Clemsa, a manufacturer based in Spain and part of the Italy-headquartered FAAC Technology Group, has transformed its electronics production capabilities through the installation of a new Europlacer SMT placement line. Facing the challenge of producing a wide variety of access control products in a competitive and fast-changing market, Clemsa sought a solution that would increase flexibility, reduce production and inventory costs, and improve overall quality.
“We needed to expand our production capacity in terms of product diversity, not volume,” said Miguel Angel Lopez, CEO of Clemsa. “With Europlacer, we can produce exactly what we need at any time, without delays or extensive reconfiguration. That has helped us dramatically reduce both production and inventory costs while staying highly competitive.”
Clemsa manufactures electronics for access systems, including automatic doors, remote control units, RFID cards, and control boards. With 20 to 30 distinct products in active production, frequent changeovers and fast response times are critical. The Europlacer platform delivers exceptional component feeder capacity, allowing all components to remain loaded and ready. Changeovers take just 10 minutes, compared to 30–40 minutes with other brands – up to a 75% improvement.
“We simply switch programs and adjust the conveyor width — the line is instantly ready,” explained Luis Miguel, Production Manager at Clemsa. “This level of agility helps us maintain efficiency despite a complex product mix.”
One key advantage has been Europlacer’s integration of a bulk feeder for battery contactors, a component used across multiple Clemsa products. During the selection process, Clemsa requested as a prerequisite that the machine be capable of positioning battery clips, served in bulk in large bags. This component needed to be fed from a hopper that, by means of vibration, would advance to the picking area, allowing the pick and place machine to position it from there. Unlike other systems that require separate handling or third-party solutions, Europlacer integrated this functionality directly into the machine, increasing accuracy and reliability during assembly, and was the only provider that Clemsa engaged with that could meet this requirement.
The hopper was sent to the Europlacer factory where it was revised and its feeding system improved. Crucially, it was converted into an intelligent hopper with connection to Europlacer’s RC software, thereby optimising the feeding process, efficiency, and reliability. Similar bespoke solutions have been developed by Europlacer for other customers, such as automatic feeding of LED lenses.
Clemsa also praised Europlacer’s support and training services. “Their engineers have been knowledgeable and always available,” added Luis. “From installation to training, the experience has been outstanding.”
When evaluating solutions, Clemsa compared multiple SMT equipment providers. Ultimately, Europlacer stood out for its flexibility, ease of use, and commitment to automation — all of which aligned perfectly with Clemsa’s manufacturing goals.
“If another manufacturer were considering their options, I’d simply invite them to visit us,” said Miguel. “They will see the speed, flexibility, and most importantly, the consistent quality we achieve with Europlacer. In my opinion, it is an easy decision.”
Minneapolis, Minnesota – Nordson Test & Inspection today announced plans to unveil advanced technology at SEMICON Taiwan, scheduled to take place at TaiNex in Taipei at booth #12326 from September 10-12, 2025. The company will demonstrate state-of-the-art Optical, X-Ray and Acoustic Inspection and Metrology systems and unveil the new Auto Centering Sensor (ACS). Additionally, across technology platforms, the advanced Nordson Intelligence AI Ecosystem will be featured. Nordson Test & Inspection is a platinum sponsor.
Front-End Semiconductor Solutions
Nordson will be unveiling for the first time, the Auto Centering System™ (ACS), which is an extension of the wireless, WaferSense® sensor portfolio designed for capturing and analyzing real-time data for effective semiconductor tool set-up and maintenance. The wafer-shaped ACS “sees” inside equipment to capture dimensional offset data (x,y and z) to quickly center wafer transfer positions.
The recently launched next-generation Auto Gapping Sensor™ (AGS2) will also be featured. The AGS2 speeds non-contact gap measurements and parallelism adjustments under vacuum, improving uniformity, tool availability and repeatability in a thinner and lighter form factor.
Mid-End Semiconductor Solutions
The SpinSAM™ Acoustic Micro Imaging Inspection (AMI) system sets a new benchmark in the industry with its high throughput and superior sensitivity, enabling precise defect detection for Wafer-Level and Advanced Packaging applications including bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, and over-molded wafers. Using an innovative spin-scanning method, the system scans up to four 300mm wafers simultaneously, achieving an impressive speed of 41 wafers per hour. This breakthrough scanning capability, combined with best-in-class defect capture and image quality, enhances both productivity and accuracy in semiconductor inspection. It is Designed for 100% inspection, as well as edge scanning that targets defect prone areas, optimizing data acquisition where it is needed most.
The XM8000™ Automated X-Ray Metrology (AXM) system is powered by the QuadraNT tube and detector capable of 2D, 2.5D and 3D measurements of micron scale features with superior resolution. The system is designed for high-throughput metrology and defect review for optically hidden features, including voiding, fill levels, overlay and critical dimensions in Wafer-Level, Panel-Level and Advanced Packaging applications such as CoWoS, TSVs, 2.5 and 3D IC packaging and wafer bumps.
