Products
Finetech will highlight the Fineplacer Pico system in booth E1A02 during Nepcon China/EMT China on April 4-7.
The base module can be used in a wide field of applications for rework and different kinds of micro assembly, e.g. flip chip bonding. For micro assembly, it offers 5 µm (0.2 mil) placement accuracy, allowing die with a pitch down to 50 µm to be bonded. The rework configuration offers accessibility for nearly all large standard surface-mount components.
It is capable of both rework and assembly. It can be configured with a small passive rework application package that includes all rework steps: component removal, residual solder removal, paste dispensing and new component soldering. This configuration makes it possible to see 0201 or 01005 components using high-magnification optics. The optional integrated solder paste dispenser can dispense solder paste dots small enough for 01005 rework and can also be configured to dispense epoxy and underfill.
A second application package is available for mobile device rework. Comes equipped with a motorized placement module and can perform the entire rework process for the smallest of devices up to RF shield cans.
The flip chip bonding configuration includes additional process modules: a chip contact heating module, special heating plate and a bonding force module. Many flip chip applications can be supported, including eutectic and AuSn soldering, thermo compression and thermo/ultrasonic bonding, adhesive technologies, ACP (Anisotropic Conductive Paste), and Chip On Glass (ACF).
Features "WinCOMISS" software that controls bond force during placement and soldering.
Finetech, finetechusa.com
The base module can be used in a wide field of applications for rework and different kinds of micro assembly, e.g. flip chip bonding. For micro assembly, it offers 5 µm (0.2 mil) placement accuracy, allowing die with a pitch down to 50 µm to be bonded. The rework configuration offers accessibility for nearly all large standard surface-mount components.
It is capable of both rework and assembly. It can be configured with a small passive rework application package that includes all rework steps: component removal, residual solder removal, paste dispensing and new component soldering. This configuration makes it possible to see 0201 or 01005 components using high-magnification optics. The optional integrated solder paste dispenser can dispense solder paste dots small enough for 01005 rework and can also be configured to dispense epoxy and underfill.
A second application package is available for mobile device rework. Comes equipped with a motorized placement module and can perform the entire rework process for the smallest of devices up to RF shield cans.
The flip chip bonding configuration includes additional process modules: a chip contact heating module, special heating plate and a bonding force module. Many flip chip applications can be supported, including eutectic and AuSn soldering, thermo compression and thermo/ultrasonic bonding, adhesive technologies, ACP (Anisotropic Conductive Paste), and Chip On Glass (ACF).
Features "WinCOMISS" software that controls bond force during placement and soldering.
Finetech, finetechusa.com
DEK will attend the Nepcon UK show, held May 9-11 at the National Exhibition Centre, Birmingham. Sop by stand C30 to find information and exhibits of the HawkEye print verification system operating on a Europa high-accuracy SMT printer equipped with Instinctiv; VectorGuard stencil technologies; and consumables.
Visitors can witness DEK’s HawkEye print verification system in action, live on the Europa platform. It enables high-speed verification of 100% of printed boards at line beat rate. The system analyzes streamed 2-D board images in real-time to generate a pass/fail indication. Any faulty board can be immediately isolated before component placement and returned for cleaning and re-printing, thereby minimizing scrap.
The Instinctiv user interface provides intuitive graphical features and on-board help to streamline new product introduction, facilitate process monitoring and optimization, and reduce stoppages.
VectorGuard stencil technologies address the need for accuracy in the Pb-free environment. The Gold electro-formed stencils and Silver nickel laser-cut stencils reportedly deliver enhanced aperture release and paste volume repeatability.
DEK, dek.com
Visitors can witness DEK’s HawkEye print verification system in action, live on the Europa platform. It enables high-speed verification of 100% of printed boards at line beat rate. The system analyzes streamed 2-D board images in real-time to generate a pass/fail indication. Any faulty board can be immediately isolated before component placement and returned for cleaning and re-printing, thereby minimizing scrap.
The Instinctiv user interface provides intuitive graphical features and on-board help to streamline new product introduction, facilitate process monitoring and optimization, and reduce stoppages.
VectorGuard stencil technologies address the need for accuracy in the Pb-free environment. The Gold electro-formed stencils and Silver nickel laser-cut stencils reportedly deliver enhanced aperture release and paste volume repeatability.
DEK, dek.com
Bonding Source LLC, a reseller of specialty materials, enters the microelectronics and RF/Microwave market with a family of epoxies and bonding wire. It will provide immediate delivery of electrically conductive and non-conductive pastes and films manufactured by Ablestik, Emerson & Cuming and Epoxy Technology. Epoxy film pre-forms will be available with a lead-time of one week. An array of gold bonding wire and ribbon manufactured by SPM will be available for immediate delivery. The company will offer next-day delivery of epoxy paste syringes, film sheets and spools of wire/ribbon.
Scott MacKenzie, president, said, “We decided to start this new concept in providing specialty materials because we were always frustrated with how long it took to get a quote, lead-times on delivery and minimum charges. In our manufacturing business, a 4-6 lead-time on material isn’t acceptable to our customers. Also, we were constantly buying more epoxy than we could use up before the expiration date. Every year we were tossing out or reclaiming thousands of dollars worth of epoxy and wire. We thought that there must be other microelectronics and RF/Microwave companies experiencing the same pain, and approached the epoxy and wire manufacturers with the idea. They have been fully supportive, and the response from the industry has been tremendous. Bonding Source takes all the risk by purchasing the epoxy and wire, and the customers just call up and get what they need the next day.”
