ORLANDO, FL – March 18, 2026 – The 76th annual IEEE Electronic Components and Technology Conference (ECTC) will be held from May 26-29, 2026 at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, FL. The premier international event for semiconductor packaging, components, and microelectronic systems, ECTC 2026 will bring together more than 2,000 scientists and engineers for an exchange of technical information and breakthrough research.

ECTC 2026 is the flagship conference of the IEEE Electronics Packaging Society, delivering a technical program of more than 450 papers in 41 technical sessions, including five interactive presentations, one of which is a student session; 12 special sessions on selected topics; a series of 16 CEU-approved professional development opportunities; more than 130 exhibits representing industry-leading product and service companies from around the world; and multiple social events and student outreach activities to provide networking opportunities.

Topics in the ECTC 2026 program include advanced packaging technologies such as wafer-level and fan-out packaging, 2.5D, 3D & heterogeneous integration, interposers, advanced substrates, materials modeling, reliability, interconnections, packaging for high-speed and high-bandwidth, photonics, quantum electronics, as well as flexible and printed electronics.

“Advanced packaging has evolved from a back-end protection process into a front-line enabler of system-level innovation,” said Bora Baloglu, ECTC 2026 technical program chair and director of business development at Intel Foundry Services. “These technologies are now essential for driving the massive computing power required for AI infrastructure, data centers, and high-performance computing (HPC).”

The 2026 IEEE Electronic Components and Technology Conference program highlights include:

Keynote Address: Wednesday, May 27
Advanced Packaging & the Future of System Optimization, by Dr. Tien Wu, CEO of Advanced Semiconductor Engineering (ASE).

As global AI infusion redefines performance, power, and integration requirements, advanced packaging is at the forefront of semiconductor innovation. As chip architecture complexity increases, the industry is progressing beyond device-level scaling toward system-level optimization. Advances in heterogeneous integration and packaging-enabled co-design are shaping more efficient, scalable, and resilient systems. Moving forward, system-centric strategies that align architecture, packaging, and collaboration across the ecosystem will be paramount to shaping the golden era of AI and semiconductors.

Special Sessions: Tuesday, May 26 – Friday, May 29
ECTC 2026 includes a series of Special Sessions, which feature industry experts discussing technology status and roadmaps in key areas of interest, including:
• Quantum Infrastructure for AI Applications: Packaging Challenges and Roadmap
• New Packaging Technologies Enabled By Panel Level Integration • AI-Enabled Electronic Design Automation for Multi-Physics Advanced Packaging
• Photonics-Based Systems for AI and Exascale Computing
• System Integration Challenges of Large-Size and High-Power Components for High-Performance Computing and AI Applications
• Electrical-Thermal-Mechanical Co-Design in High-Performance Packaging
• Enabling Next-Generation Advanced Packaging Technology from Wafer to Panel
• Innovative Materials for Advanced Packaging – Materials for Packaging, Integration, and Performance
• IEEE EPS Seminar: Redefining System Integration – The Rise of Organic Substrates in the Chiplet Era
• ECTC 2026 Plenary Session: Efficiency Is Not Enough – Are We Solving the Wrong Problem in the Data Center Energy Use?
• IEEE EPS President’s Panel: Data Centers in the Age of AI – Challenges and Solutions

Student Innovation Challenge: Wednesday, May 27
Six winning student teams will have the opportunity to attend ECTC 2026 with financial assistance. Students in bachelor’s and master’s programs will compete on the topic:
• Low-cost Robust Thermal Solution for High Power AI/Datacenter Processor
PhD students will compete in one of two topics:
• Materials, Interfaces, & Processes for Ultra-Scalable Interconnects
• Electromigration Solutions for BGA Interconnects in AI-Focused Packages

Startup Competition: Thursday, May 28
Under the theme “The Light Age: Strategic Investment in Photonics to Power the Next Computing Era,” startup companies will pitch their innovative ideas to a panel, followed by audience Q&A, jury deliberation, and then awards and a networking event.

