SANTA CLARA, Calif. – October 6, 2025 – Microelectronics and packaging assembly leaders Promex Industries, Inc., and its QP Technologies division today announced that Ben Mendoza has been named vice president of military projects for the two companies, reporting to CEO Richard Otte. The appointment of Mendoza, who brings more than 40 years of experience in high-reliability microelectronics to the newly created position, is key to the companies’ expanded focus on serving military-aerospace markets.
Mendoza’s appointment reflects the companies’ strategy to expand their footprint in the defense and aerospace sectors to help meet growing demand for trusted, onshore microelectronics partners. To this end, he will lead efforts to strengthen the companies’ military qualification pathways, including working with the Defense Logistics Agency to establish MIL-PRF certification, extending ISO/AS9100 coverage across facilities, and ensuring ITAR compliance remains robust. His role also encompasses outreach to industry task forces, such as the JEDEC JC-13 government liaison committee, where he currently serves as chair, to align Promex and QP Technologies capabilities with evolving standards and policies.
“I’m looking forward to leveraging lessons learned throughout my career to help ensure that our solutions meet the most demanding military standards,” said Mendoza. “This includes expanding our quality systems and establishing QML lab suitability that demonstrates our commitment to the mil-aero community.”
“Ben’s leadership, credibility, and technical depth give us the ability to accelerate into this market with confidence,” said Otte. “His experience with QML certifications and defense industry groups makes him uniquely positioned to expand our capabilities and deepen our value to aerospace and defense customers.”
Integrating Promex’s deep expertise in heterogeneous integration and medical/biotech reliability with QP Technologies’ strong foundation in substrate design and microelectronics package assembly, the companies aim to deliver a comprehensive portfolio of mil-qualified packaging and assembly services. This strategic expansion underscores their long-term commitment to supporting critical defense and aerospace programs with the highest levels of quality, reliability, and technical innovation.
To learn more about the companies’ military program, contact bmendoza@promex-ind.com.
POOLE, UK – Brown brings more than 20 years of experience in sales and leadership roles within the electronics manufacturing industry. Most recently, he served as General Manager at SAKI North America, where he oversaw business development and operations across the region. His career also includes an earlier role as Regional Sales Manager at Europlacer Americas, as well as eight years as Sales Manager for the Americas at DEK USA, where he directed sales efforts across the U.S., Mexico, Canada, Brazil, and Costa Rica.
Earlier in his career, Brown owned and managed TechSearch LLC, building new territories and fostering long-term customer relationships throughout the Americas. Known for presenting at national and international sales meetings, he has consistently demonstrated the ability to grow teams, expand market reach, and deliver results in diverse environments.
“In line with market trends, we continue to strengthen our customer-facing team with individuals that bring experience, curiosity and passion for customer success.” said Andrei Stapinoiu, Director of Global Sales. “Craig brings all these values and a comprehensive set of skills that will ensure our customers receive the best service in the industry.”
For more information about Europlacer and its advanced SMT solutions, visit www.europlacer.com.
About Europlacer
Europlacer is an award-winning global SMT full-line solution provider with over 50 years of engineering heritage in the electronics assembly industry. Servicing the sector with direct offices around the world and manufacturing facilities in the UK and France, Europlacer delivers flexible and dependable products to the SMT pick and place market, providing innovative solutions to complex manufacturing challenges. Europlacer is pioneering the market with great technology and a network of acknowledged experts to continue to build the long-lasting relationships that the business has thrived on for the past half-century.
POOLE, UK – Brown brings more than 20 years of experience in sales and leadership roles within the electronics manufacturing industry. Most recently, he served as General Manager at SAKI North America, where he oversaw business development and operations across the region. His career also includes an earlier role as Regional Sales Manager at Europlacer Americas, as well as eight years as Sales Manager for the Americas at DEK USA, where he directed sales efforts across the U.S., Mexico, Canada, Brazil, and Costa Rica.
Earlier in his career, Brown owned and managed TechSearch LLC, building new territories and fostering long-term customer relationships throughout the Americas. Known for presenting at national and international sales meetings, he has consistently demonstrated the ability to grow teams, expand market reach, and deliver results in diverse environments.
“In line with market trends, we continue to strengthen our customer-facing team with individuals that bring experience, curiosity and passion for customer success.” said Andrei Stapinoiu, Director of Global Sales. “Craig brings all these values and a comprehensive set of skills that will ensure our customers receive the best service in the industry.”
For more information about Europlacer and its advanced SMT solutions, visit www.europlacer.com.
About Europlacer
Europlacer is an award-winning global SMT full-line solution provider with over 50 years of engineering heritage in the electronics assembly industry. Servicing the sector with direct offices around the world and manufacturing facilities in the UK and France, Europlacer delivers flexible and dependable products to the SMT pick and place market, providing innovative solutions to complex manufacturing challenges. Europlacer is pioneering the market with great technology and a network of acknowledged experts to continue to build the long-lasting relationships that the business has thrived on for the past half-century.
