Eindhoven, Netherlands — February 2026 — Keiron Printing Technologies, a global innovator in advanced electronics manufacturing solutions, has appointed Yankee Soldering Technology as its authorized sales representative for the New England region. The partnership covers Connecticut, Rhode Island, Maine, Massachusetts, New Hampshire, and Vermont, and will support the regional introduction and adoption of Keiron’s LiFT (Laser-Induced Forward Transfer) technology, including the company’s latest system, the Keiron HF2 LiFT Printer.

Yankee Soldering Technology is a sales organization dedicated to helping New England manufacturers compete on a global scale. With strong regional relationships and a technical, process-driven approach aligned with high-performance SMT environments, Yankee Soldering will represent Keiron’s LiFT platform to manufacturers seeking greater control, flexibility, and consistency in solder paste deposition.

Keiron’s LiFT technology replaces traditional stencil- and nozzle-based solder paste deposition with a laser-driven, non-contact digital process. By eliminating stencils, nozzles, ejectors, and other mechanical contact points, LiFT removes a major source of process variability while directly addressing one of the most common contributors to assembly defects: inconsistent solder paste application.

The Keiron HF2 LiFT Printer enables precise, repeatable solder paste deposition down to nanoliter volumes while working with standard solder pastes and accepting common CAD, Gerber, and ODB++ file formats. This allows manufacturers to implement digital solder paste printing without changing materials or disrupting established workflows. With no stencils to fabricate, clean, or store, changeovers can be completed in minutes, making the HF2 particularly well suited for high-mix, low-volume, and NPI-focused production.

A key differentiator of the HF2 is its integrated Solder Paste Volume Metrology (SPVM), which measures every deposit in real time during the printing process. This built-in verification improves first-pass yield and reduces rework and scrap without requiring a separate SPI system. The contactless architecture also avoids common reliability challenges such as clogging, mechanical wear, and alignment drift associated with conventional printing methods.

“Yankee Soldering brings deep regional knowledge and a strong technical mindset that aligns well with how LiFT technology is deployed on the factory floor,” said Brian Duffey, President of Keiron Technologies USA. “Their experience supporting high-mix and advanced SMT operations makes them an excellent partner as we expand LiFT adoption across New England.”

For more information about Yankee Soldering Technology, visit www.yankeesoldering.com.

For more information about Keiron’s industry revolutionizing technology, visit www.keirontechnologies.com.

SEYMOUR, CT, UNITED STATES -- Microboard, a leading Connecticut-based electronics manufacturing service (EMS) provider, today announced a significant $1.3 million capital investment in Mycronic's MYTower 7+ and MYTower 6X inventory towers. This strategic investment represents a major upgrade to Microboard's component storage capabilities and underscores the company's commitment to maintaining cutting-edge manufacturing infrastructure to better serve customers across Defense, Medical, Telecom, and Industrial sectors.

The new tower systems replace Microboard's existing Mycronic SMD 8000 and 5130 models, delivering a 74% increase in storage capacity. The MYTower 7+ stands at 3.03 meters tall as Mycronic's tallest component storage system, accommodating up to 1,148 reels and supporting larger components and reels up to 56mm (compared to the previous 44mm limitation in the SMD 8000 and 5130), while adding 15-inch reel capability with newer technology. The MYTower 6X, Mycronic's largest capacity component storage system, stands at 2.64 meters tall and can store up to 1,988 reels in less than 2m² of floor space, adding close to four times the capacity of the previous Tower 200 model. This new storage technology significantly expands Microboard's ability to manage high-mix component inventories while optimizing floor space efficiency.

"This investment reflects our ongoing dedication to Process Excellence, one of our three guiding principles," said Nicole Russo, President and CEO of Microboard. "For over 40 years, Microboard has continually positioned itself as an innovative EMS partner with leading-edge technology to ensure automation efficiency, serve complex business opportunities, and anticipate our customers’ evolving technology needs. These advanced storage systems enable us to stay ahead of the curve and deliver the capacity and capability our customers expect from a forward-thinking manufacturing partner.”

Lee Kemper, Executive Vice President of Microboard, added, "The upgrade and additional Mycronic Mydata component storage towers reinforce our investment in smart manufacturing at Microboard. By optimizing storage density and enabling faster, more accurate kit preparation and work order processing, we are increasing throughput while maintaining the high standards our customers expect."
The enhanced storage capacity and expanded component compatibility will enable Microboard to increase inventory management efficiency and support more complex, high-reliability circuit card assemblies for its customers.

