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RONKONKOMA, NEW YORK ― January 2026 ― Surf-Tech Manufacturing Corp., a multi-faceted provider of contract manufacturing services, has strengthened its ability to support customers with complex advanced packaging and microelectronics programs through the addition of the ViTrox V510i Smart 3D Automated Optical Inspection (AOI) system.

The new system enables Surf-Tech to deliver greater inspection accuracy, improved defect detection, and more consistent quality for customers working with increasingly miniaturized, reflective, and high-density assemblies. By incorporating real 3D measurement and high-speed inspection, the ViTrox V510i allows issues to be identified earlier in the process, helping customers improve yield, reduce rework, and maintain tighter process control.

Designed specifically for advanced packaging applications, the ViTrox V510i provides reliable inspection of lead frames, die, wire bonds, and mirror or highly reflective components—areas where traditional inspection methods often struggle. Its high-accuracy 3D imaging ensures consistent results even for challenging microelectronics features.

The system also supports real-time closed-loop feedback and data cross-referencing, enabling Surf-Tech to correlate inspection data across processes and respond quickly to trends. This data-driven approach helps customers benefit from improved traceability, faster root-cause analysis, and more stable production outcomes.

“Adding the ViTrox V510i allows us to better meet the inspection demands our customers face as packaging technologies continue to advance,” said Stephen Eggart, President, Surf-Tech Manufacturing. “It strengthens our ability to deliver reliable, repeatable quality for advanced and high-reliability applications.”

Surf-Tech Manufacturing supports customers with surface mount and through-hole assembly, box build, BGA rework, and electro-mechanical integration. The company is ISO 9001:2015 certified, ITAR registered, and builds to IPC-A-610 Class 2 and Class 3 standards, providing customers with confidence in quality, compliance, and consistency across a wide range of programs.

For more information, visit www.surftechmfg.com.

Altus Group, a leading distributor of capital equipment in the UK and Ireland, has supported Cambertronics, an ambitious contract electronics manufacturer celebrating 35 years in 2026, in upgrading its SMT production with the installation of a Koh Young Solder Paste Inspection (SPI) system.

Looking to further enhance first-pass yield and reduce the chances of costly rework, Cambertronics partnered with Altus to implement the advanced Koh Young KY8030-3 3D inspection solution. The KY8030-3 system features dual-projection 3D technology that eliminates shadow-related measurement errors, real-time PCB warp compensation, and delivers inspection speeds of 91.2 cm² per second. These capabilities enable precise volumetric measurements of solder paste deposits, allowing for the detection of issues such as bridging, insufficient solder, and misalignment at an early stage.

Jasper Whitefield, Business Development Manager at Cambertronics, said: “It is exciting to get the Koh Young unit into our facility, a significant enhancement to ensuring the highest quality output for our customers. More importantly, it allows us to keep our first-time right as high as possible, minimising time spent on rework and enabling us to focus on value-added internal activities.

“In a competitive market, we strive to achieve maximum success, and making these strategic investments is crucial to reaching that goal. We had heard a lot about Koh Young beforehand and their market-leading position, so having this technology in our facility shows our intent to maintain those high standards.”

Joe Booth, CEO of Altus Group, said: “We are always pleased to welcome another Koh Young user, especially one that recognises the critical role of SPI in process control. Unlike AOI, which detects defects after they occur, SPI helps address root causes, making it a vital investment. Cambertronics’ decision to select the KY8030-3 was a very astute one.”
With Altus Group’s support and Koh Young’s cutting-edge technology, Cambertronics continues to enhance its quality and process control capabilities to meet the evolving demands of the electronics manufacturing industry.

For further information, visit www.altusgroup.co.uk.

KINGSPORT, Tenn., Jan. 20, 2026 – Ben Maulorico has joined Insight Polymers & Compounding, a leading innovator of advanced polymer compounds, as business development manager. In his new role, he will focus on growing Insight Polymers’ compound resins business with OEMs and injection molders, as well as in direct printers and filament 3D printers.
He brings to his new position more than 30 years of experience in the plastics industry, working for compounders, resin manufacturers and additive manufacturers serving the oil & gas, energy, air filtration, lawn & garden, electronics and aircraft industries. He specialized in engineered resins for wear and friction and conductive applications.

Prior to joining Insight Polymers, Maulorico served as territory manager with Flambeau, Inc. and Osterman and Company. He has worked also for GE Plastics, Millennium Chemicals, The RTP Company and Technetics Group.

Maulorico earned a bachelor’s degree in business marketing at Bowling Green State University and a master’s in business at Cleveland State University.

