Press Releases

Electrical and electronic components come in a wide variety of sizes and mounting technologies. The classic is the through hole technology (THT), its modern counterpart is the surface-mounting technology (SMT). Unfortunately, these two technologies, which are combined in almost every electronic device, require different soldering methods. A dilemma? Yes and no.

At the beginning of the 20th century, there were no printed circuit boards. All components available at that time were wired freely by hand. It was not until around 1920 that the first prototypes were created: stamped conductor tracks riveted to hard paper and held together with sheet metal springs. In 1943, the Viennese engineer Paul Eisler was granted a patent for a printed circuit board. With moderate success for quite a long time. Manual wiring remained the standard for a good decade.

Through Hole Technology (THT) It was not until the early 1950s that the printed circuit board slowly gained acceptance. Near Düsseldorf, the through hole technology was born in the RuwelWerke. The connecting wires of the components were inserted through drilled holes in the printed circuit board, which were provided with copper conductor tracks on their underside. This approach simplified production and at the same time reduced the error rate during wiring. Today, this is called THT: Through Hole Technology.

Surface-mounting Technology (SMT)

Surface-mounting technology (SMT) is not that much younger, even though it is used for almost all modern electronic products. Its beginnings can be found in the 1960s, developed by IBM for the computers of the Saturn and Apollo missions. The reasons given for this development at the time were the cramped space conditions in the spaceships and a reduction in circuit impedance to increase switching frequencies.


SMT and THT both have a fixed place in the production of every EMS company today. EMS stands for "Electronics Manufacturing Services", i.e. the production and assembly of complete assemblies. The increasing customer demand for mobile electronic devices is shifting the focus more and more to surface mount technology. Usually SMT components are much smaller and thus allow more compact end devices. Smartphones are the best example of this. Without SMT, they would be unthinkable in their current form.

In contrast to through-hole mounting, SMT components are "glued" directly onto the copper-clad surface of the board and then soldered in a reflow oven. Often, an SMT PCB even allows assembly on both sides, which doubles the possible, fully automated assembly density.

Hybrids as a consequence

However, not every component can be reduced in size at will. Stationary electronic devices almost always have a built-in power supply. Traditionally, this consists of a transformer, capacitors, resistors and a rectifier. However, even the switching power supplies used very frequently today cannot be "shrunk" to miniature dimensions, depending on the power required. Power needs space. If, for example, the power supply also has to be placed on the SMT circuit board, then it quickly becomes a tight squeeze for a transformer. Or let's consider the question of fuse protection: If a fuse blows in the event of an overcurrent, then it would be extremely useful if this fuse could be replaced without great effort. This need gave rise to hybrids: SMT circuit boards that contain additional drill holes for THT components.

The consequences of a hybrid

The use of two technologies has consequences in the soldering process. For the EMS provider, this means that each board must undergo two soldering processes. One for the surface-mounted components (reflow method) and a second for the components in through-hole assembly (wave soldering. It goes without saying that two soldering processes are associated with significantly higher costs and a longer production time. In addition, two soldering systems must be available. But there are other disadvantages as well.

Issue: Ageing

If a hybrid PCB has to go through two soldering processes, many components are heated twice to temperatures well above 200 °C. This is not beneficial to Circuit Protection them. High temperatures will shorten the lifetime of any electronic component.

Issue: misplacement

The double soldering process poses an additional risk from its practical implementation: It is usually the case that the THT components are inserted after the reflow soldering process for SMT. In particular, manual placement of the components for the second soldering cycle in the wave bath involves a massively increased risk of incorrect placement.

Approach: no hybrids

To avoid these problems, there are several approaches. The simplest is to prevent them from occurring altogether. In other words, use only SMT or only THT components. Then a single soldering process is always sufficient. However, this is often not possible in practice due to the technical properties that the end product to be soldered should have.

Alternative: THR

The abbreviation THR stands for "Through Hole Reflow". In fact, THRs are components with through hole technology. However, these THR components are specially designed for automated assembly and high thermal stress in the reflow oven. During the assembly process, a paste is first printed in the vias for the THT pins, and then the component is pushed through the solder paste. As the paste melts in the reflow oven, the liquid solder retracts into the vias due to wetting and capillary forces, forming a clean solder joint. Two technologies, one soldering process. Highly efficient!

