North Attleboro, MA — April 2026 — DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, has expanded its manufacturing capabilities with the addition of in-house automated conformal coating, designed to support complex PCB assemblies and high-reliability applications.

As electronics continue to shrink in size while increasing in complexity, protecting assemblies from moisture, chemicals, and environmental stress has become more critical—and more challenging. Manual coating methods often introduce variability and slow production, particularly for dense, fine-pitch boards. DISTRON’s automated approach addresses those challenges with a fully integrated coating process that delivers consistent, repeatable results.

“At the board level, there’s very little margin for error anymore,” said Robert H. Donovan, CEO of DISTRON Corporation. “Bringing automated conformal coating in-house gives us tighter control over the process and better outcomes for our customers—especially on complex builds.”

The system, built around SCS (Specialty Coating Systems) technology, uses programmable selective coating to precisely apply materials while minimizing the need for manual masking. Integrated UV and thermal curing ensure coatings are applied and cured under controlled conditions, improving both quality and throughput.

With this capability, DISTRON can support a wide range of production volumes—from early-stage prototypes to full-scale manufacturing—without sacrificing accuracy or efficiency. The process is particularly well suited for industries where performance and durability are critical, including medical, aerospace and defense, industrial controls, and instrumentation.

Key advantages of DISTRON’s automated conformal coating include:

• Consistent, repeatable coverage across complex and high-density assemblies
• Reduced handling and process variability compared to manual methods
• Controlled curing for improved coating integrity and long-term performance
• Scalable processes that support both low- and high-volume production

In addition to conformal coating, DISTRON provides full-service electronics manufacturing, specializing in complex PCB assemblies and supporting customers from new product introduction through production. Its ISO-certified and FDA-compliant processes provide the traceability and quality assurance required for regulated industries.

“Customers are pushing designs further, and they need manufacturing partners who can keep up,” added Donovan. “This investment is about making sure we can handle that complexity while keeping quality consistent.”

For more information about DISTRON’s capabilities, visit www.DISTRON.com.

VERNON HILLS, IL ― April 2026 ― Eastek International Corporation announces the appointment of David A. Strabel as Vice President of Manufacturing. In this role, Strabel will lead global manufacturing operations, drive strategic growth initiatives, and further strengthen operational performance across Eastek’s electronics and full-system integration services.

Strabel brings more than 20 years of manufacturing and operations leadership experience within complex, fast-paced environments. He has a proven track record of scaling operations, improving profitability, leading high-performance teams, and implementing systems that support sustainable growth.

Most recently, Strabel served as Director of Operations at Cree Lighting in Racine, Wisconsin, where he managed daily operations for a manufacturing facility specializing in PCBA and lighting products. He led an operations team supporting more than 200 employees across electronics PCBA, powder coating, and assembly operations.

During his tenure, Strabel oversaw the production and testing of complex assemblies, partnered closely with R&D teams to accelerate product transitions from design to mass production, and established internal structures to support new contract manufacturing business. His leadership also included significant capital investment initiatives, negotiating equipment acquisitions, and driving measurable efficiency improvements across SMT operations.

Earlier in his career, Strabel held progressive technical and operational leadership roles at Eastek-ACT in Menomonee Falls. He supported equipment and process development in technical roles before advancing into management positions, including Production Supervisor and Manufacturing Manager. He led multi-shift manufacturing teams, supported global operations including collaboration with the company’s facility in Dongguan, China, and led continuous improvement initiatives such as ISO 13485 implementation, Kaizen events, and facility layout optimization. He was recognized with the company’s 2014 President’s Award for his leadership and operational achievements.

“David’s deep expertise in electronics manufacturing, combined with his strategic mindset and hands-on leadership style, makes him an outstanding addition to our executive team,” said Bill Boyer, COO and Executive VP, Eastek International. “His experience in scaling operations, improving performance metrics, and building strong teams will play a key role in supporting our customers and advancing our global growth strategy.”

Strabel holds multiple industry certifications, including SMTA Process Engineer, and has extensive training in lean manufacturing, advanced SMT programming, and strategic deployment processes. His core competencies include operational leadership, P&L management, KPI development, technology implementation, and cross-functional team alignment.

As Vice President of Manufacturing, Strabel will focus on strengthening operational excellence across Eastek’s global footprint, enhancing process standardization, and supporting customers in the medical, industrial, transportation, and energy sectors with high-quality, scalable manufacturing solutions.

For more information, visit www.eastekinternational.com.

MILPITAS, Calif. – April 1, 2026 – Worldwide 300mm fab equipment spending is expected to increase 18% to $133 billion in 2026 and 14% to $151 billion in 2027, SEMI reported today in its latest 300mm Fab Outlook. This strong growth reflects surging AI chip demand for data centers and edge devices, as well as the growing commitment to semiconductor self-sufficiency across key regions through localized industrial ecosystems and supply chain restructuring.

Looking further out, the report projects investment will continue to increase 3% to $155 billion in 2028 and another 11% to $172 billion in 2029, respectively.

“AI is resetting the scale of semiconductor manufacturing investment,” said Ajit Manocha, President and CEO of SEMI. “With global 300mm fab equipment spending projected to exceed $150 billion in 2027 for the first time, the industry is making historic, sustained commitments to the advanced capacity and resilient supply chains needed to power the AI era.”