About Insight Polymers

Insight Polymers & Compounding is a polymer processing and custom compounding operation in Northeast Tennessee focused on fully formulated systems, product development services and proprietary masterbatches. The company understands not only the engineering but the chemistry involved in polymeric materials, processing, testing and evaluation. Insight Polymers was founded and is managed by A.J. Pasquale and Jeremy Lizotte, both Ph.D. material scientists. Along with senior staff, they have more than 100 years of industrial experience in polymer materials including formulated adhesives and coatings, thermoplastics, elastomers and polymer processing. For more information please visit: https://insightpolymers.com

Yamaha Robotics Corporation has integrated its European liaison office, "Apic Yamada German Liaison Office (AGL)," into Yamaha Motor's European subsidiary, "YAMAHA MOTOR EUROPE N.V. German Branch Office, Robotics Business (YME)," effective January 1, 2026. This integration aims to further accelerate the development of the SEMI business (semiconductor back-end processes) in the European market.

Consequently, YME will now provide comprehensive total solutions encompassing not only electronic component mounting (SMT) and industrial robots (FA), but also semiconductor back-end processes (SEMI).

Following the integration, we will strengthen our sales support and service structure in
Europe. By maximizing the comprehensive capabilities of the Yamaha Motor Group, we will
deliver faster and higher-quality services. Building on the information gathering and sales
support previously handled by AGL, we will leverage synergies across the SMT, FA, and
SEMI businesses to further enhance our presence in the European market.

Under this new structure, we promise to create value that exceeds our customers' expectations and build deeper partnerships. We sincerely appreciate your continued support.

Manassas, VA – January 20, 2026: As electronics continue to evolve toward finer features and more advanced packaging, manufacturers face growing challenges in ensuring effective removal of flux residues. A newly released white paper, “Impact of Solder Powder Size on Cleaning Efficiency in Chip Resistor Assemblies for Future Advanced Packaging,” explores how solder powder size directly influences defluxing performance and long-term reliability.

Co-authored by Principal Engineer Ravi Parthasarathy in collaboration with Heraeus, the study investigates residue cleaning efficacy across advanced assemblies, including chip resistors, MLFs, and BGAs, and the impact of solder powder sizes and cleaning process conditions. The research was presented at both the IMAPS Symposium and the Electronics Packaging Technology Conference (EPTC).

Through a series of controlled experiments, the study evaluates aqueous-based defluxing processes under defined conditions, examining variables such as solder powder size, cleaning chemistry selection, conveyor speed, and process concentration. Solder powder sizes T5 (25–15 µm), T6 (15–5 µm), and T7 (11–2 µm) were systematically tested using assemblies containing MLF-68, BGA-208, and resistors of varying sizes.

The findings reveal that finer solder powders contain higher flux activator content, resulting in increased residue accumulation and significantly greater cleaning complexity, particularly under low-standoff components where access is restricted. Visual inspection following standardized defluxing processes confirmed that no single cleaning chemistry or process configuration is universally effective across all powder sizes.

The white paper concludes that one-size-fits-all cleaning approaches are insufficient for advanced semiconductor packaging. Instead, manufacturers must carefully align defluxing chemistry and process parameters with solder powder selection to achieve reliable residue removal and support long-term product performance.

The full white paper is now available for download at https://hubs.la/Q03_6LcR0.

North Attleboro, MA — January 2026 — DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, has today announced a strategic partnership with Keiron Printing Technologies that positions DISTRON as the first company in North America to deploy Keiron’s industrial HF2 LIFT-based precision solder paste printer.

This investment represents a major step in DISTRON’s ongoing commitment to advanced manufacturing, digital transformation, and sustainable production within the U.S. electronics supply chain. By adopting Keiron’s LIFT technology, DISTRON is eliminating traditional constraints associated with stencil-based printing while gaining unmatched precision, flexibility, and speed across prototyping and production.

Key advantages of the LIFT platform include:

  • Digital, non-contact solder paste deposition with exceptional accuracy
  • Zero tooling and zero material waste
  • Faster NPI cycles and accelerated time-to-market
  • Superior performance for fine-pitch, high-density, and complex assemblies
  • Enhanced support for reshoring and domestic manufacturing initiatives

“This investment reinforces DISTRON’s position as a technology leader in the U.S. EMS market,” said Robert H. Donovan, CEO of DISTRON Corporation. “Keiron’s LIFT platform allows us to respond faster, manufacture smarter, and deliver the precision our customers increasingly expect.”

Keiron’s expansion into North America through Keiron Technologies USA provides DISTRON with direct access to global innovation while strengthening domestic manufacturing capabilities. “DISTRON’s leadership and technical vision make them the ideal partner for introducing LIFT technology to the U.S. market,” said Brian Duffey, President of Keiron Technologies USA. “Their commitment to innovation sets a powerful example for the industry.”

“DISTRON’s early adoption demonstrates what is possible when manufacturers embrace fully digital production,” added Paul Rooimans, CEO of Keiron Printing Technologies. “This installation marks a defining moment for advanced electronics manufacturing in North America.”

With this deployment, DISTRON establishes a new benchmark for precision, sustainability, and agility in U.S. electronics manufacturing—reinforcing its role as a trusted partner for customers seeking next-generation assembly solutions.

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