SANTA ANA, CA ― April 2026 ― Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has strengthened its test capabilities with the recent purchase of the TAKAYA APT-1600FD-SL dual-sided flying probe test system, expanding its ability to support increasingly complex and high-reliability PCB assemblies.

The addition of the APT-1600FD-SL enables EMI to perform simultaneous probing on both sides of a board, significantly improving test coverage while reducing overall test time. Designed to handle larger PCBAs, the system is well suited for emerging applications such as 5G, battery management systems (BMS), and other high-density designs that demand precise, efficient validation.

“This investment gives us more flexibility and confidence when testing today’s complex boards,” said CM Chin, Vice President of Express Manufacturing, Inc. “We’re seeing larger form factors, tighter spacing, and higher performance requirements. This system helps us keep pace while maintaining the level of quality our customers expect.”

The APT-1600FD-SL features a 10 flying Z-axis probe design, allowing access to difficult test points that traditional systems may miss. Its dual-sided configuration not only increases coverage but also shortens test cycles—helping EMI improve throughput without compromising accuracy. Integrated laser profiling further enhances precision by compensating for board warpage prior to testing, ensuring consistent contact and reliable results.

For EMI customers, the benefits are immediate:

• Higher test coverage for complex and densely populated PCB assemblies
• Faster turnaround times driven by reduced test cycles and improved throughput
• Improved product quality through more accurate and repeatable testing
• Support for larger boards and next-generation applications

The system also incorporates advanced measurement capabilities and high-resolution vision inspection, enabling EMI to detect defects such as missing components, incorrect placement, and orientation issues earlier in the process.

“As designs continue to evolve, test has to evolve with them,” added Chin “This is about giving our customers the assurance that their products are fully validated before they leave our floor.”

The investment reflects EMI’s ongoing focus on building a robust, scalable manufacturing environment that supports both current production needs and future technologies.

For more information about Express Manufacturing, Inc. (EMI), email info@eminc.com or visit www.eminc.com.

North Attleboro, MA — April 2026 — DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, has expanded its manufacturing capabilities with the addition of in-house automated conformal coating, designed to support complex PCB assemblies and high-reliability applications.

As electronics continue to shrink in size while increasing in complexity, protecting assemblies from moisture, chemicals, and environmental stress has become more critical—and more challenging. Manual coating methods often introduce variability and slow production, particularly for dense, fine-pitch boards. DISTRON’s automated approach addresses those challenges with a fully integrated coating process that delivers consistent, repeatable results.

“At the board level, there’s very little margin for error anymore,” said Robert H. Donovan, CEO of DISTRON Corporation. “Bringing automated conformal coating in-house gives us tighter control over the process and better outcomes for our customers—especially on complex builds.”

The system, built around SCS (Specialty Coating Systems) technology, uses programmable selective coating to precisely apply materials while minimizing the need for manual masking. Integrated UV and thermal curing ensure coatings are applied and cured under controlled conditions, improving both quality and throughput.

With this capability, DISTRON can support a wide range of production volumes—from early-stage prototypes to full-scale manufacturing—without sacrificing accuracy or efficiency. The process is particularly well suited for industries where performance and durability are critical, including medical, aerospace and defense, industrial controls, and instrumentation.

Key advantages of DISTRON’s automated conformal coating include:

• Consistent, repeatable coverage across complex and high-density assemblies
• Reduced handling and process variability compared to manual methods
• Controlled curing for improved coating integrity and long-term performance
• Scalable processes that support both low- and high-volume production

In addition to conformal coating, DISTRON provides full-service electronics manufacturing, specializing in complex PCB assemblies and supporting customers from new product introduction through production. Its ISO-certified and FDA-compliant processes provide the traceability and quality assurance required for regulated industries.

“Customers are pushing designs further, and they need manufacturing partners who can keep up,” added Donovan. “This investment is about making sure we can handle that complexity while keeping quality consistent.”

For more information about DISTRON’s capabilities, visit www.DISTRON.com.

VERNON HILLS, IL ― April 2026 ― Eastek International Corporation announces the appointment of David A. Strabel as Vice President of Manufacturing. In this role, Strabel will lead global manufacturing operations, drive strategic growth initiatives, and further strengthen operational performance across Eastek’s electronics and full-system integration services.

Strabel brings more than 20 years of manufacturing and operations leadership experience within complex, fast-paced environments. He has a proven track record of scaling operations, improving profitability, leading high-performance teams, and implementing systems that support sustainable growth.

Most recently, Strabel served as Director of Operations at Cree Lighting in Racine, Wisconsin, where he managed daily operations for a manufacturing facility specializing in PCBA and lighting products. He led an operations team supporting more than 200 employees across electronics PCBA, powder coating, and assembly operations.

During his tenure, Strabel oversaw the production and testing of complex assemblies, partnered closely with R&D teams to accelerate product transitions from design to mass production, and established internal structures to support new contract manufacturing business. His leadership also included significant capital investment initiatives, negotiating equipment acquisitions, and driving measurable efficiency improvements across SMT operations.