Back to (fuse) protection

With this in mind, we should once again take a look at the circuit protection of a fully automatically assembled PCB. It would be highly advantageous to install a fuse holder on the SMT board, which can also be soldered right away in the reflow process. Such fuse holders exist. The glow wire resistant, open fuse holder SCHURTER OGN is a classic. It is designed for 5x20 fuses of various rated currents and tripping characteristics. If desired, it can also be easily converted into a closed fuse holder by means of a cover. Three versions are now available: classic THT, SMT and now also THR, which is fully compatible with the THT version. The right solution for almost every application. One soldering process is enough, isn't it?


The SCHURTER Group is a globally successful Swiss family business. With our components ensuring the clean and safe supply of power, input systems for ease of use and sophisticated overall solutions, we impress our customers with agility and excellent product and service quality.

HAUPPAUGE, NY — Orbit International Corp., an electronics manufacturer and software solution provider, today announced that consolidated bookings for the month of November 2022 were approximately $3,700,000. Deliveries for some of these orders have already commenced and are expected to continue through the first quarter of 2024.

Mitchell Binder, President and CEO of Orbit International commented, “We are pleased to report that our consolidated bookings for the month of November were approximately $3,700,000. This firm booking month comes on the heels of orders received in excess of $5,000,000 for the month of October, representing our strongest booking month of 2022. Our Electronics Group (“OEG”) bookings were approximately $2,600,000 and were highlighted by three orders received by our Orbit Instrument Division, including (i) a $725,000 order for displays used on a U.S. Navy program; (ii) an approximately $475,000 order for keypads used on a major aircraft program; and (iii) a $365,000 engineering contract for switch panels used on multiple aircraft platforms. Other bookings were for keyboards and displays. Our OEG bookings also include approximately $830,000 in orders received by our Simulator Product Solutions LLC (“SPS”) subsidiary.

Binder added, “Bookings from our Power Group (“OPG”) were approximately $1,100,000 and were highlighted by orders for several power supplies utilizing our VPX technology, an additional follow-on order for a COTS power supply used on a major missile defense system and approximately $500,000 for several other programs utilizing both our COTS and commercial power supplies. In addition, we continue to work with a customer on a significant follow-on order utilizing our VPX power supply. However, although we expected to receive this award in 2022, it now appears this contract will not be received until sometime in 2023.”

Binder concluded, “We are happy to report that many of the contract awards that were being held up have begun to come to fruition in the current quarter. As mentioned, we are now expecting a large VPX award to be delayed into the first quarter of 2023 and other awards expected by our OEG will also be delayed into 2023. However, bookings for our OPG for the last three months have exceeded $4,200,000 and total orders for the Company for the first two months of this current fourth quarter have reached approximately $8,700,000, which positions us to potentially post one of our strongest consolidated booking quarters in the last several years. As previously noted, timing uncertainty in the receipt of contracts from our prime contractors doing business with the U.S government is an inherent factor in our industry.”

Orbit International Corp., through its Electronics Group, is involved in the development and manufacture of custom electronic device and subsystem solutions for military, industrial and commercial applications through its production facilities in Hauppauge, NY and Carson, CA. Orbit’s Power Group, also located in Hauppauge, NY, designs and manufactures a wide array of power products including AC power supplies, frequency converters, inverters, VME/VPX power supplies as well as various COTS power sources.

NORTHBROOK, IL ― Impossible Objects is pleased to announce that it has been selected for a 2022 SMT China Vision Award in the category of Wave Solder for its Wave Solder Pallets. With the SMT China Vision Award, Impossible Objects has won a total of five awards for its solder pallets.

Wave solder pallets and high temperature fixtures support the mass manufacturing process of printed circuit boards, resulting in tremendous cost benefits. They reduce setup time, improve solder flow, reduce bridging and solder skipping, eliminate labor intensive hand masking, reduce board warping and protect heat-sensitive components.

Pallets and fixtures require machining and skilled labor to produce. This traditional production process can be slow and expensive. Impossible Objects’ revolutionary Composite Based Additive Manufacturing (CBAM) is breaking that paradigm.

