG integrated paste and glue dispensing system and 2½ D Plus high-speed inspection system. Uses a high-speed servo vision drive system.
EKRA, www.ekra.com
Progressive Energy
Dynamics fluid delivery technology comes on the MicroJet defluxer and is said to offer maximum
impingement energy and fluid flow around and under SMT components.
Independently targeted, precision flow jets impact all four sides of circuit
card assemblies and SMT components as they travel through the wash. Can clean low
standoff BGAs and microBGAs.
Aqueous Technologies Corp., www.aqueoustech.com
Alternate Finger gasket is a variation of the slot mount shielding and electrical contact gasket. Is said to be preferred for applications where a continuous slot is not an ideal option. The beryllium copper fingerstock gasket is manufactured with retention fingers on an alternating pattern. Is available for standard and ultrasoft compression applications. Is also available in several plating finishes. Can be ordered in a variety of lengths and retention fingers at every third or fifth slot. Free samples are available.
Leader Tech, www.leadertechinc.com
This line of air-cooled induction soldering systems has output power from 5W to 5kW. Applications include conductor to wafer, wire to connector, coax to connector and connector to PCB.
iTherm Technologies, http://www.itherm.com/solder.html
iTherm Technologies, http://www.itherm.com/solder.html
VectorGuard Platinum stencil platform is for wafer-level packaging, direct chip attach, flip chip and BGAs. Is said to be capable of aperture accuracies of less than 3 μm, and positional tolerances of better than 20 μm at pitches down to 50 μm. Is frameless, and offers simple and automatic tensioning, independent of traditional pneumatic assistance processes.
DEK, www.dek.com
Press Releases
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- Henkel earns ASE 2024 Best Supplier Award, Recognized for its Part in Carbon Verification Project; Wen Zhou Comments