AUSTIN, TX, UNITED STATES, February 26, 2026 /EINPresswire.com/ -- PulseForge, Inc. (PFI), the inventors of Photonic Soldering technology, today announced a major breakthrough enabling high-temperature solder alloy reflow in ambient atmosphere without the use of active flux. This advancement constitutes a critical milestone for next-generation electronics manufacturing, providing a cleaner, faster, and more cost-effective alternative to traditional soldering methods.

The breakthrough, first demonstrated in pre-bumping of ball grid array (BGA) components, is applicable across a broad range of device structures. Solder balls are stabilized mechanically with a flux-less tacky agent and attached using the photonic reflow process. This approach enables manufacturers to achieve a significantly cleaner final joint, with easier and more reliable removal of remaining residues compared to reflow with conventional fluxed solder pastes. Because the process operates in ambient atmosphere, it also eliminates the expense and environmental impact of inert gas purging.

“Flux-less soldering has long been considered the ‘holy grail’ of electronics assembly,” said Jonathan Gibson, CEO of PulseForge, Inc. “Our team has achieved what the industry has pursued for decades: a clean, repeatable, production-ready process that dramatically lowers total manufacturing cost by eliminating the need for process nitrogen. This technology changes what is possible in high-performance electronics.”

A gamechanger for high-reliability applications

Flux has historically played an essential—but imperfect—role in soldering by removing oxides and improving wetting. However, its use introduces a variety of trade-offs, including corrosion risk, ionic contamination, post-cleaning steps, and long-term reliability concerns. As electronic devices continue to shrink and I/O density increases, flux residue poses an even greater reliability challenge.

PulseForge’s flux-less approach overcomes these limitations by leveraging the unique physics of Photonic Soldering, where rapid heating significantly limits oxygen penetration during reflow. The result is solder joints with performance identical to flux-assisted processes, with reduced contamination risks and cleaning overhead.

This innovation sets a new standard for high-reliability applications including semiconductor packaging, die attachment, advanced interconnects, flex-to-rigid assemblies, and next-generation underfill processes. 

Cleaner and greener at a lower cost

PulseForge Photonic Soldering delivers profile times between 1 and 5 seconds, dramatically increasing throughput compared to conventional soldering approaches. By eliminating the need for inert or reducing gases, the environmental impact of the process is reduced by more than 95%, while also cutting operational costs.

Combined with a faster process and reduced consumables, the technology delivers a significant cost-per-unit advantage to manufacturers.

Available for immediate implementation

The full suite of PulseForge industrial tools supports immediate qualification and integration of the new flux-less process into existing production environments. The technology is available across all PulseForge soldering tool platforms, allowing customers to deploy it quickly in both development and high-volume manufacturing.

About PulseForge

PulseForge, Inc. develops and manufactures state-of-the-art flashlamp-based tools that deliver energy in a precise and targeted manner to enable innovation in industrial manufacturing. PulseForge’s expertise and tools empower customers to explore novel materials and manufacturing methodologies, driving dynamic and efficient production at an industrial scale.

Tokyo, Japan – Panasonic Connect Co., Ltd. announced that it has published a case study on the delivery of its surface mount technology (SMT) equipment to Dixon Technologies (India) Limited, one of India’s largest electronics manufacturing services (EMS) and design manufacturing companies. The installed equipment contributed to solving key challenges in high-volume manufacturing by achieving both high productivity and consistent quality.

URL: https://connect.panasonic.com/en/products-services_fa/solutions/case-studies/dixon-padget

Background

Dixon Technologies plays a vital role in promoting the “Make in India” initiative, contributing significantly to the transformation of India into a global manufacturing hub. To sustain its rapid growth, the introduction of advanced equipment became essential, as the company faced challenges in balancing high productivity with consistent quality. Their previous systems had limitations in mounting speed, line efficiency, and especially in changeover time for high-volume product categories. Dixon sought a highly reliable solution that could support rapid production expansion without compromising quality.

Reasons for introduction

Panasonic Connect’s SMT solutions met Dixon’s requirements for high-speed mounting suitable for large-scale mobile device production, production stability, automation, rapid product changeover, and ongoing operator training. The decision was further supported by the company’s strong technical support structure. In addition to offering excellent reliability, mounting accuracy, and operability, Panasonic Connect’s dedicated technical team provided proposals that improved product quality and overall line utilization—key factors in the adoption.

Customer testimonial

Dixon Technologies manufactures a wide range of products, resulting in frequent model changeovers. With Panasonic Connect’s equipment, changeover times have been significantly shortened, greatly improving equipment efficiency. Previously, changeovers on other manufacturers’ machines took approximately 60 minutes, but this has now been reduced to 15 minutes, contributing to lower downtime and reduced overall costs.

Following installation, substantial improvements were seen in line throughput, mounting accuracy, and equipment utilization rates. Faster changeovers resulted in significant reductions in downtime and improvements in product quality. Panasonic Connect’s software and predictive maintenance capabilities also contributed to enhanced quality.

Panasonic Connect provides 24/7 support, with engineers stationed on-site to minimize downtime in case of equipment failure. While the supply of spare parts is satisfactory, further improvements are anticipated. Dixon expresses high expectations for Panasonic Connect’s growing presence in India and its leadership in driving industry-wide progress.

