Press Releases
KUALA LUMPUR, MALAYSIA – Henkel is proud to announce that it has won the Texas Instruments 2024 Supplier Excellence Award. The most prestigious level of supplier recognition, the award highlights suppliers that exemplify the highest standards of innovation, collaboration, and performance.
“We are humbled and honored to be recognized by Texas Instruments with this distinction,” says Wen Zhou, Corporate Vice President Electronics at Henkel Adhesive Technologies. “Winning this award is a testament to our team’s expertise in die attach materials innovation, adherence to the most rigorous standards, and a collaborative, can-do mindset. Our partnership with Texas Instruments helps advance some of today’s most cutting-edge analog and embedded semiconductor technologies for critical markets like automotive, industrial, and communications. We are delighted to be an enabler of this consequential work.”
According to Texas Instruments, factors that contributed to Henkel’s top-performing supplier status included “the team’s consistent prioritization of Texas Instruments as a customer, quick response, creative ideas, and a willingness to challenge the status quo so that both companies can grow together.”
With over 20,000 suppliers, Texas Instruments evaluates the companies across six areas: cost, environmental and social responsibility, technology, responsiveness, and assurance of supply and quality. With this framework of objective assessment, the best suppliers that exemplify excellence are identified. This year, 19 suppliers were named Supplier Excellence Award winners.
“Henkel is thrilled to be among such an elite group of suppliers and deeply appreciative of Texas Instruments for recognizing our role in its success with the 2024 Supplier Excellence Award,” concludes Zhou. “We are excited about the future of our partnership and know that together, we can push innovation even further!”
About Henkel
With its brands, innovations and technologies, Henkel holds leading market positions worldwide in the industrial and consumer businesses. The business unit Adhesive Technologies is the global leader in the market for adhesives, sealants and functional coatings. With Consumer Brands, the company holds leading positions especially in laundry & home care and hair in many markets and categories around the world. The company's three strongest brands are Loctite, Persil and Schwarzkopf. In fiscal 2024, Henkel reported sales of more than 21.6 billion euros and adjusted operating profit of around 3.1 billion euros. Henkel’s preferred shares are listed in the German stock index DAX. Sustainability has a long tradition at Henkel, and the company has a clear sustainability strategy with specific targets. Henkel was founded in 1876 and today employs a diverse team of about 47,000 people worldwide – united by a strong corporate culture, shared values and a common purpose: "Pioneers at heart for the good of generations.” More information at www.henkel.com
EL SEGUNDO, CA – Braided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
On May 6, Martin Hart, President of TopLine Corporation and holder of multiple patents in the field of electronic components, will present “Braided Solder Columns for Cold Electronics - Moon, Mars and Beyond” at the SPACE PARTS WORKING GROUP (SPWG) 2025, an international forum in El Segundo, California, to disseminate information to the aerospace industry and to resolve problems with high-reliability electronic piece parts needed for space and missile applications. In-person attendance will be held at The Aerospace Corporation, 210 S. Douglas Street, El Segundo, CA 90245.
“Braided Solder Columns are non-collapsible, robust and compliant structures used for reducing stress caused by CTE mismatch,” Hart says. “Columns are more reliable than solder balls, especially when connecting large-size chip packages to PC Boards operating in cryogenic environments. Additionally, they are available with lead for Aerospace & Defense applications, but also available in lead-free designs for RoHS AI Datacenters, for example.”
For more information, contact TopLine Corporation at 95 HWY. 22 W., Milledgeville, GA 31061 USA Telephone: 800-776-9888, Email: info@topline.tv.
About TopLine
TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. TopLine is a pioneer in CGA solder columns technology and low temperature cryogenic package-to-board interconnects. TopLine is also a supplier of bonding wire for many semiconductor uses and for EV applications. To learn more, visit www.CCGA.tv or call (1+) 800 – 776-9888.
SAN JOSE, CA ― Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, proudly announces the installation of the JUKI Primo Large-Format Screen Printer, expanding its capabilities to support printed circuit board assemblies (PCBAs) up to 33.5"x 24". This investment enables Green Circuits to provide comprehensive solutions for today’s increasingly complex and larger-format designs.
As product innovation drives the need for larger, more intricate PCBAs — especially in industries such as aerospace, communications, and high-end industrial system s— the JUKI Primo delivers the high-speed precision and flexibility required to meet customer demands.
“Our customers are designing bigger and more complex boards than ever before,” said Michael W. Hinshaw, Jr., Chief Executive Officer at Green Circuits. “The JUKI Primo allows us to meet those needs head-on, while maintaining the accuracy and efficiency we’re known for.”
