Archives

2018 Issues

1803cover

 

FEATURES

SOLDER VOIDING
Fill the Void III

In the third of a series of studies, several new variables were tested and compared to previous data on voiding. This round used a new board design that includes two sizes of QFNs, BGAs and LGAs susceptible to voiding, and tested multiple powder sizes.
by Tony Lentz

INEMI ROADMAP
The Ongoing Convergence of Gaming Devices

Cost, power, bandwidth and form factor of these mobile devices continue to be driving factors for acceleration of integration of silicon and system capabilities into single package or single die.
by Kartik Ananth

TEARDOWNS
Microsoft Xbox One X Teardown

A custom chip built on the AMD platform powers the popular video game console.
by Mike Buetow

 

FIRST PERSON

 

MONEY MATTERS

 

TECH TALK