The 4800 INTEGRA Plus is the next generation automated bond test solution designed to meet the dynamic wafer-level packing environment. With its new motion, vision, and wafer handling system complemented by the high-throughput Paragon software, the system offers best-in-class micro bump and trace bond testing on chip-on-wafer, stacked wafer, and molded wafer applications. The system demonstrates unmatched precision, hands-free, and fully traceable bond testing capability for both 200 and 300mm wafers enabled by a smart load port and wafer chuck, and Matrix Map software.
Back-End Semiconductor Solutions
The advanced SQ7000™+ Multi-Function system for AOI, SPI and CMM is designed to address next-generation applications such as advanced packaging, socket metrology, and memory among other high-end applications. This cutting-edge technology enables highly accurate, high-speed inspection and metrology, with an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that eliminates reflection-based distortions common with shiny and specular surfaces. The SQ7000+ inspects for defects, and measures critical parameters in seconds with a comprehensive coordinate measurement software suite.
The newly launched SQ3000™M2 Inspection and Metrology system, designed for micro-electronics applications including wire bonds, provides superior performance with unparalleled accuracy and resolution. Powered by Focus Variation Metrology (FVM) technology and high resolution telecentric optics, the system provides exceptional defect coverage and metrology capabilities.
Dynamic Planar CT™ is the next-generation of 3D Planar X-Ray inspection software for our Automated X-Ray Inspection (AXI) systems that reveals incredible details, superior data quality, and clear layer separation, powered by a new 3D reconstruction algorithm. Dynamic Planar CT is ideal for any 3D electronics inspection application, but excels in the semiconductor market for inspection of flip chip micro bumps. Dynamic Planar CT will be demonstrated on Nordson’s XS-3 AXI system. The performance is significantly advanced providing a larger field of view and up to 2× faster image acquisition than classical Planar CT. These speed enhancements yield faster cycle times and greater throughput, while also crucially reducing sample radiation dose.
Setting a new industry benchmark for 3D/2D manual inspection for back-end semiconductor applications, the Quadra® 7 Pro MXI system revolutionizes the inspection experience with its revolutionary Onyx® detector technology. This advancement ensures exceptional image clarity and low noise. The Dual Mode Quadra NT4® tube provides unprecedented flexibility offering both brightness and resolution modes, enabling operators to seamlessly transition between them according to specific application requirements. Revalution™ software elevates the user experience with easy-to-use, expanded functionality that enables quicker decision-making and improved overall productivity.
The Gen7 AMI system powered by C-SAM technology, provides fast and highly accurate inspection for detecting delamination and voiding with the most sophisticated microscope. Ideal for lab analysis and specialized high-resolution applications.
Advanced ML, DL and AI
Nordson Test & Inspection is at the forefront, advancing Machine Learning (ML), Deep Learning (DL) and Artificial Intelligence (AI) all under the Nordson Intelligence ecosystem. The latest advancement in the ecosystem is Nordson Sight, a complete SPC solution offering full-fledged machine-level to factory-level SPC capability, historical analysis and reporting tools across technology platforms. Nordson Sight provides complete traceability for effective process verification and control, to improve yields and processes. Effectively monitor how well manufacturing processes are running with comprehensive yield analysis charts, coupled with defect analysis tools that enable quick diagnostics and corrective action.
Visitors to the Nordson Test & Inspection booth at SEMICON Taiwan can discover the latest best-in-class inspection and metrology solutions that improve semiconductor yields, processes and productivity.
For more information, visit www.nordson.com/testinspect.
CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials, is pleased to announce the appointment of Covermat Co., Ltd. as its official distributor in Thailand.
Founded in 2014 and headquartered in Bangkok, Covermat is a rapidly growing industrial distributor specializing in advanced materials and adhesive technologies. The company serves a wide range of sectors, including electronics, automotive, home appliances, and medical devices, providing technical support and tailored solutions across Southeast Asia.
Covermat’s reputation for deep market expertise and strong customer relationships makes them an ideal partner to support the growing demand for AIM’s innovative solder materials in the region. The company’s local warehousing, multilingual sales teams, and ability to closely engage with engineering teams at customer sites ensure reliable and responsive support for OEMs, EMS providers, and converters.
“We’re excited to welcome Covermat to the AIM Solder global distribution network,” said David Suraski, President, Assembly Materials Division at AIM. “Their technical strength, customer-first philosophy, and strong track record in Southeast Asia align perfectly with AIM’s commitment to delivering high-performance soldering solutions and localized support around the world.”
AIM’s comprehensive line of solder pastes, bar solder, wire solder, fluxes, and specialty materials will now be more accessible to manufacturers in Thailand through Covermat’s established network and logistics capabilities.
Key Largo, FL & Hatboro, PA – Automated Production Equipment (APE), a trusted supplier of high-performance soldering and rework systems, proudly announces a strategic partnership with Manncorp, a leading provider of Surface Mount Technology (SMT) production equipment. This collaboration brings together two industry leaders to deliver expanded, end-to-end SMT solutions to electronics manufacturers across North America.