Impossible Objects 3D prints wave solder pallets and fixtures using carbon fiber reinforced with high temperature PEEK polymer. These materials provide excellent thermal and chemical resistance for the wave solder process. Impossible Objects customers report that its pallets withstand thousands of cycles without material degradation or warping.

SMT China magazine launched the SMT China Vision Awards in 2007 to recognize both international and domestic providers of SMT equipment, materials, software and services that have made outstanding contributions to the rapid growth of China's electronics manufacturing industry by their inventions and innovations.

To learn more about Impossible Objects, visit

PALO ALTO, CA — Arch Systems, the leading provider of machine data and analytics for electronics assembly operations, has been selected for a 2022 SMT China Vision Award in the category of Software – Process Control for its ArchFX Production Insights Suite.

“We are excited to be recognized as leading data experts for today’s electronics manufacturers by our industry colleagues,” said Arch CEO, Andrew Scheuermann. “We are encouraged to see so many manufacturers leaning into smarter uses of their data and we are delighted to be on this journey with them.”

Part of the ArchFX Platform, the Production Insights Suite surfaces entirely new and valuable insights for electronics manufacturers. These insights are providing ROI in the tens and hundreds of millions of dollars for manufacturing customers and are fundamentally improving the way they approach “data projects” overall.

The ArchFX Production Insights Suite contains core Insight Applications (analytics modules) including the Quality Application, Assembly Application, Test Application and React. These applications harness the combined powers of rich machine data, domain expertise and expert data analysis – empowering electronics manufacturers to reclaim 20-60 percent in valuable quality, performance and line utilization losses from their assembly, quality and test machines.

SMT China magazine launched the SMT China Vision Awards in 2007 to recognize both international and domestic providers of SMT equipment, materials, software and services that have made outstanding contributions to the rapid growth of China's electronics manufacturing industry by their inventions and innovations.

Arch has built the largest collaboration of industry domain experts working hand-in-hand with data scientists to constantly map new signals in the data, adding them to the ever-growing library of operational analytics and recommendations. These signals and recommendations are changing how manufacturers tackle their most complex problems, allowing them to simplify and align actions both on the shop floor and the top floor. Arch also is a recipient of the 2021 Global Technology and Mexico Technology Awards and 2022 NPI, Global Technology and Mexico Technology Awards.

The ArchFX Platform provides the machine connectivity, data management and advanced insights needed to achieve digital transformation across the manufacturing organization. For more information, visit

CLINTON, NY — Indium Corporation’s Global Head of e-Mobility and Infrastructure, Brian O’Leary, will co-chair a special panel discussion on e-Mobility on Thursday, January 26 from 10 a.m.–1 p.m. local time at IPC APEX Expo in San Diego, Calif., US.

Climate change, government policy, and consumers are rapidly driving the automotive industry towards an electrified future. The printed circuit board assembly (PCBA) manufacturing industry has a vital role to play in this transition. From longer mission profiles to higher voltages, PCBAs are required to work longer, harder, and at higher operating temperatures.

The special session, one of the first of its kind, will bring together key stakeholders from across the e-Mobility industry, including original equipment manufacturers (OEMs), their supply chain regulators, policy, and technology experts. It will consist of two parts, the first of which will address problems and challenges facing the industry. The second part will address solutions to those problems. Audience participation is highly encouraged.

Registration for the special session is included in the All Access or Full Technical Conference packages or can also be added as a Technical Conference Single Session Pass.

O'Leary is responsible for promoting Indium Corporation's full range of products and services for e- Mobility, which includes electric cars, trucks, eVTOLs, charging stations, etc. He joined Indium Corporation in 2014 and has more than 20 years of experience in the electronics industry. He authored two books on thermal profiling called Profiling Guide for Profitability and Profiling Guide for Six Sigma. He currently serves as the chair of the IPC e-Mobility Quality & Reliability Advisory Council. In addition to regular technical conference participation, he co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption and a high-profile industry stakeholder as a guest. In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape.

