POOLE, UK – Brown brings more than 20 years of experience in sales and leadership roles within the electronics manufacturing industry. Most recently, he served as General Manager at SAKI North America, where he oversaw business development and operations across the region. His career also includes an earlier role as Regional Sales Manager at Europlacer Americas, as well as eight years as Sales Manager for the Americas at DEK USA, where he directed sales efforts across the U.S., Mexico, Canada, Brazil, and Costa Rica.

Earlier in his career, Brown owned and managed TechSearch LLC, building new territories and fostering long-term customer relationships throughout the Americas. Known for presenting at national and international sales meetings, he has consistently demonstrated the ability to grow teams, expand market reach, and deliver results in diverse environments.

“In line with market trends, we continue to strengthen our customer-facing team with individuals that bring experience, curiosity and passion for customer success.” said Andrei Stapinoiu, Director of Global Sales. “Craig brings all these values and a comprehensive set of skills that will ensure our customers receive the best service in the industry.”

For more information about Europlacer and its advanced SMT solutions, visit www.europlacer.com.

About Europlacer

Europlacer is an award-winning global SMT full-line solution provider with over 50 years of engineering heritage in the electronics assembly industry. Servicing the sector with direct offices around the world and manufacturing facilities in the UK and France, Europlacer delivers flexible and dependable products to the SMT pick and place market, providing innovative solutions to complex manufacturing challenges. Europlacer is pioneering the market with great technology and a network of acknowledged experts to continue to build the long-lasting relationships that the business has thrived on for the past half-century.

POOLE, UK – Brown brings more than 20 years of experience in sales and leadership roles within the electronics manufacturing industry. Most recently, he served as General Manager at SAKI North America, where he oversaw business development and operations across the region. His career also includes an earlier role as Regional Sales Manager at Europlacer Americas, as well as eight years as Sales Manager for the Americas at DEK USA, where he directed sales efforts across the U.S., Mexico, Canada, Brazil, and Costa Rica.

Earlier in his career, Brown owned and managed TechSearch LLC, building new territories and fostering long-term customer relationships throughout the Americas. Known for presenting at national and international sales meetings, he has consistently demonstrated the ability to grow teams, expand market reach, and deliver results in diverse environments.

“In line with market trends, we continue to strengthen our customer-facing team with individuals that bring experience, curiosity and passion for customer success.” said Andrei Stapinoiu, Director of Global Sales. “Craig brings all these values and a comprehensive set of skills that will ensure our customers receive the best service in the industry.”

For more information about Europlacer and its advanced SMT solutions, visit www.europlacer.com.

About Europlacer

Europlacer is an award-winning global SMT full-line solution provider with over 50 years of engineering heritage in the electronics assembly industry. Servicing the sector with direct offices around the world and manufacturing facilities in the UK and France, Europlacer delivers flexible and dependable products to the SMT pick and place market, providing innovative solutions to complex manufacturing challenges. Europlacer is pioneering the market with great technology and a network of acknowledged experts to continue to build the long-lasting relationships that the business has thrived on for the past half-century.

CRANSTON, RI — October 2025 — Federal Electronics, a leader in providing advanced electronic manufacturing services, has installed a new Pillarhouse Jade S-200 MKII selective solder system at its Hermosillo, Mexico facility, further strengthening its ability to support high-mix, high-complexity assemblies. With one system now dedicated to lead solder and the other to lead-free, the site can better accommodate diverse customer requirements for high-mix, high-complexity assemblies.

The Jade MKII is designed for small- to medium-batch production, where precision, repeatability, and production flexibility are critical. The hand-load platform is equipped with a universally adjustable tooling carrier that accommodates PCBs or pallets up to 457mm x 508mm (18” x 20”). Pillarhouse’s patented Drop-Jet design fluxer provides fast, effective flushing of the pressurized flux chamber. This minimizes maintenance while supporting a range of flux types, including high solid content and water-soluble fluxes.

Federal Electronics’ Hermosillo facility plays a central role in the company’s North American manufacturing network, providing proximity to key customers, a highly skilled workforce, and infrastructure tailored to high-reliability markets. The addition of these selective solder systems was driven by the need to increase throughput while maintaining the company’s strict quality standards.

“Selective soldering is an important part of our capability set, especially for customers with high-reliability requirements,” said Ed Evangelista, President of Federal Electronics. “With these installations, we’re enhancing both flexibility and process control, ensuring that we can meet customer needs efficiently and consistently.”

For more information on Federal Electronics and its manufacturing capabilities, visit www.federalelec.com or contact sales@federalelec.com.

Manassas, VA – October 2, 2025: As part of its mission to advance knowledge and support the electronics manufacturing industry through technical training and education, ZESTRON Academy is pleased to announce its upcoming webinar, “Ensuring Reliability in Advanced Packaging: The Cleaning Challenge,” taking place on October 9th at 2:00 PM EDT. The session will be led by Kalyan Nukala, M.S.Ch.E., Senior Applications Engineer at ZESTRON Americas.

The electronics industry is experiencing rapid change as semiconductor packaging continues to evolve with highly advanced technologies such as System-in-Package (SiP), flip chip ball grid arrays (fcBGA), Package-on-Package (PoP), and 2.5D architectures. These innovations bring remarkable performance improvements but also introduce new and complex reliability challenges. Larger die sizes, increased bump counts, and standoff heights now dipping below 50 micrometers make flux residue removal more difficult, particularly under low-profile components.

The addition of other factors like standoff heights below 50μm and components like QFNs and LGAs further complicate the process, increasing the rest of failures from electrochemical migration and electrical leakage.

This webinar will provide attendees with a deeper understanding of why proper cleaning is an essential step in safeguarding the long-term performance of advanced packages. The session will will discuss the latest cleaning strategies that can be implemented to reduce risks, optimize processes, and prevent failure in high-reliability applications.

The webinar is open to all professionals working with advanced semiconductor packaging who are seeking to improve reliability outcomes and better understand the role of cleaning in long-term product performance. For more information and to register for free, please visit https://www.zestron.com/usa/en/education/2025-cleaning-webinars.