Segment Growth

The Logic & Micro segment is expected to spearhead equipment expansion with $228 billion in total investments from 2027 to 2029 mainly due to strong foundry sector demand, driven by sub-2nm cutting-edge capacity investments. Advanced node technology is essential to enhance chip performance and power efficiency to meet rigorous chip design requirements for various AI applications. More advanced node technology is expected to enter volume production from 2027 to 2029. Additionally, AI performance improvements are anticipated to drive massive growth in various edge AI devices. Beyond advanced nodes, demand across all nodes and various electronics devices is anticipated to grow moderately, supporting investment in mature nodes as well.

The memory segment is projected to rank second in equipment spending, totaling $175 billion from 2027 to 2029. This period marks the start of a new growth cycle for the segment. Within the memory category, DRAM equipment spending is expected to reach $111 billion cumulatively from 2027 to 2029, while 3D NAND equipment spending is estimated to be $62 billion during the same time frame.

The demand for memory has significantly increased due to AI training and inference. AI training has notably driven up the demand for High Bandwidth Memory (HBM), while model inference has created substantial demand for storage capacity, thus boosting the growth of NAND Flash applications in data centers. This strong demand has led to sustained high levels of investment in the memory supply chain over the near and long term, helping to cushion potential downturns from traditional memory cycle fluctuations.

Regional Investment Trends

Global 300mm fab equipment investment is expected to remain broadly distributed across the major semiconductor manufacturing regions from 2027 to 2029, reflecting a mix of advanced-node expansion, memory capacity additions, and policy-supported supply chain localization. China, Taiwan, Korea, and the Americas are each expected to see substantial levels of spending during the period, while Japan, Europe & Middle East, and Southeast Asia also continue to expand investment from a smaller base.

In China, investment is expected to remain supported by ongoing domestic capacity expansion and national initiatives aimed at strengthening semiconductor manufacturing capabilities. In the Taiwan region, spending is projected to be driven primarily by continued expansion of leading-edge foundry capacity, including 2nm and sub-2nm technologies. Korea’s investment outlook remains closely tied to the memory sector, where AI-related demand is supporting another cycle of capacity and technology upgrades. In the Americas, spending is expected to be underpinned by advanced process expansion and broader efforts to strengthen domestic manufacturing ecosystems.

Japan, Europe & Middle East, and Southeast Asia are also expected to post meaningful growth through 2029. In these regions, equipment investment is supported by a combination of government incentives, supply chain resilience strategies, and targeted efforts to expand semiconductor manufacturing capacity.

Part of the SEMI Fab Forecast database, the SEMI 300mm Fab Outlook lists 404 facilities and lines globally. The report reflects 198 updates and 9 new fabs/lines projects since its last publication in December 2025.

For more information on the report or to subscribe, please contact the SEMI Market Intelligence Team at mktstats@semi.org. Details on SEMI market data are available at SEMI Market Intelligence.

Duluth, GA – Koh Young America, the industry leader in True 3D measurement-based inspection solutions, announced two changes within its North American organization. Dave Nemeth has been named Sr. Manager, Eastern Regional Sales, covering eastern Canada and key territories across the eastern and midwestern United States, while Mitchell Kim has been appointed Manager of Service & Applications for the U.S. & Canada.

Nemeth moves into his new role after more than 12 years as Koh Young’s service manager. He brings extensive practical experience from a range of electronics manufacturing services providers, from mid-tier companies to Tier 1 global organizations, including extended international assignments. A proud U.S. Air Force veteran, Nemeth has built a strong reputation for customer focus and a comprehensive understanding of manufacturing operations and their support requirements. In his new role, he will support customers in eastern Canada, the Midwest including Michigan, Wisconsin, Illinois, Indiana, Ohio, and Kentucky, the Northeast including New England, New York, New Jersey, and eastern Pennsylvania, and Florida, where he is based.

Kim steps into his expanded role after 15 years with Koh Young, having joined the company in 2011. Over that time, he progressed from field service into applications, later serving as applications team leader before taking on this broader management position. He holds a Bachelor of Science in Systems Engineering from the University of Arizona and brings deep technical knowledge along with extensive experience supporting customers across the region.

The appointments also create stronger regional alignment for customers in the U.S. and Canada. With Kim based in Duluth, Georgia, alongside Koh Young America's applications, training, and Help Desk teams, the company is better positioned to improve coordination, accelerate response, and provide more closely aligned support across service and process-related functions.

"These changes reflect the strength of our team and our commitment to developing talent from within," said Joel Scutchfield, General Manager of Koh Young America. "Dave has led our service organization with dedication for more than a decade, and his experience in the EMS environment gives him a strong foundation for this next step into regional sales. At the same time, Mitchell's progression shows the kind of growth we are proud to foster at Koh Young. It is a meaningful passing of the torch, and it also creates stronger regional alignment for our customers by bringing service and applications leadership closer to our Duluth-based support resources."

By aligning leadership more closely with regional resources and customer needs, Koh Young continues to strengthen the foundation for responsive support and long-term partnership across the electronics manufacturing industry. Together, these appointments reinforce the Koh Young commitment to the customer.