Press Releases
MacDermid Alpha to Present Technical Paper at SMTA China South Technical Conference 2021 in Shenzhen
(Waterbury, CT USA) – July 27, 2021 - The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will be presenting a technical paper: “The Interaction of Two Solder Paste Alloys With 5 Surface Finishes” at the SMTA China South Technical Conference taking place from August 25 - 26 in Shenzhen, China.
June 30, 2021 ― Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials is proud to be celebrating its 85th anniversary.
TORONTO, CANADA -- Bittele Electronics Inc., a Toronto-based Turn-key PCB manufacturer specializing in prototype and low-to-mid volume printed circuit board (PCB) assembly, announced today it is now offering Free Passive Parts in its online ordering system. Any passive part on a Turnkey order's bill of materials (BOM) with a direct match to a part number in Bittele’s inventory will be automatically provided to a customer, free of charge.
AUBURN HILLS, MI – July 2021 – The Murray Percival Company, the leading supplier to the Midwest's electronics industry, is pleased to announce their Summer Cleaning Sale on select MicroCare and Techniglove products so that you can clean and protect your facility and staff. Head to their webstore now to take advantage of this deal before it’s gone!
CHATSWORTH, CA – July 27, 2021 – NEOTech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets, is proud to announce receiving the Town of Westborough’s Outstanding Achievement in Stormwater Management & Water Quality Award at its Westborough, MA site. This award highlights NEOTech’s commitment to the corporate responsibility and diligence of being environmentally conscious. The Westborough team met and exceeded the Town of Westborough’s stringent requirements for stormwater management and water quality.
High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.
