Press Releases
KINGSPORT, Tenn., Jan. 20, 2026 – Ben Maulorico has joined Insight Polymers & Compounding, a leading innovator of advanced polymer compounds, as business development manager. In his new role, he will focus on growing Insight Polymers’ compound resins business with OEMs and injection molders, as well as in direct printers and filament 3D printers.
He brings to his new position more than 30 years of experience in the plastics industry, working for compounders, resin manufacturers and additive manufacturers serving the oil & gas, energy, air filtration, lawn & garden, electronics and aircraft industries. He specialized in engineered resins for wear and friction and conductive applications.
Prior to joining Insight Polymers, Maulorico served as territory manager with Flambeau, Inc. and Osterman and Company. He has worked also for GE Plastics, Millennium Chemicals, The RTP Company and Technetics Group.
Maulorico earned a bachelor’s degree in business marketing at Bowling Green State University and a master’s in business at Cleveland State University.
About Insight Polymers
Insight Polymers & Compounding is a polymer processing and custom compounding operation in Northeast Tennessee focused on fully formulated systems, product development services and proprietary masterbatches. The company understands not only the engineering but the chemistry involved in polymeric materials, processing, testing and evaluation. Insight Polymers was founded and is managed by A.J. Pasquale and Jeremy Lizotte, both Ph.D. material scientists. Along with senior staff, they have more than 100 years of industrial experience in polymer materials including formulated adhesives and coatings, thermoplastics, elastomers and polymer processing. For more information please visit: https://insightpolymers.com
Yamaha Robotics Corporation has integrated its European liaison office, "Apic Yamada German Liaison Office (AGL)," into Yamaha Motor's European subsidiary, "YAMAHA MOTOR EUROPE N.V. German Branch Office, Robotics Business (YME)," effective January 1, 2026. This integration aims to further accelerate the development of the SEMI business (semiconductor back-end processes) in the European market.
Consequently, YME will now provide comprehensive total solutions encompassing not only electronic component mounting (SMT) and industrial robots (FA), but also semiconductor back-end processes (SEMI).
Following the integration, we will strengthen our sales support and service structure in
Europe. By maximizing the comprehensive capabilities of the Yamaha Motor Group, we will
deliver faster and higher-quality services. Building on the information gathering and sales
support previously handled by AGL, we will leverage synergies across the SMT, FA, and
SEMI businesses to further enhance our presence in the European market.
Under this new structure, we promise to create value that exceeds our customers' expectations and build deeper partnerships. We sincerely appreciate your continued support.
Manassas, VA – January 20, 2026: As electronics continue to evolve toward finer features and more advanced packaging, manufacturers face growing challenges in ensuring effective removal of flux residues. A newly released white paper, “Impact of Solder Powder Size on Cleaning Efficiency in Chip Resistor Assemblies for Future Advanced Packaging,” explores how solder powder size directly influences defluxing performance and long-term reliability.
Co-authored by Principal Engineer Ravi Parthasarathy in collaboration with Heraeus, the study investigates residue cleaning efficacy across advanced assemblies, including chip resistors, MLFs, and BGAs, and the impact of solder powder sizes and cleaning process conditions. The research was presented at both the IMAPS Symposium and the Electronics Packaging Technology Conference (EPTC).
Through a series of controlled experiments, the study evaluates aqueous-based defluxing processes under defined conditions, examining variables such as solder powder size, cleaning chemistry selection, conveyor speed, and process concentration. Solder powder sizes T5 (25–15 µm), T6 (15–5 µm), and T7 (11–2 µm) were systematically tested using assemblies containing MLF-68, BGA-208, and resistors of varying sizes.
The findings reveal that finer solder powders contain higher flux activator content, resulting in increased residue accumulation and significantly greater cleaning complexity, particularly under low-standoff components where access is restricted. Visual inspection following standardized defluxing processes confirmed that no single cleaning chemistry or process configuration is universally effective across all powder sizes.
The white paper concludes that one-size-fits-all cleaning approaches are insufficient for advanced semiconductor packaging. Instead, manufacturers must carefully align defluxing chemistry and process parameters with solder powder selection to achieve reliable residue removal and support long-term product performance.
The full white paper is now available for download at https://hubs.la/Q03_6LcR0.
North Attleboro, MA — January 2026 — DISTRON CORPORATION, a leading U.S.-based electronics contract manufacturer, has today announced a strategic partnership with Keiron Printing Technologies that positions DISTRON as the first company in North America to deploy Keiron’s industrial HF2 LIFT-based precision solder paste printer.
This investment represents a major step in DISTRON’s ongoing commitment to advanced manufacturing, digital transformation, and sustainable production within the U.S. electronics supply chain. By adopting Keiron’s LIFT technology, DISTRON is eliminating traditional constraints associated with stencil-based printing while gaining unmatched precision, flexibility, and speed across prototyping and production.
Key advantages of the LIFT platform include:
- Digital, non-contact solder paste deposition with exceptional accuracy
- Zero tooling and zero material waste
- Faster NPI cycles and accelerated time-to-market
- Superior performance for fine-pitch, high-density, and complex assemblies
- Enhanced support for reshoring and domestic manufacturing initiatives
“This investment reinforces DISTRON’s position as a technology leader in the U.S. EMS market,” said Robert H. Donovan, CEO of DISTRON Corporation. “Keiron’s LIFT platform allows us to respond faster, manufacture smarter, and deliver the precision our customers increasingly expect.”