Bonding Source, bondingsource.com
Scott MacKenzie, president, said, “We decided to start this new concept in providing specialty materials because we were always frustrated with how long it took to get a quote, lead-times on delivery and minimum charges. In our manufacturing business, a 4-6 lead-time on material isn’t acceptable to our customers. Also, we were constantly buying more epoxy than we could use up before the expiration date. Every year we were tossing out or reclaiming thousands of dollars worth of epoxy and wire. We thought that there must be other microelectronics and RF/Microwave companies experiencing the same pain, and approached the epoxy and wire manufacturers with the idea. They have been fully supportive, and the response from the industry has been tremendous. Bonding Source takes all the risk by purchasing the epoxy and wire, and the customers just call up and get what they need the next day.”
Bonding Source, bondingsource.com
Stackable PCB Transport and Storage Racks are made of conductive material for safe, convenient handling of printed circuit cards during assembly. Can hold up to 50 PCBs from 2” to 9.8” (5 to 25 cm) wide. Are made of conductive plastic temperature rated to 176OF, Surface resistance <10 6.
The width of the rack can be quickly adjusted for different PCB sizes by unlocking the stop latches on the top panel, pushing the side plate to the correct position and resetting the position holders. A chain and sprocket mechanism assures that the sides of the panel will be held parallel during adjustment. Adjusting the rack for new PCB size takes less than 20 sec.
The width of the rack can be quickly adjusted for different PCB sizes by unlocking the stop latches on the top panel, pushing the side plate to the correct position and resetting the position holders. A chain and sprocket mechanism assures that the sides of the panel will be held parallel during adjustment. Adjusting the rack for new PCB size takes less than 20 sec.
FKN Systek, Fknsystek.com
Zuken and PCB Libraries Inc. have launched a CADSTAR-compatible land pattern generator, IPC-7351A LP Wizard. The tool reportedly reduces the time it takes to build library parts and ensures compatibility with the latest IPC standard for surface-mount design.
The tool consists of land pattern viewers, calculators and generators
for the creation of CAD land patterns in SMT parts libraries. The time to build a standard SMT library part (previously on average 30 min.) has been reduced. The generated library parts comply with the latest land pattern and surface-mount design requirements as defined by the IPC. Using data based on the IPC-7351 Land Pattern Standard, users can generate accurate manufacturing compliant PCBs while cutting costs.
The LP Wizard dovetails with the free library documentation and the Viewer, both provided by the IPC with the needed standard. The data entered by a PCB designer can also be shared with engineers throughout the organization with the Viewer on a project by project basis.
Available for purchase direct from PCB Libraries; all licenses come with one year of maintenance; pcblibraries.com/store/detail.aspx?ID=54
The tool consists of land pattern viewers, calculators and generators
for the creation of CAD land patterns in SMT parts libraries. The time to build a standard SMT library part (previously on average 30 min.) has been reduced. The generated library parts comply with the latest land pattern and surface-mount design requirements as defined by the IPC. Using data based on the IPC-7351 Land Pattern Standard, users can generate accurate manufacturing compliant PCBs while cutting costs.
The LP Wizard dovetails with the free library documentation and the Viewer, both provided by the IPC with the needed standard. The data entered by a PCB designer can also be shared with engineers throughout the organization with the Viewer on a project by project basis.
Available for purchase direct from PCB Libraries; all licenses come with one year of maintenance; pcblibraries.com/store/detail.aspx?ID=54
Zuken USA Inc., zuken.com
Protocase Designer version 113 is now available for download at protocase.com/www/designer.
Upgrades inclulde:
Flat panel: a simple flat panel template compliments standard enclosure templates.
Exclusion zone: eliminates any user concern from placing cutouts or components in inappropriate areas.
Flanges: appropriate flanges result in realistic template models
Information bar: more information regarding origins, exclusion zones, library component nomenclature, etc.
Coordinate origin: more detail regarding face editor origins.
Open/Save functions: cleaned up issues related to opening and saving files.
A new tutorial emphasizes proper enclosure design for mounting your PCBs; it can be found at protocase.com/www/designer/tutorial/.
Upgrades inclulde:
Flat panel: a simple flat panel template compliments standard enclosure templates.
Exclusion zone: eliminates any user concern from placing cutouts or components in inappropriate areas.
Flanges: appropriate flanges result in realistic template models
Information bar: more information regarding origins, exclusion zones, library component nomenclature, etc.
Coordinate origin: more detail regarding face editor origins.
Open/Save functions: cleaned up issues related to opening and saving files.
A new tutorial emphasizes proper enclosure design for mounting your PCBs; it can be found at protocase.com/www/designer/tutorial/.
Protocase Inc., protocase.com
Press Releases
- Danutek Celebrates its 20 Anniversary
- Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
- Kubler US Corp. Expands to Texas and Surrounding States with FHP Reps
- Indium Corporation Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC