TORRANCE, CA — February 2026 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will host a live technical webinar, “Strain Gage Based Bolt Axial Force Measurement – Effects of Vibration and Temperature in Battery and PCB Fastening,” on Wednesday, March 4th at 10:00 am. Engineers and manufacturing professionals can register here: https://us02web.zoom.us/webinar/register/WN_0gNNnro3TyC5dqfan-jt1A.

As electrification advances and electronics become more compact and power-dense, fastening reliability has become increasingly critical. Vibration and temperature fluctuations can significantly alter bolt axial force in battery systems and PCB assemblies, potentially leading to loosening, degraded electrical contact, and long-term reliability failures. These changes are often undetectable through torque control methods alone.

The webinar introduces strain gage-based bolt axial force measurement as a quantitative method for directly evaluating fastening conditions. The session will highlight BoltEye™ bolt axial sensors from Kyowa, which are customized by drilling the bolt, bonding strain gages, and routing lead wires to enable real-time axial force measurement.

Available for a wide range of bolt sizes—from M3 screws used in PCB assemblies to M64 bolts for heavy applications—BoltEye sensors can be customized for various bolt shapes and materials. The sensors are capable of measuring axial force during tightening, as well as monitoring loosening caused by vibration, high temperature, and thermal cycling. Measurement capability extends up to 300°C, making the solution suitable for demanding battery and power electronics environments.

A key focus of the webinar will be measurement stability. Compared to conventional embedded strain gage methods, Kyowa’s heat-crimping technique to the inner surface of the bolt hole provides improved zero return performance and greater stability under both room and elevated temperature conditions. The session will also address common challenges such as drift, creep during temperature cycling, and maintaining accuracy above 40°C.

To ensure reliable data, Seika and Kyowa provide load calibration and temperature characteristic data for customized bolt axial sensors. Calibration is performed using data loggers traceable to national standards, allowing accurate conversion from strain output to true axial force. Temperature characteristic data supports correction when measurements are conducted under changing thermal conditions—an essential requirement in battery testing and PCB validation.

By directly visualizing axial force rather than inferring it from torque, strain-based measurement provides valuable insight for design validation, reliability assessment, and troubleshooting. Engineers gain a clearer understanding of joint behavior under real-world operating conditions, supporting improved product durability and long-term performance.

The webinar is especially relevant for design engineers, manufacturing engineers, quality professionals, and reliability teams working with battery systems, EV components, power electronics, and PCB assemblies.

For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com.

Fraser, MI — February 2026 — K&F Electronics, a third-generation, family-owned electronics assembly provider, has installed a SASinno Ultra-i1 offline selective soldering system, expanding its selective soldering capacity and improving process consistency for customer programs that require precise, repeatable results.

Founded in 1972, K&F Electronics has evolved into a long-established U.S. provider of electronic assembly services, supporting customers across a range of industries with reliable, high-quality builds. The addition of the Ultra-i1 allows K&F to handle a broader mix of board designs, lot sizes, and production schedules while maintaining quality and delivery expectations.

The SASinno Ultra Series, which includes the Ultra-i1 and Ultra-i2 models, is designed for operations with frequent changeovers and mixed production runs. The Ultra-i1 installed at K&F provides controlled selective soldering for small- to medium-batch production without slowing overall throughput.

Key features of the system include fiducial recognition, jet fluxing, automatic nozzle cleaning, and dual preheating zones to support stable soldering conditions. A maintenance-free electromagnetic pump and nitrogen heating help deliver consistent solder quality across production runs.

System operation and setup are managed through a Windows-based interface, with tools such as live soldering cameras, wave height calibration, and barcode tracking to support process verification and documentation.

“This addition gives us greater control over selective soldering and more flexibility for the mix of programs we support,” said Sean Kincaid, President of K&F Electronics. “It helps us respond quickly to new requirements while maintaining the level of quality our customers rely on.” The Ultra-i1 installation reflects K&F Electronics’ continued investment in equipment that strengthens process reliability and supports customer schedules.

For more information about K&F Electronics and its electronics assembly services, visit www.circuitboards.com.

Guadalajara, Mexico — February 2026 — SMarTsol proudly announces a strategic partnership with Koh Young Technology, industry leader in True 3D measurement-based inspection solutions. Effective February 1, 2026 SMarTsol will serve as the Sales Representative for Koh Young Technology in Mexico, expanding its portfolio with advanced inspection and smart manufacturing solutions.

Through this partnership, SMarTsol will deliver world-class technologies to the Mexican market, including SPI (Solder Paste Inspection), AOI (Automated Optical Inspection), semiconductor inspection, and AI-driven Smart Factory solutions, enabling manufacturers to enhance quality, efficiency, and process control.

“We are very proud to establish this partnership with Koh Young Technology,” said Ivan Romo, Director of SMarTsol.
“Koh Young is a global benchmark for innovation and precision in 3D inspection, and this collaboration strengthens our mission to provide cutting-edge solutions to our customers in Mexico.”

Speaking on behalf of Koh Young, Joel Scutchfield, General Manager for Koh Young Technology in Mexico, stated: “Mexico represents a strategic market for Koh Young due to its strong growth in electronics manufacturing. Partnering with SMarTsol as our Sales Representative allows us to expand our local presence with a company that has deep market knowledge and a proven ability to support customers both commercially and technically.”

As part of this collaboration, SMarTsol and Koh Young Technology will jointly present their solutions at APEX 2026, taking place in Anaheim, California, where both companies will showcase their latest technological innovations to the industry.

This partnership underscores both companies’ commitment to innovation, operational excellence, and delivering advanced solutions that help electronics manufacturers in Mexico achieve the highest quality standards.

For more information about SMarTsol Technologies products and services, please visit www.smartsol.mx.

WOOSTER, OH – RBB, a trusted leader in electronics manufacturing since 1973, is starting the new year with significant equipment upgrades designed to enhance precision, throughput, and manufacturing capabilities across its production lines.

To support its commitment to quality and efficiency, RBB has installed MPM MOMENTUM II 100 stencil printers on both SMT lines, offering industry-leading alignment repeatability, wet print accuracy, and dual-lane processing capabilities—all in a compact, space-saving design. Key features of the Momentum II 100 include:

• AccuCheck Print Capability Verification for real-time assurance of print quality
• Automatic Paste Dispensing System for precise, uniform paste application
• BridgeVision and StencilVision for advanced inspection of PCB and stencil surfaces
• EdgeLoc Board Clamping System ensuring consistent board flatness and optimal gasketing
• High Flow Venturi with Closed-loop Control for consistent quality and easy setup
• OpenApps Architecture supporting custom Industry 4.0 integration

Additionally, RBB has expanded its measurement and profiling capabilities with the addition of ASC International LineMaster Fusion 3D inline solder paste measurement and M.O.L.E. EV6 thermal profilers for both reflow oven and wave solder processes. These systems provide fast, accurate, and automated data collection, helping RBB maintain repeatable quality with minimal operator intervention.
To further improve production efficiency, RBB added a new depanelization machine, a slideline with integrated monitoring, and advanced through-hole preparation equipment, enabling higher throughput and better control of mixed-technology assemblies.

To improve environmental control on the factory floor, RBB implemented a new industrial dry fog humidification system from IKEUCHI. This system uses ultra-fine “Dry Fog” technology to maintain stable relative humidity without wetting sensitive surfaces or equipment. By distributing very fine droplets with a mean diameter of 10 µm or less, the system helps suppress electrostatic discharge (ESD) issues, reduce debris and dust adhesion, and improve overall process stability during sensitive assembly and handling operations. Designed for industrial spaces, the humidification system achieves humidity control with energy use significantly lower than traditional steam humidifiers while also providing slight evaporative cooling and reducing static-related defects in electronics manufacturing environments.

In addition to these upgrades, RBB added a new MR2 Router depanelization system, bringing high-precision PCB routing capability in-house. Built on heavy-duty machine tool construction, the MR2 Router features a solid 2-inch-thick precision-ground steel base that enables ±0.0005-inch cutting accuracy at high speeds. An overhead gantry with precision THK ball screws and closed-loop servo drives supports a full range of cut types — lines, arcs, angles, and 3D topography — while a dual vacuum configuration delivers exceptional debris removal and clean depanelization results.

“These upgrades significantly enhance our capabilities and allow us to deliver higher precision and efficiency for our customers,” said Bruce Hendrick, Owner and CEO, RBB. “We continue to invest in new equipment to ensure reliable, high-quality electronic assemblies for prototypes.”

RBB specializes in turnkey and consignment manufacturing, including both surface mount and through-hole assembly, with expertise in mixed-technology designs commonly used in avionics, communications, power, and control systems.

For more information about RBB’s electronics manufacturing services, visit www.rbbsystems.com.