Press Releases
CYPRESS, CALIFORNIA – February 2026 – Hanwha Semitech Americas announced the appointment of Marin Coronado Mendoza as General Manager of Hanwha Semitech Mexico, where he will lead the company’s operations, sales, and customer support across the region.
Based in Guadalajara, Marin Coronado brings more than 25 years of experience in electronics manufacturing, surface mount technology (SMT), and capital equipment leadership in Mexico and the United States. In his new role, he will focus on strengthening Hanwha Semitech’s presence in Mexico, supporting manufacturers with local expertise, and expanding regional service and sales capabilities.
Prior to joining Hanwha Semitech, Marin Coronado served as Mexico North Territory Sales Manager at ASMPT USA SMT, where he managed sales operations across Northern Mexico, supporting more than 80 customer accounts. During his tenure, he drove multimillion-dollar capital equipment sales, led cross-border logistics and technical support efforts, and worked closely with customers on equipment evaluations, demonstrations, and long-term production strategies.
Earlier in his career, he spent over 12 years as General Manager for ASM Assembly Systems Mexico, overseeing national operations, engineering, sales, service, and full P&L responsibility. Under his leadership, ASM expanded its market presence in Mexico and strengthened customer relationships across high-volume and high-reliability manufacturing sectors. His background also includes engineering manager and leadership roles at Sanmina and Siemens Siplace, where he began his career as a field service engineer and technical support.
Marin Coronado holds a degree in Electrical and Electronic Engineering from the Universidad de Guadalajara.
“Mexico continues to be a critical manufacturing hub for electronics and advanced assembly,” said Marin Coronado, General Manager of Hanwha Semitech Mexico. “I’m excited to work closely with our customers and partners to support their production goals with the speed, service, and technical depth they expect from Hanwha.”
Hanwha Semitech Americas provides advanced SMT placement systems, automation solutions, and smart factory technologies to electronics manufacturers worldwide, supporting applications across automotive, industrial, medical, aerospace, and high-reliability markets.
For more information about Hanwha Semitech, visit www.hanwhasemitech.com/en/
About Hanwha Semitech Americas:
Hanwha Semitech Americas is a leading global provider of precision manufacturing and technology solutions. Renowned for its innovative approach and cutting-edge technology, Hanwha Techwin is committed to driving advancements in the electronic manufacturing industry, supporting manufacturers worldwide in their pursuit of global competitiveness.
TEMPE, AZ – Benchmark Electronics, Inc. has entered into an employment agreement with David Moezidis, who will assume the role of President and Chief Executive Officer effective March 31, 2026, according to a recent filing with the Securities and Exchange Commission. Moezidis, 54, will also serve on the company’s board of directors during his tenure as CEO.
The agreement, dated February 19, sets Moezidis’s annual base salary at $900,000. He will be eligible for an annual target cash bonus equal to 115% of his base salary, with a maximum bonus opportunity of 200%.
In February 2026, Moezidis will receive equity awards valued at $2.5 million, divided evenly between time-based restricted stock units and performance stock units. Upon taking office as CEO, he will receive an additional $1.5 million in equity awards, also split evenly between time-based and performance-based units. The time-based awards will vest in three equal annual installments, subject to continued employment, while performance stock units will vest over three years based on the same performance criteria applied to other executive officers in 2026.
Under the terms of the agreement, if Moezidis’s employment is terminated without cause or he resigns for good reason, he will receive a lump-sum payment equal to two times the combined value of his base salary and target bonus, along with a pro-rated annual bonus and pro-rated vesting of equity awards. If such termination occurs within 24 months following a change in control, severance increases to three times the total cash amount, and all outstanding equity awards will vest at target levels.
The agreement also provides for accelerated vesting of awards in the event of death and includes two-year non-compete and non-solicitation provisions following termination.
ATLANTA, GA – ECIA has issued a follow up Industry Alert from its Global Industry Practices Committee (GIPC) experts to update members on last Friday’s U.S. Supreme Court tariff ruling. The U.S. Supreme Court has ruled that the International Emergency Economic Powers Act (IEEPA) does not authorize the imposition of tariffs. As a result, tariffs enacted under IEEPA authority have been invalidated, and the collection of those duties is being halted. This decision may affect ECIA member companies that import electronic components, subassemblies, or finished electronic products. This alert covers the component categories impacted and how companies might respond.
“The ECIA GIPC teams are working to keep our members informed and up to date,” ECIA VP of Industry Practices Christine Wolnik commented. “We will be hosting a webinar on tariffs on March 4th to highlight the Supreme Court ruling and provide an opportunity to answer questions. Look for details and an invitation soon."
While recognizing the need to balance global trade and support U.S. manufacturing, ECIA has taken the position that tariffs have imposed significant and uneven challenges on the component channel. ECIA is committed to monitoring the situation and providing members with the latest information for timely decision making.
View the complete ECIA Industry Alert and learn more about tariffs here.
Brooksville, FL – February 2026 – Interconnect Cable Technologies Corporation (ICTC), a global contract manufacturer, has launched a new Value-Added Services page on its website, outlining an expanded range of testing and analytical capabilities now available to customers.
The updated section at www.ictcusa.com provides a clear overview of services ICTC can perform today, with additional capabilities—including parylene coating—expected to be added in the coming months.
Current Value-Added Services include:
- Dye & Pull Testing: A destructive method used to uncover hidden cracks and weak solder interfaces, particularly beneath area-array packages such as BGAs, CSPs, and LGAs. The process provides visual confirmation of solder joint integrity and helps pinpoint potential failure locations.
