Hellbender Inc., a fast-growing leader in AI-on-edge device design and manufacturing, has brought surface mount technology (SMT) assembly fully in-house — and credits Europlacer’s high-mix platform as a key driver behind faster cycles, higher yields, and scalable innovation.

Focused on next-gen electronics for industries ranging from medical to industrial automation and entertainment, Hellbender is redefining the possibilities of physical AI with compact, energy-efficient devices that demand high precision and rapid iteration.

“We move fast. We’re prototyping new designs every week. To keep up, we needed to own the full production process — and that meant bringing SMT in-house,” said Brian Beyer, CEO and Founder of Hellbender. “Europlacer’s equipment gave us everything we needed: ease of use, flexibility, and the ability to hit the quality standards our customers demand.”
Hellbender worked with Brad Kendall of Quality Associates to design an SMT line tailored to its low-volume, high-mix environment. From loader to unloader, Europlacer’s platform enabled seamless integration, rapid changeover, and robust performance.

“The user interface is incredibly intuitive,” added Cameron Baldwin, Hellbender Co-founder and SMT Production & Process Engineer. “We’ve trained multiple technicians from scratch and had them running live production within a week. That kind of onboarding speed just doesn’t happen with most SMT systems.”
Bringing SMT in-house allowed Hellbender to dramatically shorten design-to-build timelines and reduce reliance on external quick-turn suppliers — all while improving product consistency and control.

“Europlacer didn’t just provide us with machines — they supported our growth like a true partner,” Beyer said. “From day one, their team, especially Chris Merow, treated us like we were their most important customer. That level of service has made a real impact.”

With a new, faster Europlacer machine on order and plans for a larger facility underway, Hellbender is doubling down on its in-house production capabilities to meet growing demand.

“If you're a high-mix company looking to scale intelligently, I’d strongly recommend Europlacer,” Beyer said. “It’s reliable, flexible, and easy to use — and it's helped us deliver high-performance products faster than we thought possible.”

Hellbender Inc. designs and manufactures AI-on-edge devices for industries, including medical technology, sports and entertainment, and industrial systems. With a focus on speed, flexibility, and high-performance design, Hellbender delivers next-generation solutions that move intelligence out of the cloud and directly into the device. Learn more at www.hellbender.com.

Watch the video featuring Hellbender story on Youtube :
https://youtu.be/E8DvasQFdgo?si=l1Jf7rqiDhWUwYRH

For more information about Europlacer and its advanced SMT solutions, visit www.europlacer.com.

MADISON, AL – STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract PCB manufacturing, proudly announces the 25th work anniversary of Frank Honyotski, Master Instructor.

Since joining STI in 2000, Frank has played an integral role in developing and delivering world-class training programs. As a Master Instructor, his depth of knowledge, professionalism, and passion for quality have left a lasting impact on both students and the electronics industry at large.

"Frank is more than an instructor—he’s a mentor, a leader, and a trusted expert," said David Raby, President and CEO of STI Electronics. "His commitment to excellence and continuous improvement has helped shape the success of our training programs and the careers of countless professionals in the field."

To honor this milestone, STI held a celebration at its Madison facility, where employees gathered to recognize Frank’s achievements and enjoy cake shared with all of his colleagues at STI. David Raby, President/CEO, presented him with a certificate in appreciation of his 25 years of dedicated service along with a monetary gift.

Frank’s 25 years of service reflect not only personal dedication but also the values that define STI Electronics: excellence, integrity, and a relentless pursuit of quality.

Please join us in congratulating Frank Honyotski on this remarkable achievement and in thanking him for his continued contributions to STI and the industry.

About STI Electronics, Inc.

Since 1982, STI Electronics, Inc. (STI) has been the premier full-service organization for training, consulting, laboratory analysis, prototyping, and contract PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. For more information, visit https://stiusa.com.

CHELMSFORD, MA – VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, is pleased to announce the appointment of Marco Antonio Cruz Tovar as Mexico Regional Sales Manager. In this role, Marco will be responsible for driving all sales activities across the Mexico region for the complete line of VJ Electronix products.

Marco brings over 20 years of experience in electronics manufacturing, with a strong focus on regional sales strategy, customer support, and SMT technology in the Mexican market. His technical expertise and proven success in business development make him a valuable addition to the VJ Electronix team.

“We are excited to welcome Marco to VJ Electronix,” said David Hamel, Global Sales & Marketing Director at VJ Electronix. “His experience in SMT technology and regional market insight will play a key role in supporting our customers and partners across Mexico.”

Marco will work closely with VJ Electronix’s established channel partners in the region to deliver innovative solutions and exceptional service to electronics manufacturers seeking reliability, precision, and process control in X-ray inspection, rework, and component counting technologies.

Marco holds a Bachelor of Science in Mechanical Electrical Engineering from Universidad Valle Del Bravo and is fluent in both English and Spanish. He is based in El Marqués, Querétaro, and will be supporting customers throughout Mexico.

For more information about VJ Electronix, visit www.vjelectronix.com.

Merrimack, NH – Microsembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility. This investment significantly enhances Microsembly’s fine-pitch interconnect and high-power bonding capabilities—supporting expanding customer demand across aerospace, defense, medical, and telecom markets.

The expanded in-house wire bonding and die attach suite now includes Hesse Bondjet BJ855 and BJ820 automated wire bonders, Westbond 7KE/7KEH and 7476E/747630E manual wedge, ball, and ribbon bond bonders, and a Besi Datacon 2200 Evo Bonder. They’ve also added a Palomar SST 5100 Vacuum Pressure Furnace for void free eutectic die attach.

With this equipment, Microsembly delivers a full spectrum of wire bonding and die attach services for the manufacturing of RF/microwave PCBAs used in complex mixed technology RF/microwave assemblies.

Wire and Ribbon Bonding and Die Attachment capabilities enabled by these systems include:

• Gold (Au) ribbon bonds as small as .002” x .0005”
• Au wedge bonds down to .0007” on FETs, MMICs
• Au ball bonds and stitch-on-ball (SOB) bonds down to .0007”
• Quad diode package bonding with Au ribbon bonds down to .003” x .00025”
• Conductive epoxy die attach bond line thicknesses as little as .002”
• Combination bonds including ball, stitch-on-ball, and ribbon bonding
• Omega wrap (Double-C) ribbon bonds on feedthroughs
• Beam lead tacking with waffle patterning
• Cross bond stitching on ultra-small mesa diodes
• Precise MMIC-to-capacitor interconnects
• Void Free Eutectic Die Attach

“These machines not only add speed and repeatability but also allow our technicians to perform extremely precise and specialized bonds critical to high-reliability systems,” said Phuong “Kent” Dang, President at Microsembly. “From ultra-fine interconnects on microwave dies to rugged ribbon bonds on high-power components, we can handle a wide range of RF and microwave assembly challenges with confidence.”

This enhanced wire bonding and die attach suite supports Microsembly’s vertically integrated model, offering everything from initial design and prototyping to high-frequency testing and full-volume production. Customers benefit from rapid development cycles, U.S.-based manufacturing, and proven quality assurance processes built for mission-critical environments.