CAMBRIDGE, UK — A new wave of electronics manufacturing is on the horizon, driven forward by volatile energy prices and increasing demand for sustainability. With the electronics industry accounting for 4% of global greenhouse gas emissions, it requires substantial innovation to reduce its environmental footprint. Fortunately, this area has a lot of movement, with several potentially revolutionary technologies entering the scene. IDTechEx's "Sustainable Electronics Manufacturing 2023-2033" report explores the key opportunities for sustainable innovation and the most promising new manufacturing approaches. The report concentrates on the fundamental building blocks of electronics - printed circuit boards (PCBs) and integrated circuits (ICs).

Incentives for Sustainable Electronics

Sustainability within the semiconductor and electronics industries is being driven forward by government mandates and green investment initiatives. Increasingly relevant to the survival of traditional manufacturers is the conscious choice of the public to only purchase from, and even only work for, companies that prioritize sustainable practices.

Environmentalism is often perceived as an obstacle-laden with legislative red tape and burdensome disclosures. However, companies that embrace environmentalism reap long-term rewards, and as such, the negative perception is replaced by one of opportunity. The implementation of low-emission manufacturing processes or the adoption of material recycling and recovery schemes can be the financially astute choice presenting an opportunity to reduce costs associated with energy consumption, waste treatment, and superfluous steps. Prioritizing environmentalism keeps the industry ahead of the curve as legislation becomes stricter while positioning individual companies to benefit from designated ESG investment.

As energy prices rise globally, low temperature and rapid processing methods become more attractive. Some of these methods employ additive approaches that substantially cut waste by printing material only where needed. This spares manufacturers the costs and emissions associated with excess materials and etching required in traditional subtractive manufacturing. For example, switching to additive methods of PCB manufacturing can lower water consumption by up to 95% - an outcome that could save the sector hundreds of millions of liters of water annually.

IDTechEx's analysis expects additive manufacturing to be particularly significant to the scaling of flexible printed circuit boards. Flexible PCBs are an important part of the emerging electronics industry as they enable a wider variety of applications than conventional rigid electronics. Flexible PCBs inherently require an overhaul of traditional processing - for example, using plastic or paper rather than conventional FR substrates. Embracing a new technology enables scope for further changes, such as transitioning to new materials and additive methods. Low-temperature processing may also be imperative for PCBs made on plastics such as polyethylene terephthalate (PET), considering that these have relatively low heat tolerances.

Digitization for Smart Manufacturing

Sustainable electronics manufacturing presents many opportunities to be more efficient, reduce waste, and improve cost-effectiveness. Sustainable manufacturing can be facilitated through artificial intelligence and Internet of Things. Using smart digital manufacturing methods to automate processes and sensor technology to detect leaks and improper material usage can help companies minimize waste and cut down on excess costs.

Digital data analysis can help remove superfluous steps and illustrate where to focus efforts to eliminate excess material and energy consumption. Digitization is becoming increasingly popular, with many household name brands adopting similar measures. At the end of 2021, Apple announced it had joined Sustainable Semiconductor Technologies and Systems (SSTS) - a program created by the Belgian research institute, imec, to reduce the environmental impact of semiconductor manufacturing. Imec's SSTS program aims to improve sustainability by employing digital solutions that can assist in modeling less wasteful manufacturing methods. In addition to Apple, imec is also working with Microsoft and Amazon.


Reducing the carbon footprint of the electronics industry is a daunting task, particularly for well-established manufacturers that are reluctant to divert from traditional methods. Across the world, government and consumer pressure are forcing manufacturers to take on greater responsibility in reducing their emissions. IDTechEx believes that by embracing sustainable manufacturing methods, companies can benefit financially and demonstrate significant reductions in environmental impact. A comprehensive analysis and exploration of sustainable innovations within the field can be found in IDTechEx's report, "Sustainable Electronics Manufacturing 2023-2033".

This report analyses the many innovations aiming to make electronics manufacturing more sustainable and how they are being deployed. It examines the current status and latest trends in technology performance, supply chain, and manufacturing. It also identifies the key challenges, competition, and innovation opportunities within sustainable electronics manufacturing. IDTechEx has 20 years of expertise covering emerging technologies, including printed and flexible electronics. Our analysts have closely followed the latest developments in relevant markets, interviewed key players across the supply chain, attended conferences, and delivered consulting projects on the field.

To find out more about the IDTechEx report "Sustainable Electronics Manufacturing 2023-2033", please visit

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