- Flying Probe Testing: A fixtureless electrical test solution well suited for prototypes and low- to medium-volume production. By eliminating the need for dedicated test fixtures, flying probe testing reduces upfront cost and lead time while still delivering meaningful electrical coverage.
- Microsectioning / Cross-Section Analysis: A detailed internal examination technique used to evaluate PCB structures, plated holes, connectors, and cable/harness terminations. Through precision cutting and microscopic inspection, ICTC can identify voids, cracks, plating irregularities, and other internal conditions not visible from the surface.
- Salt Fog Environmental Exposure Testing: An accelerated corrosion test designed to evaluate coatings, finishes, and assemblies exposed to salt-laden environments. This testing supports customers building products for harsh operating conditions.
“Customers often need more than a pass/fail result,” said Rob Ogilbee, CFO of ICTC USA. “They need data they can act on. These services give them a clearer picture of what’s happening inside their boards and assemblies.”
The new web page consolidates these offerings in one place, making it easier for manufacturers to understand the scope of ICTC’s capabilities and determine which services align with their program requirements.
To view the full list of ICT’s value-added services, visit: https://www.ictcusa.com/what-we-do/value-added-services/
SAN JOSE, CA ― February 2026 ― Green Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor and AI hardware markets, has significantly enhanced real-time manufacturing visibility and operational control following its implementation of Cetec ERP nearly two years ago.
The web-based ERP platform was deployed as part of a strategic initiative to unify business systems, improve cross-functional transparency, and support the company’s continued growth in high-reliability and regulated markets.
Since implementation, Green Circuits has strengthened shop floor visibility, streamlined quoting and order processing, improved inventory accuracy and material traceability, and enhanced document and quality management workflows. The centralized platform integrates ERP, MRP, CRM, and QMS functionality into a single system, enabling departments to access consistent, real-time data across sales, engineering, manufacturing, quality, and finance.
“Implementing Cetec ERP has given us greater transparency across the organization,” said Mark Evans, Chief Operating Officer. “Real-time access to production, materials, and quality data allows us to make faster decisions, respond more effectively to customer requirements, and maintain strong process control as we scale.”
The system’s web-based architecture supports Green Circuits’ dynamic production environment, including prototype-to-production transitions, engineering change management, and strict documentation requirements. Enhanced traceability and integrated quality controls further strengthen compliance capabilities for aerospace, medical, and other high-reliability sectors.
As demand continues to grow in complex electronics manufacturing, the ERP platform provides the infrastructure necessary to scale operations while maintaining discipline, accountability, and process consistency.
“Our investment in Cetec ERP was about building a stronger operational foundation,” added Evans. “It allows us to improve efficiency internally while delivering greater predictability and responsiveness to our customers.”
Green Circuits provides end-to-end electronics manufacturing services, including design support, PCB fabrication, assembly, testing, and box build, supporting both prototype and full-scale production programs.
For more information about Green Circuits, visit www.greencircuits.com.
Eindhoven, Netherlands — February 2026 — Keiron Printing Technologies, a global innovator in advanced electronics manufacturing solutions, has appointed Yankee Soldering Technology as its authorized sales representative for the New England region. The partnership covers Connecticut, Rhode Island, Maine, Massachusetts, New Hampshire, and Vermont, and will support the regional introduction and adoption of Keiron’s LiFT (Laser-Induced Forward Transfer) technology, including the company’s latest system, the Keiron HF2 LiFT Printer.
Yankee Soldering Technology is a sales organization dedicated to helping New England manufacturers compete on a global scale. With strong regional relationships and a technical, process-driven approach aligned with high-performance SMT environments, Yankee Soldering will represent Keiron’s LiFT platform to manufacturers seeking greater control, flexibility, and consistency in solder paste deposition.
Keiron’s LiFT technology replaces traditional stencil- and nozzle-based solder paste deposition with a laser-driven, non-contact digital process. By eliminating stencils, nozzles, ejectors, and other mechanical contact points, LiFT removes a major source of process variability while directly addressing one of the most common contributors to assembly defects: inconsistent solder paste application.
The Keiron HF2 LiFT Printer enables precise, repeatable solder paste deposition down to nanoliter volumes while working with standard solder pastes and accepting common CAD, Gerber, and ODB++ file formats. This allows manufacturers to implement digital solder paste printing without changing materials or disrupting established workflows. With no stencils to fabricate, clean, or store, changeovers can be completed in minutes, making the HF2 particularly well suited for high-mix, low-volume, and NPI-focused production.
A key differentiator of the HF2 is its integrated Solder Paste Volume Metrology (SPVM), which measures every deposit in real time during the printing process. This built-in verification improves first-pass yield and reduces rework and scrap without requiring a separate SPI system. The contactless architecture also avoids common reliability challenges such as clogging, mechanical wear, and alignment drift associated with conventional printing methods.
“Yankee Soldering brings deep regional knowledge and a strong technical mindset that aligns well with how LiFT technology is deployed on the factory floor,” said Brian Duffey, President of Keiron Technologies USA. “Their experience supporting high-mix and advanced SMT operations makes them an excellent partner as we expand LiFT adoption across New England.”
For more information about Yankee Soldering Technology, visit www.yankeesoldering.com.
For more information about Keiron’s industry revolutionizing technology, visit www.keirontechnologies.com.
