The Rhythm EX Selective Soldering System offers a selective soldering range of 24 x 24"; no manual rotation or adjustment is required. Offers closed-loop servo-driven X, Y, and Z-axis motion that articulates the solder wave and flux beneath the PCB. Designed for high-mix or high-volume production. Programmable in minutes to handle basic to complex through-hole soldering. Includes independently heated and programmable Nitrogen inertion and quick-change solder nozzles for keep-away (less than 1.5 mm) and lead protrusion clearance (6 mm). Delivers automation capabilities for wave height management, system standby and startup, automated conveyor width adjustment, dedicated witness vision systems, adjustable temp N₂ DirectHeat and EasyLoad solder pot management.
 
RPS Automation LLC, www.rpsautomation.com
 

Automatic Vision Control for L-Series pick-and-place systems is said to advance placement of 0201s; 100% accurate on-the-fly, bottom-up vision placement of micro BGAs and ultra fine pitch QFPs. Cognex Machine Vision has 2 µm resolution scales and easy-to-use software. L-Series is for BGA, µBGA, bottom-leaded and odd-shaped component placement down to 0201 components and 0.015" pitch resolution requirements. 
 
APS Novastar, www.apsgold.com/aps.html  
 

The Unitek Eapro DT-500-PH features a motorized X-axis table, Y-axis table, or X-Y-axis table. Is said to be suited for hot bar bonding multiple parts in an array at one time, bonding multiple flexes onto one PCB, or bonding one flex to both a PCB and LCD. Includes Uniflow2 power supply for selective hot bar soldering, heat sealing and conductive adhesive bonding applications. Reportedly provides targeted heating and precision temperature control for flex circuits, ribbon cables, wires, SMT components, single- or dual-sided edge connectors and thermocompression bonding of gold ribbon.
 
Miyachi Unitek, www.muc.miyachi.com  
 

PC-controlled Martin “Expert” Pb-free rework station version 9.6 is said to automatically accomplish any stage of SMT repair, from removal to replacement, as well as the re-solder of BGAs, CSPs, µBGAs and other SMDs. A high-res camera combined with auto-vision placement controls component positioning in full and continuous view of the operator. There is no need to shuttle the camera out of the path of the placement head. The IR underheating unit adjusts to exact board size; heats the underside of the PCB and is said to attain Pb-free processing temperatures faster, with no board warpage or component damage. Includes a selection of nozzles for placement, soldering and solder removal, as well as a flux pen and a paste dispensing unit for re-soldering. Includes vacuum pen.
 
Manncorp, www.manncorp.com