About Dixon Technologies (India) Limited

Founded in 1993, Dixon Technologies is one of India’s largest EMS companies, providing comprehensive and long-term solutions that include product design, manufacturing, assembly, testing, and after-sales services for a wide range of categories such as consumer electronics, home appliances, lighting, mobile phones, and security systems.

HARRISBURG, PA ― February 2026 ― Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is pleased to announce the upcoming ANSI/ESD S20.20-2021 Training Course hosted by Desco Industries Inc., taking place throughout May 2026. This comprehensive four-part webinar series is designed to help ESD professionals and manufacturing teams implement, verify, and maintain effective ESD control programs aligned with the globally recognized ANSI/ESD S20.20-2021 standard.

The live online training will be held from 1-3 PM EDT on the following dates:

• Tuesday, May 5, 2026 – ESD Basics/Technical and Administrative Review of S20.20-2021 Grounding/Personnel
• Tuesday, May 12, 2026 – Grounding-Wrist Straps/Continuous Monitoring/Flooring-Personnel Grounding
• Tuesday, May 19, 2026 – Worksurfaces/Mobile Equipment/Shelving/Seating
• Tuesday, May 26, 2026 – Packaging/Ionization//Garments/Gloves/Finger CotsParticipants who register will automatically be enrolled in all four sessions and will receive a certificate recognizing completion of the Desco Industries Inc ANSI/ESD S20.20-2021 Training Course upon successful completion of the program and related exams.

Building a Strong Foundation in ESD Control
Electrostatic discharge (ESD) remains a critical risk factor for electronics manufacturers worldwide. An effective ESD control program requires leadership commitment, structured processes, and a clear understanding of how static electricity is generated and controlled. Focused training and organization are key components to achieving a sustainable ESD program from management through the operator level.

This course is particularly valuable for individuals new to ESD program implementation and management, as well as experienced professionals seeking a stronger understanding of the administrative and technical requirements of the S20.20-2021 standard.

The training emphasizes both theoretical understanding and practical application, ensuring attendees can confidently manage ESD control items and maintain compliance across their facilities.

Proven Value for Manufacturing Teams

Past attendees consistently praise the program for its clarity and depth.

“Thank you for putting on this training. I’ve been a part of our ESD program for over a decade with no real training, just picking up on things over time. It all makes so much more sense now to the point of being able to explain and teach others.” — Jennifer Simmerman, Quality Assurance Group Leader, RBB, Wooster, Ohio

“Desco and SCS are what any organization would desire as their partner in ESD training and static control products… This training covers all necessary topics needed to help your business build a comprehensive ESD control program, certify your staff, and support your specific needs.” — S. R. Cooper, ESD Coordinator, MicroSat Systems Canada Inc.

Registration Information

Registration is open through Tuesday, April 28, 2026. To secure your spot, Register Here.

For questions, contact ESD@ce3s.com or call 800-955-0225.

For more information about CE3S, please visit www.ce3s.com or contact sales@ce3s.com.

Plymouth, WI — February 2026 — Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH.

This strategic integration unites Kurtz Ersa’s established reflow soldering expertise with ATV’s advanced vacuum and specialty thermal processing technologies, creating a complete solution portfolio for microelectronics, semiconductor packaging, and power electronics manufacturing.

Advanced Thermal Solutions for Semiconductor Applications

At the core of the expanded lineup is the SRO i-Line reflow platform, engineered for high-precision semiconductor and substrate processing. The system delivers exceptional temperature uniformity, tightly controlled heating zones, optimized cooling performance, and vacuum in combination with Formic Acid and Nitrogen, making it well suited for DCB/AMB substrate soldering, power module assembly, and other thermally demanding applications. Its stable heating technology ensures repeatable results across both development and production environments.

Complementing the SRO i-Line are the VADU vacuum reflow systems, including models such as the VADU 200XL and VADU 300XL. These batch vacuum platforms are specifically designed to reduce voiding in solder joints—an essential requirement for automotive, industrial, and wide bandgap semiconductor applications. Through controlled vacuum processing and precise thermal profiling, the VADU systems support die attach, substrate soldering, and advanced packaging processes where reliability is critical.

The portfolio also supports sintering, curing, and additional specialty thermal processes required for next-generation semiconductor devices. With programmable process control, data logging, and controlled atmosphere capabilities, the systems are built to meet strict quality, traceability, and performance standards.

A Dedicated Semiconductor Focus

The formation of Kurtz Ersa Semicon GmbH reflects the company’s long-term investment in microelectronics and semiconductor technology. By combining inline reflow platforms with batch vacuum systems, Kurtz Ersa now offers customers a coordinated path from R&D and pilot production to scalable manufacturing—while maintaining precise thermal control and documented process repeatability.

“Semiconductor manufacturers are facing tighter process windows and increasing reliability requirements,” said Ernie Grice, Vice President Sales at Kurtz Ersa, Inc. “With Kurtz Ersa Semicon GmbH, we are bringing together complementary technologies and focused expertise to deliver advanced thermal solutions tailored specifically for microelectronics and power electronics production.”

With decades of experience in thermal processing and a growing global presence, Kurtz Ersa continues to expand its capabilities to support the evolving needs of semiconductor manufacturers worldwide.

For more information about Kurtz Ersa and its semiconductor solutions, visit www.ersa.com.