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TORRANCE, CA – Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce the next installment of its webinar series: “Wireless Strain Measurement Solutions for PCB Testing.” The live event will take place via Zoom on Aug 6, 2025 at 1:00 PM EST, and is now open for registration.

Register here: https://us02web.zoom.us/webinar/register/WN_vYPTfZHdSKm8eCijp_uOow

In PCB strain testing applications—especially involving large, complex boards—traditional wired strain gage systems often introduce excessive wiring, cost, and logistical challenges. This webinar will explore how wireless strain measurement technology offers a practical, scalable, and efficient alternative.

James Hara, a recognized expert from Kyowa Americas, will lead the session. Hara will walk attendees through the latest advancements in wireless telemetry systems, sharing real-world case studies that highlight their use in PCB assembly and mounting processes. The discussion will focus on how wireless solutions help reduce setup time, enhance flexibility, and simplify strain measurement across multiple testing channels.

Whether you’re working in design validation, process development, or production quality control, this webinar offers valuable insight into modernizing your mechanical stress testing with compact, wireless solutions.

“We’re excited to offer this timely and technical discussion as part of our continuing education efforts,” said Michelle Ogihara, Executive VP at Seika Machinery. “Wireless strain measurement is a game-changer for engineers working with large-format PCBs and high-density assemblies.”

James Hara is a Senior Applications Engineer with Kyowa Americas, specializing in mechanical stress analysis, strain gage systems, and sensor-based testing in electronics manufacturing. He brings years of hands-on experience and insight into real-world PCB assembly challenges.

For more information about Seika Machinery and its advanced solutions for electronics manufacturing, visit www.seikausa.com.

SHENZHEN, CHINA – Taking place from October 28 to 30, 2025, at the Shenzhen World Exhibition & Convention Center (Bao'an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities.

Featuring an ever-expanding showcase of automation equipment and technologies, the show empowers you to optimize your supply chain, reduce costs, and ensure quality and yield — all driving sustained growth in the electronics manufacturing industry.

Hundreds of New Product Launches

NEPCON ASIA 2025 will showcase hundreds of new products and solutions across SMT, testing and measurement, soldering, dispensing, semiconductor packaging, and automation. The show will feature over 600 leading exhibitors, including Yamaha, Hanwha, Fuji, Kurtz Ersa, Rehm, Tamura, Koh Young, TRI, ALEADER, Unicomp, Anda, and Axxon, connecting them with millions of buyers from high-growth sectors such as automotive electronics, semiconductors, and new energy.

The event aims to engage more than 2,000 buyers from emerging fields like low-altitude flight, embodied robotics, and AI, offering exhibitors invaluable exposure to new sectors.

Breakthrough Areas Driving Innovation

Several standout themed areas will debut, integrating industry resources and cutting-edge technologies, while showcasing packaging, testing, flexible manufacturing, assembly, and key components.

Key themed areas include:

  • AI Smart Glasses Disassembly Area
  • Flexible Manufacturing and Intelligent Transport System Area
  • Low-Altitude Flight Components Disassembly Area
  • Embodied Intelligence Robot Core Parts Disassembly Area
  • Electronic Finished Products Automated Packaging Demonstration Area
  • GBT & SiC Packaging and Testing Demo Line
  • Conferences Empowering Industry Growth

NEPCON ASIA 2025 will host 40 high-level conferences covering advanced manufacturing, semiconductors, power electronics, robotics, and AI, empowering businesses to explore future technologies and seize new growth opportunities.

The SMTA South China High-Tech Workshop will feature global experts from China, the US, Japan, and Thailand, providing forward-looking insights for businesses.

Connecting Global Markets

As China's technology and manufacturing hub, Shenzhen offers a complete electronics ecosystem and unmatched supply chain advantages, providing exhibitors and visitors with opportunities to access its thriving industry cluster.

Through collaborations with overseas industry associations across Southeast Asia, the event will organize factory tours, business matchmaking and overseas networking salons, fostering deeper integration between Chinese and global electronics manufacturers.

Visitor pre-registration is now open! Join NEPCON ASIA 2025 to capture new opportunities, explore emerging markets, and enhance global competitiveness.

CHINA – Viasion Technology Co., Ltd, a premier PCB manufacturer in China, is solidifying its position as a global partner for advanced electronics manufacturing services (EMS). Leveraging over 16 years of industry expertise, Viasion is empowering businesses worldwide with high-quality, cost-effective solutions in printed circuit board fabrication, turnkey PCB assembly, and comprehensive product development.

As demand grows for dependable, scalable, and innovative electronics, Viasion continues to stand out as a preferred China PCB supplier. Specializing in low-to-medium volume projects, the company offers unmatched flexibility, from prototyping to full-scale production, catering to diverse sectors such as automotive, industrial automation, medical devices, telecommunications, and consumer electronics.

“Our mission is to help companies bring cutting-edge electronics to market faster and more reliably,” said Ross Feng, spokesperson for Viasion Technology. “Whether it’s a complex multi-layer PCB or a complete electronic product, we pride ourselves on delivering exceptional quality, competitive pricing, and personalized support every step of the way.”

Key offerings include:

  • PCB Fabrication: From simple single-layer boards to intricate multi-layer designs, built to precise international standards.
  • PCB Assembly in China: Turnkey services covering sourcing, SMT & through-hole assembly, testing, and box build.
  • Custom Electronics Manufacturing Services: Tailored solutions from concept and design to mass production, ensuring rapid time-to-market.