Professional Development Courses: Tuesday, May 26
In addition to the technical program, ECTC 2026 offers 16 Professional Development Courses (PDCs). These four-hour courses on relevant electronic packaging topics are taught by world-class experts, enabling participants to broaden their technical knowledge base. Attendees will be awarded either CEU (continuing education units) or PDH (professional development hours) credits. These courses are offered in conjunction with the co-located IEEE ITherm Conference, which focuses on thermal/thermomechanical issues in electronic systems.

Further information about ECTC 2026
For registration and other information, please visit: https://ectc.net/registration/

Carlsbad, CA, USA – 17 March 2026 - Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, today announced an expanded distribution partnership with Assembly Products, Inc., a subsidiary of Blackstone Global, Inc.,, extending sales and support coverage across the United States and Canada for their equipment used in electronics manufacturing and advanced packaging.

Under the new agreement, Assembly Products’ distribution scope also expands beyond its nearly 30 years of supporting ASYMTEK precision dispensing and conformal coating solutions to now include MARCH plasma systems and the SELECT selective soldering product line.

This broadened agreement strengthens Nordson Electronics Solutions’ ability to support more customers by leveraging Blackstone Global’s extensive North American distributor network, and their deep technical expertise.

“With the growth of electronics manufacturing and back-end packaging in the United States, this expanded partnership positions us to meet the increased demand more effectively while continuing to deliver high-value, customized solutions,” said Evelyn Landsberger, Director of Sales, Americas, Nordson Electronics Solutions. “This new partnership will strengthen support for our customers across North America.”

Assembly Products, Inc. will serve as an authorized distributor for Nordson Electronics Solutions in the United States and Canada, with the exception of California, New Mexico, Arizona, and Texas, where Nordson Electronics Solutions will continue to operate through its direct sales organization. In addition to sales and service, Assembly Products, Inc. will play a key role in supporting customization requirements to maintain the high level of tailored solutions that Nordson Electronics Solutions customers expect.

The Nordson Electronics Solutions Americas sales team is working closely with the Assembly Products team to implement partnership structures and ensure a successful transition for customers affected by the change. Both organizations are committed to clearly communicating the Nordson value proposition and maintaining a customer first focus across all solutions and services.

About Assembly Products, Inc. a subsidiary of Blackstone Global

Assembly Products, Inc. is a distributor and manufacturers' representative firm servicing the electronics, industrial, and medical device assembly markets, as a division of Blackstone Global, Inc., a holding company. They focus on adding value to their customers’ manufacturing processes through applications engineering support, service, and technical sales expertise. The team brings deep technical knowledge, and their extensive North American distributor network delivers consistent customer support. Assembly Products, Inc. is a strong strategic partner for Nordson Electronics Solutions’ next phase of growth.

About Nordson Electronics Solutions

Nordson Electronics Solutions makes reliable electronics a reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, electronics, and precision assembly manufacturers with the innovative fluid dispensing, conformal coating, plasma treatment, and selective soldering solutions their products need to protect sensitive electronics and deliver a lifespan of reliability. Day after day, year after year, across the globe, for over 40 years, we've provided engineering and applications excellence to help our customers succeed.

About Nordson Corporation

Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework through an entrepreneurial, division-led organization to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end-market exposure includes consumer non-durable, medical, electronics and industrial end markets. Founded in 1954 and headquartered in Westlake, Ohio, the Company has operations and support offices in over 35 countries. Visit Nordson on the web at www.nordson.com.

New Britain, Connecticut, March 16, 2026 — MicroCare announces the appointment of Dr. Uwe Wanner, MBA, as Director of Research & Development. In this role, Wanner will lead the company’s global R&D strategy, advancing innovation, regulatory excellence, and product development to support continued growth in precision cleaning and fluid technology solutions.

Dr. Wanner brings more than 20 years of regional and international leadership experience across R&D, regulatory strategy, laboratory operations, and product commercialization. He has led global scientific teams, built innovation centers, and guided organizations from concept through successful market launch.

At MicroCare, Wanner will oversee the innovation pipeline, direct formulation and product development, strengthen regulatory strategy, and support scalable manufacturing processes while collaborating closely with cross-functional teams.