The JUKI Primo features advanced alignment systems, intuitive software controls, and a rugged design optimized for high-throughput environments. Its large-format capability ensures seamless integration into Green Circuits’ SMT lines, supporting both prototype and full-scale production runs.
As a global EMS leader, Green Circuits offers a full suite of services, including PCB design and engineering, fabrication, assembly, system and box build, supply chain and logistics, test and burn-in, BGA rework, and failure analysis. With this addition, Green Circuits continues to build on its reputation for advanced manufacturing, offering full turnkey services backed by cutting-edge equipment, skilled engineering teams, and a customer-first approach.
For more information, visit www.greencircuits.com .
About Green Circuits
As a leader in the industry, Green Circuits has more than 30 years of experience culminating in an extensive knowledge of printed circuit board fabrication and assembly. The company is built on a commitment to quality and a focus on speed and service.
SANTA CLARA, CA – Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is proud to announce the continued success of its initiative to recruit and develop young engineering talent. Building on the momentum from last year’s hiring of two recent college graduates, Absolute EMS has expanded the program with the addition of a third newly graduated engineer to its team.
Absolute EMS’s investment in young, enthusiastic engineering graduates is already exceeding expectations. The first two hires have quickly distinguished themselves, advancing within the organization and bringing fresh perspectives, innovative ideas, and a contagious enthusiasm for manufacturing.
Recognizing the industry-wide concern about the shortage of young professionals entering the manufacturing sector, Absolute EMS is proud to be part of the solution. By offering opportunities for professional development, mentorship, and hands-on experience, the company is helping foster the next generation of engineering leadership.
The first two engineers played an active role in interviewing, onboarding, and mentoring the newest team member. Their collaborative approach has fostered strong synergy, pride, and a deep sense of responsibility — fueling daily learning, growth, and innovation across the team.
“We’re incredibly proud of how these young engineers have embraced the challenges and opportunities at Absolute EMS,” said Doug Dow, COO at Absolute EMS/ “Their success shows the incredible potential that emerges when you invest in people early in their careers and create an environment where they are empowered to grow and lead.”
Absolute EMS is proud to operate a 4.0 manufacturing facility that combines cutting-edge technology with an emphasis on lean processes and continuous improvement. With certifications including ISO 13485, AS9001D, and ISO 9001, Absolute EMS continues to lead the charge in providing high-precision electronics manufacturing solutions (EMS).
For more information about Absolute EMS, visit www.absolute-ems.com.
SANTA CLARA, CA – Promex Industries, Inc., a Silicon Valley-based provider of advanced design, packaging, and microelectronics assembly services, today announced it has expanded its manufacturing line, adding two advanced systems designed to support the industry’s most demanding microelectronics applications. The newly installed LPKF CuttingMaster 2127 ultraviolet (UV) laser depaneling and Koh Young aSPIre 3 automated solder paste inspection (SPI) systems bring heightened flexibility, quality, and throughput to the company’s advanced, best-in-class assembly process offerings.
The new tools represent key next steps in Promex’s efforts to enable continued high-level integration – from the chip/wafer level all the way to finished boards – on a wide variety of substrate materials. “These investments reinforce our commitment to helping customers build more advanced, compact, and reliable electronic assemblies,” said Dave Fromm, chief operations officer, Promex. “Together, the new laser and SPI systems expand our core capabilities and allow us to deliver higher quality, yield, and consistency—from prototype to production—reflecting our commitment to not just meeting but staying ahead of industry and customer needs.”
UV laser depaneling
The LPKF CuttingMaster 2127 system delivers ultra-precise UV laser singulation, micromachining, and cutting for a wide range of organic and composite materials common in many microelectronics products, especially those employing heterogeneous integration to co-package electronic and non-electronic components. Materials processed include polyimide and liquid crystal polymer (LCP) flexible circuit boards, FR4 circuit boards, organic/laminate substrates and interposers, and overmolded plastics/composites. With a <20 µm spot size and ±25 µm positional accuracy, the laser allows engineers to design boards with complex form factors and tighter layouts. This precision reduces up to 30% of dead space between components on the panel, maximizing design efficiency.
Enabling clean, stress-free singulation of flex and rigid-flex circuits is key to meeting customer demand for chip-on-flex and flexible packaging solutions. Offering this capability in-house allows Promex to improve turnaround times, enhance process control, and ensure consistent quality for critical applications.
Inline SPI metrology
To meet the stringent demands of fine-pitch surface mount technology (SMT), Promex has also added the Koh Young aSPIre 3 SPI system. Designed to perform 100% inline metrology, the system inspects solder paste deposits at every location on every panel—across rigid and flexible substrates—capturing detailed statistical data and building paste libraries for each design.