Viasion’s state-of-the-art facilities in Shenzhen, Guangdong, coupled with strict quality systems, ensure that each project meets rigorous specifications and international certifications. As global businesses continue to seek reliable EMS partners, Viasion is uniquely positioned to support their growth with seamless, scalable manufacturing solutions.

CHINA – Viasion Technology Co., Ltd, a premier PCB manufacturer in China, is solidifying its position as a global partner for advanced electronics manufacturing services (EMS). Leveraging over 16 years of industry expertise, Viasion is empowering businesses worldwide with high-quality, cost-effective solutions in printed circuit board fabrication, turnkey PCB assembly, and comprehensive product development.

As demand grows for dependable, scalable, and innovative electronics, Viasion continues to stand out as a preferred China PCB supplier. Specializing in low-to-medium volume projects, the company offers unmatched flexibility, from prototyping to full-scale production, catering to diverse sectors such as automotive, industrial automation, medical devices, telecommunications, and consumer electronics.

“Our mission is to help companies bring cutting-edge electronics to market faster and more reliably,” said Ross Feng, spokesperson for Viasion Technology. “Whether it’s a complex multi-layer PCB or a complete electronic product, we pride ourselves on delivering exceptional quality, competitive pricing, and personalized support every step of the way.”

Key offerings include:

  • PCB Fabrication: From simple single-layer boards to intricate multi-layer designs, built to precise international standards.
  • PCB Assembly in China: Turnkey services covering sourcing, SMT & through-hole assembly, testing, and box build.
  • Custom Electronics Manufacturing Services: Tailored solutions from concept and design to mass production, ensuring rapid time-to-market.

Viasion’s state-of-the-art facilities in Shenzhen, Guangdong, coupled with strict quality systems, ensure that each project meets rigorous specifications and international certifications. As global businesses continue to seek reliable EMS partners, Viasion is uniquely positioned to support their growth with seamless, scalable manufacturing solutions.

Minneapolis, Minnesota – Nordson Test & Inspection today announced that smartTec will expand distribution of X-Ray and Test Solutions to include Denmark, Norway, Finland, Sweden, Latvia, Lithuania, and Estonia.

“To build on our strong partnership with Nordson Test & Inspection, we are pleased to expand our distribution of Nordson’s X-Ray and Test portfolio of inspection and metrology solutions in Scandinavia and Baltic countries,” said Lars Bøndergaard, Managing Director of smartTec Nordic A/S, “Nordson has a leading portfolio of differentiated solutions that deliver superior performance for our customers in both semiconductor and SMT markets and they continue to advance both system and software technologies incorporating machine learning (ML), deep learning (DL) and artificial intelligence (AI) to address next-generations applications.”

smartTec Nordic A/S is part of smartTec Gmbh, headquartered in Germany. The expansion of distribution of the X-Ray and Test solutions in Scandinavia and the Baltic countries builds on the strong multi-year partnerships and distribution of Nordson’s X-Ray and Optical inspection and Metrology systems in Europe.

For more information, visit www.nordson.com/testinspect or https://smarttec.de/

SAN JOSE, CA ― SHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging. The acquisition marks a significant step in SHENMAO’s strategic expansion into the advanced semiconductor and IC packaging market.

This milestone enhances SHENMAO’s vertical integration and reinforces its role as a key innovator and supplier for the growing global semiconductor ecosystem.
Founded in 2004, PMTC specializes in the development and manufacturing of high-end solder balls used in advanced packaging formats such as FCCSP (Flip Chip Chip Scale Packaging) and WLCSP (Wafer Level Chip Scale Packaging). PMTC is recognized globally by major IC design houses and packaging companies for its patented, high-reliability solder alloys that offer excellent ductility, thermal fatigue resistance, and drop performance.

The company brings in-house alloy development, application expertise, and a strong R&D foundation, positioning SHENMAO to accelerate innovation in semiconductor solder materials.

“The addition of PMTC to the SHENMAO Group gives us deeper access to the advanced packaging supply chain and adds new capacity, talent, and innovation in solder ball technology,” said Kelvin Li, General Manager of SHENMAO Group. “Together, we are committed to delivering high-performance materials for next-generation semiconductor applications.”

As part of its expanded focus on eco-conscious and high-reliability materials, PMTC has introduced a new patented low-temperature solder alloy, E4 (Sn47.875Bi+Ag+Cu+In+Ni), designed for temperature-sensitive assemblies and carbon-reducing manufacturing environments.
With a reflow peak temperature of ≤180°C, the E4 alloy supports lower energy consumption while maintaining the high reliability needed for consumer electronics, automotive, and advanced packaging applications.

Key Advantages of E4:

  • High Reliability: The alloy’s unique formulation—including Cu, Ni, and In—improves mechanical strength, creep resistance, and thermal cycling performance.
  • Controlled IMC Formation: Cu, Ni, and In form stable (Cu,Ni)₆(Sn,In)₅ intermetallic compounds, enhancing joint strength and long-term stability.
  • Superior Thermal Cycling Life: E4 outperforms standard Sn42Bi58 and Sn42Bi57Ag1 alloys in thermal cycling reliability and fatigue resistance.
  • Homogeneous Element Distribution: Bi remains concentrated within the solder ball, while reinforcing elements are evenly distributed at the joint interface to support stronger solder joints.

The alloy’s low melting point and stable microstructure make it ideal for low-temperature reflow processes in high-density assemblies, enabling better protection for sensitive components and contributing to lower carbon manufacturing goals.

For more information about PMTC, a subsidiary of SHENMAO, visit: www.pmtc.com.tw or contact: service@pmtc.com.tw.

To learn more about SHENMAO’s high-performance solder materials, visit www.SHENMAO.com.

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