Prior to joining MicroCare, he held senior leadership roles at Drew Marine, Symbiotic Research (Tentamus Group), and Arysta LifeScience. He holds a Doctorate from The University of Bonn and an MBA from Fairfield University, graduating top of his class.

“Uwe’s combination of scientific depth, strategic vision, and global leadership experience will play a critical role in ensuring our continued innovation and long-term growth,” said Venesia Hurtubise, VP of Technology & Compliance at MicroCare. “His ability to translate complex scientific challenges into scalable commercial solutions aligns perfectly with our mission to deliver precision chemistry with confidence.”

Commenting on his new role, Wanner said, “I am excited to join MicroCare and contribute to a culture that values expertise, creativity, and innovation. Together, we will continue to strengthen the company’s product portfolio and support customers with reliable, forward-thinking solutions.”

For more information about MicroCare and its advanced cleaning and fluid technologies, visit microcare.com.

Global tablet shipments declined by around 3% QoQ and 4% YoY in Q4 2025, marking a clear step into a more mature phase for the market, according to Counterpoint Research’s latest Global Tablet Market Tracker. This growth followed a stronger Q3 and a high comparison base in the prior year, when Q4 2024 shipments had grown nearly 8% YoY as the market rebounded on the back of leading OEMs like Apple and Samsung returning to more regular launch cycles, and the rapid expansion of Chinese OEMs.

For full-year 2025, the market remained in the mid-100-million-unit range, signaling a shift toward a steadier replacement-driven trajectory. As the category matures, premium products and deeper ecosystem integration are becoming increasingly important, with leading vendors placing greater emphasis on value creation and long-term user engagement rather than chasing short-term shipment spikes.

Within this digestion phase, most OEMs prioritized cleaner channels and healthier economics over aggressive unit growth. Inventory was managed more tightly, promotions were more measured, and brands leaned into higher-value products where they had clearer strengths, from Apple’s premium productivity-oriented iPads to Android vendors’ higher-end tablets with stylus and ecosystem integration. Apple stood out in this environment – iPad’s global ASP rose from $527 in Q3 2025 to $583 in Q4 2025, underscoring the continued strength of the premium segment and Apple’s ecosystem. Meanwhile, Android vendors focused on stabilizing demand by reinforcing mid-range price bands and expanding productivity features such as keyboard and stylus support while maintaining strong coverage in value segments. Supply-side signals, including a pullback in tablet display panel shipments, also pointed to normalization rather than a large build ahead of 2026.

Looking ahead, the global tablet market is expected to face renewed pressure in 2026 as rising memory prices weigh on the economics of mid-range and entry-level devices, particularly for Android vendors. While shipments may soften in the near term, demand is expected to gradually stabilize as component costs normalize and replacement cycles resume. The continued shift toward premium and productivity-oriented tablets should also help support a more replacement-driven market structure over time. The latest iPad Air, launched in the first quarter of 2026, further strengthens the premium‑leaning segment of the market by offering a refreshed option between flagship Pro models and base iPads that maintains robust performance and memory configurations at broadly consistent price points, giving cost‑conscious upgraders an accessible premium choice and helping Apple defend a richer premium mix and relatively stable iPad shipments even as rising memory costs pressure the broader tablet category.

About Counterpoint Research

Counterpoint Research is a global market research firm specializing in products across the technology ecosystem. We advise a diverse range of clients – from smartphone OEMs to chipmakers and channel players to Big Tech – through our offices located in the world's major innovation hubs, manufacturing clusters and commercial centers. Our analyst team, led by seasoned experts, engages with stakeholders across the enterprise – from the C-suite to professionals in strategy, analyst relations (AR), market intelligence (MI), business intelligence (BI), product and marketing – to deliver services spanning market data, industry thought leadership and consulting. Our core areas of coverage include AI, Automotive, Consumer Electronics, Displays, eSIM, IoT, Location Platforms, Macroeconomics, Manufacturing, Networks and Infrastructure, Semiconductors, Smartphones and Wearables. Visit our Insights page to explore our publicly available market data, insights and thought leadership, and to understand our focus, meet our analysts and start a conversation.