Earlier in his career, Strabel held progressive technical and operational leadership roles at Eastek-ACT in Menomonee Falls. He supported equipment and process development in technical roles before advancing into management positions, including Production Supervisor and Manufacturing Manager. He led multi-shift manufacturing teams, supported global operations including collaboration with the company’s facility in Dongguan, China, and led continuous improvement initiatives such as ISO 13485 implementation, Kaizen events, and facility layout optimization. He was recognized with the company’s 2014 President’s Award for his leadership and operational achievements.

“David’s deep expertise in electronics manufacturing, combined with his strategic mindset and hands-on leadership style, makes him an outstanding addition to our executive team,” said Bill Boyer, COO and Executive VP, Eastek International. “His experience in scaling operations, improving performance metrics, and building strong teams will play a key role in supporting our customers and advancing our global growth strategy.”

Strabel holds multiple industry certifications, including SMTA Process Engineer, and has extensive training in lean manufacturing, advanced SMT programming, and strategic deployment processes. His core competencies include operational leadership, P&L management, KPI development, technology implementation, and cross-functional team alignment.

As Vice President of Manufacturing, Strabel will focus on strengthening operational excellence across Eastek’s global footprint, enhancing process standardization, and supporting customers in the medical, industrial, transportation, and energy sectors with high-quality, scalable manufacturing solutions.

For more information, visit www.eastekinternational.com.

MILPITAS, Calif. – April 1, 2026 – Worldwide 300mm fab equipment spending is expected to increase 18% to $133 billion in 2026 and 14% to $151 billion in 2027, SEMI reported today in its latest 300mm Fab Outlook. This strong growth reflects surging AI chip demand for data centers and edge devices, as well as the growing commitment to semiconductor self-sufficiency across key regions through localized industrial ecosystems and supply chain restructuring.

Looking further out, the report projects investment will continue to increase 3% to $155 billion in 2028 and another 11% to $172 billion in 2029, respectively.

“AI is resetting the scale of semiconductor manufacturing investment,” said Ajit Manocha, President and CEO of SEMI. “With global 300mm fab equipment spending projected to exceed $150 billion in 2027 for the first time, the industry is making historic, sustained commitments to the advanced capacity and resilient supply chains needed to power the AI era.”

Segment Growth

The Logic & Micro segment is expected to spearhead equipment expansion with $228 billion in total investments from 2027 to 2029 mainly due to strong foundry sector demand, driven by sub-2nm cutting-edge capacity investments. Advanced node technology is essential to enhance chip performance and power efficiency to meet rigorous chip design requirements for various AI applications. More advanced node technology is expected to enter volume production from 2027 to 2029. Additionally, AI performance improvements are anticipated to drive massive growth in various edge AI devices. Beyond advanced nodes, demand across all nodes and various electronics devices is anticipated to grow moderately, supporting investment in mature nodes as well.

The memory segment is projected to rank second in equipment spending, totaling $175 billion from 2027 to 2029. This period marks the start of a new growth cycle for the segment. Within the memory category, DRAM equipment spending is expected to reach $111 billion cumulatively from 2027 to 2029, while 3D NAND equipment spending is estimated to be $62 billion during the same time frame.

The demand for memory has significantly increased due to AI training and inference. AI training has notably driven up the demand for High Bandwidth Memory (HBM), while model inference has created substantial demand for storage capacity, thus boosting the growth of NAND Flash applications in data centers. This strong demand has led to sustained high levels of investment in the memory supply chain over the near and long term, helping to cushion potential downturns from traditional memory cycle fluctuations.

Regional Investment Trends

Global 300mm fab equipment investment is expected to remain broadly distributed across the major semiconductor manufacturing regions from 2027 to 2029, reflecting a mix of advanced-node expansion, memory capacity additions, and policy-supported supply chain localization. China, Taiwan, Korea, and the Americas are each expected to see substantial levels of spending during the period, while Japan, Europe & Middle East, and Southeast Asia also continue to expand investment from a smaller base.

In China, investment is expected to remain supported by ongoing domestic capacity expansion and national initiatives aimed at strengthening semiconductor manufacturing capabilities. In the Taiwan region, spending is projected to be driven primarily by continued expansion of leading-edge foundry capacity, including 2nm and sub-2nm technologies. Korea’s investment outlook remains closely tied to the memory sector, where AI-related demand is supporting another cycle of capacity and technology upgrades. In the Americas, spending is expected to be underpinned by advanced process expansion and broader efforts to strengthen domestic manufacturing ecosystems.

Japan, Europe & Middle East, and Southeast Asia are also expected to post meaningful growth through 2029. In these regions, equipment investment is supported by a combination of government incentives, supply chain resilience strategies, and targeted efforts to expand semiconductor manufacturing capacity.

Part of the SEMI Fab Forecast database, the SEMI 300mm Fab Outlook lists 404 facilities and lines globally. The report reflects 198 updates and 9 new fabs/lines projects since its last publication in December 2025.

For more information on the report or to subscribe, please contact the SEMI Market Intelligence Team at mktstats@semi.org. Details on SEMI market data are available at SEMI Market Intelligence.