"A valued customer for over 15 years, Microboard first partnered with Mycronic in 2010. Their journey has been defined by a steady evolution from initial acquisition to high level advocacy and loyalty. Their latest milestone – a comprehensive capacity driven equipment upgrade – reflects a deep-seated dedication to scaling their impact. This proactive investment not only enhances their immediate capacity but reinforces the trust and shared vision that have defined our partnership for over a decade," said Liz Morrill, Regional Sales Manager at Mycronic.

A ribbon-cutting ceremony for the new MYTower systems is scheduled for Thursday February 26, 2026.

Learn more about Mycronic and their advanced electronics manufacturing equipment by visiting their website.

About Microboard: Microboard is a Connecticut-based electronics manufacturing service (EMS) provider delivering circuit card assembly, system integration, and test services. With over 40 years of experience, manufacturing high reliability and high complexity electronics across the Defense, Medical, Telecom, and Industrial sectors. Microboard supports humanitarian projects partnering with 10 different organizations around the world, serving people making less than a $1.60 a day in crisis impacted areas. Through these projects Microboard revitalizes water wells, supports sustainable farming initiatives, provides internationally accredited education, and conflict mitigation.

TSMC is accelerating its domestic manufacturing expansion, with industry sources indicating that as many as ten fabs could be under construction or preparing to begin operations across Taiwan’s major science parks in 2026.

The development reflects the chipmaker’s push to scale advanced process technologies and packaging capacity amid rising global demand.

According to supply chain reports, TSMC’s current focus remains on cutting-edge nodes, including 2nm, A16 and A14. Preparatory engineering work is progressing at the P3 and P4 facilities within Fab 20 in Hsinchu Baoshan, which will serve as production bases for technologies below the 2nm level.

The company began 2nm volume production in late 2025, running concurrently at Fab 20 - located beside TSMC’s global R&D centre - and the newly completed Fab 22 in Kaohsiung. Fab 20 has now entered stable production with an estimated monthly output of between 20,000 and 25,000 wafers.

In the Central Taiwan Science Park, TSMC is developing Fab 25 as its hub for 1.4nm technology. Plans call for four fabs at the site, with piling work having started in late 2025. Risk production is expected to begin in late 2027, followed by full-scale volume manufacturing in the second half of 2028.

The region is also set to take on a central role in advanced packaging. The AP5B facility in Taichung is scheduled for completion in 2026, while construction of the AP7 P1 packaging fab in Chiayi is progressing on a similar timeline. These projects reinforce central Taiwan’s position as a key packaging production centre as next-generation chip designs require increasingly sophisticated back-end processes.

In Kaohsiung, where Fab 22 anchors TSMC’s 2nm programme, multiple construction phases are advancing in parallel. P1 entered volume production in the second half of last year, P2 has completed equipment installation and begun trial production, and P3’s structural build is largely finished. Work on P4 and P5 is also underway, with all five fabs expected to reach full operational status by the fourth quarter of 2027.

Further south, Tainan is emerging as another strategic location for advanced-node expansion. To meet surging demand for 2nm capacity, TSMC plans additional investment in the Tainan Special Zone A. If its P1 project clears environmental review in April, construction could begin as early as May.

TSMC’s expansion is supported by a sharp rise in capital spending. In January, the company projected its 2026 capex at between $52-56 billion, representing an increase of around 30% year on year. The investment surge highlights the scale of its commitments not only in Taiwan but also in overseas projects in the United States and Japan.

The combined activity across multiple science parks indicates that TSMC’s domestic build-out is accelerating rapidly, with advanced process nodes and high-end packaging at the centre of its long-term manufacturing strategy.

Data Modul expands its EMS capabilities, including fully integrated assembly and supply chain services, announcing this update through the following release:

Our assembly and logistics services include:

• Procurement of specified components through partner agreements and DATA MODUL's global sourcing network
• Quality assurance for components, sub-assemblies and finished devices
• Coordination and documentation by experienced project teams
• Tailored logistics solutions with direct-to-destination delivery
• On-demand after-sales service, extending beyond project completion if required

By assuming responsibility for key processes, we significantly reduces interfaces and coordination efforts for its customers. The result is increased reliability, quality and transparency throughout the entire supply chain. In addition, DATA MODUL's experienced R&D team supports the development process from design-in through to series production - acting as a trusted partner on the path to a fully assembled, market-ready product.

Technology and expertise for a wide range of requirements

With state-of-the-art manufacturing technologies, including bonding, prototyping, testing procedures and product qualification, DATA MODUL creates optimal conditions for the successful implementation of various projects. Whether low volumes during ramp-up phases or higher production volumes, manufacturing capacities are fully scalable and designed for maximum flexibility.

We act as an extension of our partners, providing flexibility, expertise and practical solutions. Customers increasingly expect holistic, end-to-end services that reduce complexity and allow them to focus on their core business," says Dr Florian Pesahl, CEO of DATA MODUL.