Keiron’s expansion into North America through Keiron Technologies USA provides DISTRON with direct access to global innovation while strengthening domestic manufacturing capabilities. “DISTRON’s leadership and technical vision make them the ideal partner for introducing LIFT technology to the U.S. market,” said Brian Duffey, President of Keiron Technologies USA. “Their commitment to innovation sets a powerful example for the industry.”
“DISTRON’s early adoption demonstrates what is possible when manufacturers embrace fully digital production,” added Paul Rooimans, CEO of Keiron Printing Technologies. “This installation marks a defining moment for advanced electronics manufacturing in North America.”
With this deployment, DISTRON establishes a new benchmark for precision, sustainability, and agility in U.S. electronics manufacturing—reinforcing its role as a trusted partner for customers seeking next-generation assembly solutions.
January 2026 ― Cranston, Rhode Island USA – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the appointment of Angel Lopez as Technical Support Engineer.
Duluth, January 15th, 2026 – Viscom Inc. will showcase its latest AI-based inspection solution vAI ProVision at APEX Expo 2026, taking place from March 17–19, in Anaheim, California. Visitors can experience live demonstrations at Booth 2836.
A highlight of the show is Viscom’s new software solution vAI ProVision. Programming AOI and AXI systems manually requires significant time and specialized expertise. This often delays commissioning, increases costs, and limits flexibility due to dependency on experienced specialists. These challenges can quickly become bottlenecks, slowing down production and reducing overall efficiency.
vAI ProVision, the AI-assisted feature in Viscom’s vVision Software, creates fully functional inspection programs for AOI and AXI fast, without compromising on inspection depth. This innovation reduces setup time and operator workload while simultaneously increasing quality, process reliability, and throughput. The software feature is designed for electronics manufacturers of all sizes: from high-volume production lines to EMS providers handling high product variety and short life cycles.
“AI is a core element of our product strategy, driving greater efficiency, performance, and differentiation in the marketplace.”, explains Jesper Lykke, CEO of Viscom Inc.
Viscom will also present its latest inspection systems live at the APEX Expo, including the iX7059 PCB Inspection XL for advanced 3D X-ray inspection of larger, heavier and more complex assemblies. This innovation is part of the broader iX7059 Series, Viscom’s powerful portfolio of AXI systems, from inspecting components weighing up to 200 kg and measuring 2 meters in length, to achieving resolutions down to 1 micron, this one series gives customers endless possibilities.
Visitors will also have the opportunity to learn more about the cost-efficient iS6052 Series, designed for AOI, SPI, and CCI applications. These solutions deliver an optimal balance of throughput, accuracy, and investment efficiency, making them ideal for manufacturers seeking reliable quality control without compromising speed.
The X8011-III brings high-end 2D and 3D X-ray capability to both automated and manual workflows. Equipped with an open microfocus X-ray tube and a modular design, it is particularly well suited for high-mix, low-volume productions as well as R&D environments. The X8011-III can now be equipped with a 210 kV X-ray tube, significantly expanding its capabilities. With this expansion, the X8011-III opens up new opportunities across a broader range of market applications. Its key differentiator remains the unique combination of an exceptionally compact footprint and outstanding versatility.
By combining intelligent software with industry-leading inspection systems, Viscom once again demonstrates its role as a technology innovator and leader.
“The business outlook for 2026 is optimistic.”, explains Jesper Lykke, CEO of Viscom Inc. “Early indicators point to positive momentum, with the first three months of the year expected to be particularly important in validating this trend. Viscom enters the year with a robust list of projects already included in the forecast, reflecting healthy customer demand and strong market engagement. We look forward to presenting new software and hardware innovations at APEX 2026.”
At the event, the company will show how AI-based solutions can simplify manufacturing processes, enhance reliability, and support sustainability and long-term success: true to its guiding principle: “We make technology safe, reliable and sustainable”. Viscom looks forward to welcoming visitors at Booth 2836!
About Viscom
Founded in 1984, Viscom SE is one of the leading suppliers worldwide in the field of assembly inspection within electronics production. With its headquarters and production site in Hanover, Germany, the company develops, produces and sells high-quality inspection systems from the areas of AOI, SPI, AXI, MXI, wire bond inspection as well as conformal coating inspection. The systems developed and manufactured in Hanover set high standards in terms of accuracy and speed. The product range covers the complete spectrum of optical inspection and X-ray inspection for small and medium-sized companies as well as for large series production. Viscom systems are used for 100% automatic inspection of electronic assemblies such as those used in the production of automotive electronics, aerospace technology or in the manufacture of telecommunications electronics.
Product development also focuses on customer-specific system developments and networking with other production processes for smart factory applications. In order to achieve this, Viscom SE increasingly invests in its own software and hardware development which is constantly defining new standards in inspection technology.
International sales are handled by a broad network of its own subsidiaries, application centers, service centers and representatives. A service team of in-house technicians and application specialists commission Viscom systems worldwide, offering maintenance, conversion and modernization from a single source. In addition, system-specific training courses are offered for customers’ operators, programmers and maintenance personnel. Experienced engineers and technicians from the application and service departments share their expert knowledge with participants.
About Exacom
Exacom GmbH develops X-ray metrology systems for high-quality and cost-effective inline inspection of battery cells. The company has a wide expertise in defect detection and process optimization from research and development to mass production. The advanced solutions cover a wide range of cell formats, including coin, cylindrical, pouch and prismatic cells. Exacom is part of the strong German group Viscom SE.