This data-driven approach delivers the highest standard in the True 3D SPI market, enhancing yield, enabling predictive quality control, and supporting tighter process windows essential to assembly of advanced components such as ball grid arrays (BGAs), chiplets, and high-density interconnects. These capabilities are especially critical for advanced assembly on thin, flexible circuit boards, where solder printing cannot be assumed to be consistent across the print area (as it would be for traditional, rigid circuit boards).
The new tools are already in use at the Promex site, supporting customer programs in emerging areas such as artificial intelligence, medical electronics, and space systems. Combined with the company’s existing laser micromachining and advanced assembly capabilities, they position Promex to deliver fully integrated, high-quality solutions at scale.
About Promex
Promex Industries, Inc. specializes in advanced design, packaging and assembly services for key subsystems used in a wide range of applications, such as optical, photonics, diagnostics, life sciences, medical and MEMS devices. The company is skilled at heterogeneous integration of tiny components with unique functionality and complex, custom or detailed assembly requirements. Founded in 1975, Silicon Valley-based Promex provides design-for-manufacturing services coupled with materials science expertise and broad assembly capabilities for small- to mid-volume onshore production. Services provided in the company’s Class 100/Class 1000 cleanrooms include RoHS-optimized SMT, wafer thinning, dicing, die bonding, wire bonding, flip chip, and combining microelectronic and non-microelectronic components. Promex is ISO 13485:2016 and ISO 9001:2015 certified, IPC certified and ITAR registered. https://promex-ind.com/
PEORIA, AZ – HyRel Technologies , a global provider of quick turn semiconductor modification solutions, is proud to spotlight its 7th class of interns in partnership with Peoria Unified School District, featuring three outstanding young women who are already making meaningful contributions to the company's innovative engineering and operations efforts.
This year’s intern class includes Lily Neal, Kaylee Browning, and Veronica Macke—each bringing unique strengths, ambition, and creativity to the HyRel team. From SolidWorks design and 3D printing to accounting and machine component innovation, these interns represent the future of engineering and tech talent.
“What we’re seeing is the result of creating the right environment,” said Brian Watson, Founder, HyRel Technologies. “We’re incredibly proud of our interns—this program is not just about introducing them to careers; it’s about watching them grow into young professionals who already rival early-career engineers.”
Lily Neal began her internship in October 2024, focusing on accounting. What started as a learning opportunity quickly turned into a permanent role at HyRel, where she now balances bookkeeping responsibilities and hands-on work with taping parts. Lily credits HyRel’s supportive culture and flexible scheduling for helping her manage the demands of her senior year while gaining valuable experience.
She plans to pursue a degree in accounting at Arizona State University and continue working with the team that helped launch her career. Kaylee Browning has proven herself as a rising engineering talent. She’s led the design of the base platform for HyRel’s upcoming VersaCell system, producing work that closely aligned with the company’s mechanical engineering team. She’s tackled complex SolidWorks projects, including designing a custom machine cover for a fluxer using unfamiliar components like gas struts and quarter-turn fasteners—skills she mastered through independent research and problem-solving.
Veronica Macke, an aspiring mechanical engineer, has hit the ground running. She’s already gained hands-on experience in 3D printing and manufacturing tray design for HyRel’s assembly process. Veronica values HyRel’s strong mentorship culture and plans to study Mechanical Engineering at Northern Arizona University, where she will also participate in the Air Force ROTC program. “HyRel is my first stepping stone to a great career,” she shared. “I will be forever grateful for the experience.”
What makes this year’s class even more special is the organic connection to HyRel’s extended family: some of the interns are friends of former HyRel high school interns now pursuing engineering degrees at ASU—proof that the program is building not only skills but a powerful pipeline of young talent.
Adding to this momentum, HyRel recently secured a paid engineering internship through ASU’s Blackstone LaunchPad program, further expanding opportunities for college students and reinforcing the company’s dedication to real-world learning. HyRel is dedicated to not only advancing its business but also to fostering the growth and potential of individuals who will shape the future of the semiconductor industry. For more information about HyRel’s innovative internship program and its dedication to community engagement, visit www.HyRel.tech .
About HyRel Technologies
HyRel is a worldwide provider of high quality, quick turn semiconductor modification solutions serving the military, space, automotive, energy and commercial markets to companies seeking to improve product reliability. HyRel provides robotic hot solder component tinning, component solder ball removal and replacement, component tape and reel packaging services and component bake and dry pack services to customers worldwide. HyRel is also developing proprietary micorobotic innovations to elevate the speed, reliability, and safety of standard semiconductor processes. For more information about HyRel Technologies, please visit www.HyRel.tech .
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