CRANSTON, RI — July 2025 — Federal Electronics, a leader in providing advanced electronic manufacturing services, has strengthened the advanced cleaning capabilities of its Hermosillo, Mexico facility with the recent installation of a HydroJet Inline Cleaner from Austin American Technology (AAT). This investment supports the company’s ongoing expansion into high-reliability manufacturing for industries including aerospace, defense, medical, and industrial electronics.

The HydroJet system, designed and built in the U.S., is known for its robust, energy-efficient inline cleaning performance—capable of delivering consistent, high-purity results required for demanding assemblies. This new addition positions the Hermosillo facility to meet AS9100 cleanliness standards, a key milestone as the site prepares to support more complex, mission-critical programs.

“Adding the HydroJet system enhances our process capability and aligns with our goal to serve OEMs with increasing reliability and regulatory demands,” said Ed Evangelista, President of Federal Electronics. “It reflects our strategic growth into aerospace and defense while continuing to support our core customers in medical and industrial markets.”

Opened in 2010, the Hermosillo facility has become an essential part of Federal Electronics’ global operations, offering cost-effective, high-quality, nearshore manufacturing to OEMs across North America. The site employs over 350 skilled professionals and is fully integrated with the company’s Cranston, Rhode Island headquarters through a shared ERP and IT platform—ensuring consistency, transparency, and real-time coordination across locations.

Now fully equipped for AS9100 programs, the facility is positioned to serve a growing base of customers in the Midwest, Southwest, and Western U.S., offering a responsive, U.S.-aligned option for high-mix, high-reliability assembly.

“We continue to expand and invest in Hermosillo because it delivers what our customers need—flexibility, quality, and a trusted team,” added Evangelista. “The HydroJet is another example of how we’re scaling to stay ahead of our customers’ requirements.”

For more information on Federal Electronics and its manufacturing capabilities, visit www.federalelec.com or contact sales@federalelec.com.

TORRANCE, CA – Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce the next installment of its webinar series: “Wireless Strain Measurement Solutions for PCB Testing.” The live event will take place via Zoom on Aug 6, 2025 at 1:00 PM EST, and is now open for registration.

Register here: https://us02web.zoom.us/webinar/register/WN_vYPTfZHdSKm8eCijp_uOow

In PCB strain testing applications—especially involving large, complex boards—traditional wired strain gage systems often introduce excessive wiring, cost, and logistical challenges. This webinar will explore how wireless strain measurement technology offers a practical, scalable, and efficient alternative.

James Hara, a recognized expert from Kyowa Americas, will lead the session. Hara will walk attendees through the latest advancements in wireless telemetry systems, sharing real-world case studies that highlight their use in PCB assembly and mounting processes. The discussion will focus on how wireless solutions help reduce setup time, enhance flexibility, and simplify strain measurement across multiple testing channels.

Whether you’re working in design validation, process development, or production quality control, this webinar offers valuable insight into modernizing your mechanical stress testing with compact, wireless solutions.

“We’re excited to offer this timely and technical discussion as part of our continuing education efforts,” said Michelle Ogihara, Executive VP at Seika Machinery. “Wireless strain measurement is a game-changer for engineers working with large-format PCBs and high-density assemblies.”

James Hara is a Senior Applications Engineer with Kyowa Americas, specializing in mechanical stress analysis, strain gage systems, and sensor-based testing in electronics manufacturing. He brings years of hands-on experience and insight into real-world PCB assembly challenges.

For more information about Seika Machinery and its advanced solutions for electronics manufacturing, visit www.seikausa.com.

SHENZHEN, CHINA – Taking place from October 28 to 30, 2025, at the Shenzhen World Exhibition & Convention Center (Bao'an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities.

Featuring an ever-expanding showcase of automation equipment and technologies, the show empowers you to optimize your supply chain, reduce costs, and ensure quality and yield — all driving sustained growth in the electronics manufacturing industry.

Hundreds of New Product Launches

NEPCON ASIA 2025 will showcase hundreds of new products and solutions across SMT, testing and measurement, soldering, dispensing, semiconductor packaging, and automation. The show will feature over 600 leading exhibitors, including Yamaha, Hanwha, Fuji, Kurtz Ersa, Rehm, Tamura, Koh Young, TRI, ALEADER, Unicomp, Anda, and Axxon, connecting them with millions of buyers from high-growth sectors such as automotive electronics, semiconductors, and new energy.

The event aims to engage more than 2,000 buyers from emerging fields like low-altitude flight, embodied robotics, and AI, offering exhibitors invaluable exposure to new sectors.

Breakthrough Areas Driving Innovation

Several standout themed areas will debut, integrating industry resources and cutting-edge technologies, while showcasing packaging, testing, flexible manufacturing, assembly, and key components.

Key themed areas include:

• AI Smart Glasses Disassembly Area
• Flexible Manufacturing and Intelligent Transport System Area
• Low-Altitude Flight Components Disassembly Area
• Embodied Intelligence Robot Core Parts Disassembly Area
• Electronic Finished Products Automated Packaging Demonstration Area
• GBT & SiC Packaging and Testing Demo Line
• Conferences Empowering Industry Growth

NEPCON ASIA 2025 will host 40 high-level conferences covering advanced manufacturing, semiconductors, power electronics, robotics, and AI, empowering businesses to explore future technologies and seize new growth opportunities.

The SMTA South China High-Tech Workshop will feature global experts from China, the US, Japan, and Thailand, providing forward-looking insights for businesses.

Connecting Global Markets

As China's technology and manufacturing hub, Shenzhen offers a complete electronics ecosystem and unmatched supply chain advantages, providing exhibitors and visitors with opportunities to access its thriving industry cluster.

Through collaborations with overseas industry associations across Southeast Asia, the event will organize factory tours, business matchmaking and overseas networking salons, fostering deeper integration between Chinese and global electronics manufacturers.

Visitor pre-registration is now open! Join NEPCON ASIA 2025 to capture new opportunities, explore emerging markets, and enhance global competitiveness.

CHINA – Viasion Technology Co., Ltd, a premier PCB manufacturer in China, is solidifying its position as a global partner for advanced electronics manufacturing services (EMS). Leveraging over 16 years of industry expertise, Viasion is empowering businesses worldwide with high-quality, cost-effective solutions in printed circuit board fabrication, turnkey PCB assembly, and comprehensive product development.

As demand grows for dependable, scalable, and innovative electronics, Viasion continues to stand out as a preferred China PCB supplier. Specializing in low-to-medium volume projects, the company offers unmatched flexibility, from prototyping to full-scale production, catering to diverse sectors such as automotive, industrial automation, medical devices, telecommunications, and consumer electronics.

“Our mission is to help companies bring cutting-edge electronics to market faster and more reliably,” said Ross Feng, spokesperson for Viasion Technology. “Whether it’s a complex multi-layer PCB or a complete electronic product, we pride ourselves on delivering exceptional quality, competitive pricing, and personalized support every step of the way.”

Key offerings include:

• PCB Fabrication: From simple single-layer boards to intricate multi-layer designs, built to precise international standards.
• PCB Assembly in China: Turnkey services covering sourcing, SMT & through-hole assembly, testing, and box build.
• Custom Electronics Manufacturing Services: Tailored solutions from concept and design to mass production, ensuring rapid time-to-market.

Viasion’s state-of-the-art facilities in Shenzhen, Guangdong, coupled with strict quality systems, ensure that each project meets rigorous specifications and international certifications. As global businesses continue to seek reliable EMS partners, Viasion is uniquely positioned to support their growth with seamless, scalable manufacturing solutions.