TURKU, Finland -- Teleste, a leading provider of broadband network solutions, announces significant advancements in its supply chain to support its expansion in North America. These improvements are designed to deliver both global scale and local responsiveness.

Strategic EMS Partnerships

At Teleste's headquarters in Finland, the existing smart factory integrates R&D, global sourcing, and modern manufacturing under one roof serving global customers.

For increased agility and scale, Teleste has established multiple strategic Electronics Manufacturing Services (EMS) partnerships to support its growth. By combining the smart factory concept with these EMS partnerships, Teleste achieves economies of scale while maintaining a strong local presence.

Teleste now announces that the chosen EMS partner, GPV Americas, has started to ramp up high-volume ICON product family (DOCSIS 4.0 1.8 GHz Intelligent Amplifiers) manufacturing in Mexico, to serve North American key customers. This enables very high production capacity with short lead times and agile customer service.

To further boost responsiveness, Teleste has also introduced assembly capabilities at its New Jersey distribution center in the USA. This enables the delivery of products from global sites, while performing customer-specific configurations locally, reducing lead times and enhancing service agility.

Commitment to Operational Excellence

Teleste's supply chain relies on standardized assembly cells built on standardized manufacturing systems to eliminate waste and inefficiencies. Easily duplicated at EMS sites, this approach ensures consistent quality, performance, and traceability, making EMS partners a seamless extension of Teleste's operations close to customers.

Esa Korolainen, SVP Operations, Logistics and Sourcing at Teleste, commented, "Over the years, Teleste has delivered hundreds of thousands of high-quality network products, each produced through our industry-leading supply chain model. By combining global scale with local responsiveness, we are ready to support our customers in North America with unmatched speed, flexibility, and service excellence."

Carlsbad, CA, USA – 23 September 2025 – Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, announces full compatibility of its industry-leading ASYMTEK conformal coating systems with actnano’s next-generation, PFAS-free materials. This integration offers electronics manufacturers a proven path to more sustainable, energy-efficient production without sacrificing performance or throughput, allowing electronics manufacturers to meet sustainability goals while preserving operational excellence.

actnano’s award-winning Advanced nanoGUARD™ (ANG) coatings eliminate the need for energy-intensive curing ovens while maintaining protection for printed circuit board assemblies (PCBAs). These innovative materials are now fully supported across Nordson’s ASYMTEK Select Coat® SL-940 and SL-1040 conformal coating platforms. Learn more about actnano-compatible solutions here.

“We’re excited to support manufacturers making the shift to greener materials,” explained Almar Thewissen, Market Development Manager, Nordson Electronics Solutions. “With our equipment and actnano’s technology, customers can maintain a high-quality production line and a safe workplace while also reducing energy consumption.”

Nordson’s conformal coating equipment ensures optimal material handling and process stability when using actnano coatings. This combination enables smarter, greener electronics production with proven equipment upgrades that are ideal for high-throughput environments. The equipment features are designed to ease the transition from traditional conformal coating materials while optimizing actnano coating performance. Key equipment features include:

• Agitating reservoirs to prevent particle settling in the fluid, with choices in reservoir size and pneumatic or electric agitation.
• Circulating fluid systems to maintain material consistency and avoid build-up during idle time.
• Circulating applicators -- the ASYMTEK SC-350 Select Spray and SC-400 Precise Coat® Jet – to ensure a stable coating process.
• Extraction filters to manage atomized particle accumulation in spray applications and maintain optimal airflow.
• Dual ultrasonic cleaning station cleans two applicators simultaneously for increased uptime.

“With Nordson’s Select Coat® platforms and our ANG coatings, electronics manufacturers can reduce their environmental impact and improve production efficiency,” said Dr. Cassandra Zentner, Vice President of Technology and Sustainability of actnano. “This partnership is a win for both sustainability and innovation for our customers.”

LYON, France - September 23, 2025 | Yole Group today announces the release of its Automotive White Paper, Vol. 2, part of the 2025 Yole Group White Paper Collection. Following the success of Volume 1, this latest edition dives deeper into the transformative forces shaping the future of automotive semiconductors.

While the global automotive market is set to grow at a modest 2% CAGR between 2024 and 2030, the semiconductor segment is surging dramatically, increasing from $68 billion to $132 billion over this period. This divergence underscores the central role of semiconductors as vehicles evolve into software-defined, connected, and increasingly autonomous platforms.

The white paper examines how established semiconductor leaders and emerging challengers are repositioning themselves to capture value in this rapidly expanding market.

Pierrick Boulay, Principal Analyst, Automotive Semiconductors at Yole Group: “Automotive semiconductors are no longer a hidden enabler. They are the foundation of future mobility. Yole Group’s Automotive White Paper, Vol.2, shows how technological choices and strategic bets in the next five years will define the winners and losers of this industry.”

Yu Yang, Principal Analyst, Automotive Semiconductors at Yole Group: “The global race is accelerating. While incumbents hold strong in ADAS and autonomous compute, challengers must prove reliability to earn trust. The winners will be those who align technology innovation with OEMs’ evolving roadmaps.”

MILPITAS, Calif. ─ September 21, 2025 ─ SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement from SEMI Americas President Joe Stockunas on the United States H1-B policy proclamation issued by President Trump on September 19, 2025.

“With the announcement of a new policy on high-skilled H-1B visa worker, SEMI supports the Administration’s strategic and economic security objectives. SEMI members also recognize the Administration’s commitment to securing U.S. leadership in the semiconductor manufacturing value chain and look forward to working together to ensure policies meet both national security needs and strengthening the talent base necessary to support companies. SEMI is concerned about added strain at a time when the industry faces significant workforce shortages and looks forward to bringing together our member companies and the Administration to achieve the Administration’s objectives.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.