Press Releases

September 19th, 2018 ― Cranston, Rhode Island USA - AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at Productronica South China, scheduled to take place October 10-12, 2018 at the Shenzhen Convention Center in Shenzhen, China. AIM will highlight its REL electronic solders, REL22™ and REL61™, along with their full line of solder assembly materials.

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Manassas, VA – September 11, 2018 ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that it will host the LED Cleaning and Reliability” webinar on Thursday,  September 27th, from 1:30 PM to 2:30 PM EDT.  This is the seventh installment of the ZESTRON Academy 2018 Cleaning Webinar Series, and will be presented by Senior Application Engineer, Ravi Parthasarathy, M.S.Ch.E.

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Seoul, South Korea – Koh Young Technology, the pioneer and leader in 3D inspection technology, showed the latest Meister-D for the SiP (System-in-Package) assembly process. This innovative technology was recently highlighted at SEMICON Taiwan in the Taipei Nangang Exhibition Center.  

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Chester, Connecticut, USA – Ascentech, LLC will will be exhibiting its GEN3 Systems Ltd. technology solutions as well as Inspectis AB products at SMTA International 2018 (SMTAI), October 16-17 at the Donald Stephens Convention Center, Rosemont, IL, USA. Ascentech’s booth is #723.

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CHATSWORTH, CA – September 18, 2018 – NEO Tech, a leading microelectronic and RF solutions provider for defense contractors and U.S. government agencies, announces that it received reaccreditation by the Department of Defense, Defense Microelectronics Activity (DMEA), furthering its reputation as a leader in the microelectronics industry.

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Somerset, NJ – September 17, 2018 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be hosting a full day seminar on “Low-Temperature Soldering Technology” at Hyatt Regency Dongguan in China on September 19, 2018.

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