The partnership combines APE’s extensive experience in precision soldering, rework, and thru-hole technologies with Manncorp’ s robust portfolio of SMT placement, stencil printing, inspection systems and turnkey production lines. Together, the companies aim to streamline the equipment procurement process, improve technical support, and offer more flexible, scalable solutions to OEMs, contract manufacturers, and R&D facilities.
“Our customers are looking for trusted partners who can deliver complete SMT solutions with responsive, knowledgeable support,” said Casey Scheu, President of APE. “Partnering with Manncorp allows us to expand what we offer while maintaining the personalized service and technical expertise APE is known for.”
“Manncorp already offers fully integrated turnkey SMT production lines,” said Henry Mann, CEO of Manncorp. “Partnering with APE allows us to expand that offering even further with one of the industry’s most comprehensive rework equipment portfolios. We’re excited to align with a team that shares our commitment to innovation, reliability, and customer service; giving our customers the widest range of solutions from one trusted source.”
As part of the partnership, both companies will collaborate on joint marketing initiatives, co-host live demonstrations, and expand cross-training among technical teams. Customers will benefit from simplified purchasing processes, unified technical support, and access to a wider range of high-quality SMT equipment tailored to their specific needs.
For more information about available equipment and services, visit www.ape.com and www.manncorp.com.
With its commitment to innovation and growth through employee development, Indium Corporation today announced the promotions of Andy Seager to Associate Director, Continental Sales (EMEA), and Karthik Vijay to Senior Technical Manager (EMEA). These advancements reflect their contributions to the company’s continued innovative efforts with customers across Europe, the Middle East, and Africa (EMEA).
Seager has more than 30 years of experience in the electronics manufacturing industry, spanning a broad range of roles, including production, quality assurance, and process engineering. As Associate Director, Continental Sales (EMEA), he leads the EMEA Field Sales and Inside Sales teams to ensure a seamless approach to engaging with Indium Corporation’s customers, fostering stronger partnerships and delivering superior service. Previously, he was the European Sales Manager responsible for growing soldering product sales throughout EMEA, including solder paste, solder preforms, fluxes, and thermal interface materials.
With more than 20 years of experience in electronics assembly, Vijay brings a customer-focused approach to product innovation. As Senior Technical Manager (EMEA), Vijay is responsible for technology programs and technical support for Indium Corporation’s EMEA customers. Previously, he was responsible for applications support for North American West Coast customers. His expertise spans automotive, industrial, and RF verticals, involving PCBA and power electronics with a focus on materials technology, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials.
“Andy’s exceptional expertise, strategic insight, and proven track record will be invaluable as we continue to expand our presence across Europe, the Middle East, and Africa. Karthik’s deep technical expertise and global mindset are pivotal in advancing our capabilities across automotive and power electronics assembly markets within the broader push for electrification and decarbonization,” said Indium Corporation Managing Director, European Operations, Brian Craig. “Together, they will play a pivotal role in Indium Corporation’s continued growth and operational excellence as we enhance customer engagement and drive materials science innovation throughout the region.”
Seager earned his degree at Farnborough College of Technology, specializing in value creation and delivery, marketing, sales, and business finance. He has also completed Miller Heiman large account management and channel management programs and is currently studying with the World Class Manager (WCM) program.
Vijay holds a master’s degree in industrial engineering with a specialization in electronics packaging and manufacturing from State University of New York at Binghamton. He also has a Lean Six Sigma Green Belt certification and is a Certified SMT Process Engineer.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
Larger substrate sizes for AI, network switch, and server CPUs are driving the development of new package structures as well as materials and processes for substrate fabrication. One of the major concerns with a large substrate is warpage; other concerns include material sets to support the larger body size, including thermal interface materials to help dissipate heat. TechSearch International’s latest Advanced Packaging Update examines these trends and includes a section on thermal interface materials (TIMs) under development for large body packages.
The Update also examines substrate material shortages, including glass fiber for the core and Bismaleimide Triazine (BT) resin for a variety of substrate types. Underlying causes for the shortages are discussed, along with alternatives for these materials.
An update on glass core substrates examines progress and highlights challenges in developing the technology. Trade-offs are examined. A particular advantage of the glass core is the potential for a thinner core than with existing glass cloth materials, but a core thickness of 1.0 mm may be necessary to meet reliability requirements. High-performance applications will require 11 or more build-up layers, and so far only three or four build-up layers on each side have been fabricated in test vehicles. There is little published reliability data for glass core substrates, and cost compared to alternatives is unavailable.
TechSearch International’s annual survey on substrate design rules is presented, featuring coverage of laminate flip chip BGA and CSP substrate suppliers worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. Core and resin materials offered by each substrate supplier are listed. OSAT financials are highlighted.
The Update is a 100-page report with full references and a set of more than 90 PowerPoint slides.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of ~20,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch International at tel: 512-372-8887 or see www.techsearchinc.com. Follow us on LinkedIn.