Circuits Assembly Online Magazine - New Products

New Products

Embedded Passives: An Overview of Implementation, Benefits and Costs is a white paper providing information about the cost/value proposition of this evolving technology. Provides guidance for engineers, executives and others considering embedded passives to evaluate the technology; has general information on how to proceed with implementation. Contains 20 pages; summarizes formed embedded passives and addresses physical considerations, quality and reliability considerations, performance gains, implementation costs and cost advantages, and design impacts for circuit boards with embedded components. Features 24 figures and tables.

IPC, http://www.ipc.org/onlinestore

KISS 101A is ready for Pb-free soldering, and reportedly can reduce hand-soldering operations by up to a factor of 10. Is programmable in X, Y and Z. Utilizes original Laser Point teach-and-align process. Features optional Pb-free-compatible solder pot. A variety of standard and custom nozzles are available, from a 3 mm bullet nozzle to a 3" wide wave. Is a benchtop model and accommodates PCBs from 2 x 2" up to 12 x 12", and connectors up to 10" long.

ACE Production Technologies, www.ace-protech.com

McDry Electronic Drying Storage Cases provide low-humidity storage without use of nitrogen for solar cells. Remove humidity by use of a zeolite desiccant, which is automatically recycled and does not require replacement. Come in 1% and 3% RH models. Offer natural air flow circulation system and do not use fans.

Seika Machinery, www.seikausa.com

The BULB-VAC tool comes with one 3/4" diameter static dissipative Buna-N vacuum cup. Operates similarly to a tweezer; squeeze the vacuum bulb; place the soft suction cup to the part to be handled; then squeeze and the part is firmly gripped. A second squeeze releases the part. These tools lift 0.25 lb. Applications include SMT parts, metal parts, plastic parts or any item with a smooth nonporous-surface. Can be used with any of the company’s rubber vacuum cups, ranging in size from 3/8" to 3/4" in diameter.

Virtual Industries, www.virtual-ii.com

The 03.1 Reballing/Prebumping Station reportedly is for BGAs and CSPs, and solder paste prebumping of QFN devices. Includes Rapid IR Heating to achieve Pb-free processing temperatures while preventing damage to components and boards. Is useful in converting BGAs, CSPs and QFNs from leaded to Pb-free devices, or vice versa.

Manncorp, www.manncorp.com/rework/multireball03/

CDS6200 with two jet dispensers permits proportioning of various media at a large number of points. Contains a custom-built vacuum table that can be adjusted manually to the height of +10 mm, and can be triggered independently; is removable from the table by hand. Using two jet valves, two different adhesives can be deposited simultaneously. A third jet dispenser can be installed at the same head. The proportioning systems of the CDS-series are flexible platforms.

Essemtec, www.essemtec.com