CRANSTON, RI — October 2025 — Federal Electronics, a leader in providing advanced electronic manufacturing services, has installed a new Pillarhouse Jade S-200 MKII selective solder system at its Hermosillo, Mexico facility, further strengthening its ability to support high-mix, high-complexity assemblies. With one system now dedicated to lead solder and the other to lead-free, the site can better accommodate diverse customer requirements for high-mix, high-complexity assemblies.
The Jade MKII is designed for small- to medium-batch production, where precision, repeatability, and production flexibility are critical. The hand-load platform is equipped with a universally adjustable tooling carrier that accommodates PCBs or pallets up to 457mm x 508mm (18” x 20”). Pillarhouse’s patented Drop-Jet design fluxer provides fast, effective flushing of the pressurized flux chamber. This minimizes maintenance while supporting a range of flux types, including high solid content and water-soluble fluxes.
Federal Electronics’ Hermosillo facility plays a central role in the company’s North American manufacturing network, providing proximity to key customers, a highly skilled workforce, and infrastructure tailored to high-reliability markets. The addition of these selective solder systems was driven by the need to increase throughput while maintaining the company’s strict quality standards.
“Selective soldering is an important part of our capability set, especially for customers with high-reliability requirements,” said Ed Evangelista, President of Federal Electronics. “With these installations, we’re enhancing both flexibility and process control, ensuring that we can meet customer needs efficiently and consistently.”
For more information on Federal Electronics and its manufacturing capabilities, visit www.federalelec.com or contact sales@federalelec.com.
Manassas, VA – October 2, 2025: As part of its mission to advance knowledge and support the electronics manufacturing industry through technical training and education, ZESTRON Academy is pleased to announce its upcoming webinar, “Ensuring Reliability in Advanced Packaging: The Cleaning Challenge,” taking place on October 9th at 2:00 PM EDT. The session will be led by Kalyan Nukala, M.S.Ch.E., Senior Applications Engineer at ZESTRON Americas.
The electronics industry is experiencing rapid change as semiconductor packaging continues to evolve with highly advanced technologies such as System-in-Package (SiP), flip chip ball grid arrays (fcBGA), Package-on-Package (PoP), and 2.5D architectures. These innovations bring remarkable performance improvements but also introduce new and complex reliability challenges. Larger die sizes, increased bump counts, and standoff heights now dipping below 50 micrometers make flux residue removal more difficult, particularly under low-profile components.
The addition of other factors like standoff heights below 50μm and components like QFNs and LGAs further complicate the process, increasing the rest of failures from electrochemical migration and electrical leakage.
This webinar will provide attendees with a deeper understanding of why proper cleaning is an essential step in safeguarding the long-term performance of advanced packages. The session will will discuss the latest cleaning strategies that can be implemented to reduce risks, optimize processes, and prevent failure in high-reliability applications.
The webinar is open to all professionals working with advanced semiconductor packaging who are seeking to improve reliability outcomes and better understand the role of cleaning in long-term product performance. For more information and to register for free, please visit https://www.zestron.com/usa/en/education/2025-cleaning-webinars.
FREMONT, CALIFORNIA ― October 2025 ― Anda Automation, a leading global provider of fluid application and custom design manufacturing equipment, has officially opened its newest showroom and advanced testing laboratory in Guadalajara, Mexico. The facility is the most comprehensive dispensing center in Latin America and is designed to help manufacturers speed up product development and improve production efficiency.
The grand opening earlier this month brought together industry partners, customers, and local dignitaries for a ribbon-cutting ceremony. Speakers included Carlos Barraza, Mexico Sales Manager for Anda Technologies Mexico, and Abby Tsoi, CEO of Anda Americas, who noted the role the Guadalajara facility will play in connecting advanced technology with the region’s growing electronics sector.
“Guadalajara has become a center of gravity for electronics manufacturing in Latin America,” said Abby Tsoi. “By opening this facility, we’re making it easier for local manufacturers to access the technologies, training, and support they need to push new ideas into production.”
The new lab offers on-site support including technical training, application testing, and rapid delivery of key components. It is equipped with advanced dispensing systems, conformal coating applications, UV and IR curing technologies, plasma surface treatment, and 3D conformal coating inspection from Anda partners.
Core resources include two fully equipped IR and UV coating lines, a plasma treatment system for advanced surface preparation, and a range of dispensing platforms featuring multiple valve technologies. These capabilities allow customers to run real-world process evaluations, fine-tune material flow, and validate performance with precision. Whether for prototyping high-density PCBs in automotive sensors or scaling consumer electronics production, the Guadalajara facility provides a practical environment to move designs from concept to market-ready products.
For more information about Anda’s capabilities, visit www.anda.us.