NEW BRITAIN, CT, June 22, 2026 — MicroCare, LLC, a leading provider of precision cleaning fluids, specialty chemicals, and application tools, today announced the appointment of Doug Kay as Director of Market and New Business Development.
In this newly created role, Kay will focus on finding new growth opportunities, expanding strategic partnerships, and driving market development initiatives across the MicroCare core industries, including electronics, medical devices, digital infrastructure, fiber optics, defense, and industrial technology.
"Doug has a proven ability to identify market opportunities, build strong commercial partnerships, and turn strategy into growth," said Tom Tattersall, CEO of MicroCare. "As we continue to expand into new markets and deepen relationships with customers and industry partners, his experience and leadership will be instrumental in helping us accelerate that growth."
Driving Growth Through Innovation and Partnerships
Kay brings more than 15 years of experience leading commercial growth, product strategy, and market expansion initiatives across the medical device and industrial technology sectors.
Most recently, he served as Global Director of Marketing at CooperSurgical, where he led product strategy, development, and commercialization efforts across multiple global business units.
Prior to CooperSurgical, Kay held global leadership roles at Ascensia Diabetes Care and earlier marketing leadership positions at Z-Medica, Spine Wave and Covidien (Medtronic Minimally Invasive Therapies Group).
Kay earned a Bachelor of Arts degree from the University of Connecticut, where he was a Roper Center Fellow for Public Opinion and Market Research, and later completed Executive Education studies in Marketing at New York University.
Positioned for the Next Chapter of Growth
"MicroCare has built an outstanding reputation through its technical expertise, innovative chemistry, and strong customer relationships," said Doug Kay. "What excites me most is the opportunity to help expand that success into new markets while strengthening partnerships with OEMs, Tier 1 manufacturers, and industry leaders. There is tremendous potential across medical devices, electronics, robotics, defense, and digital infrastructure, and I'm excited to help customers unlock new value from MicroCare solutions while supporting the company's next phase of growth."
Altus Group, a leading distributor of capital equipment for electronics manufacturing in the UK and Ireland, has announced a new partnership with SEHO Systems GmbH, a German manufacturer specialising in wave and selective soldering systems, automation technology as well as THT inspection solutions.
The agreement strengthens Altus’ position across soldering technologies and expands its capability to support both surface mount and through-hole assembly processes as a turn key partner. Through the partnership, customers will gain local access to SEHO’s range of batch and inline soldering platforms, backed by Altus’ sales, applications, and after-sales engineering support teams.
SEHO is recognised for its expertise in automated soldering processes and has built a strong international reputation in wave and selective soldering technologies. The company manufactures selective soldering machines, wave soldering systems, integrated inspection and automation technology, supporting electronics manufacturers ranging from high-mix, low-volume production through to fully automated high-volume manufacturing environments.
Joe Booth, CEO at Altus Group, said: “SEHO is a company we’ve admired for many years. They are a perfect example of the kind of high-quality, engineering-led manufacturer we want to work with.
“Our customers are typically focused on long-term reliability, process performance, and support, rather than simply choosing the lowest-cost option. The market for wave and selective soldering across the UK and Ireland remains very strong and, with increasing pressures around manual labour, we see significant opportunities for further growth in this area.
“By combining SEHO’s technology with Altus’ local applications knowledge, sales coverage, and after-sales engineering support, we believe we can significantly strengthen their position across the region. We think this partnership of Altus & SEHO, offers one of the most attractive solutions on the market today.”
The collaboration forms part of Altus Group’s ongoing strategy to partner with leading manufacturers across every major electronics assembly process. By adding SEHO to its portfolio, the company can now offer customers a broader range of soldering technologies spanning convection reflow, vapour phase, vacuum soldering, selective soldering, robotic soldering, wave soldering, and laser soldering solutions.
Ronny Horn, Area Sales Manager at SEHO, said: “It is a great pleasure for us to partner with Altus Group. The reputation of Altus Group from both customers and suppliers is really impressive. From our perspective, they are one of the most dynamic distributors in Europe and clearly on a mission to be the best at what they do.
It will be fascinating to see how combining strong technology with excellent support and a new level of energy can further strengthen our position in the market.”
SEHO already has an established installation base across the UK and Ireland, with systems operating in a wide range of manufacturing environments. Altus expects the announcement and activity surrounding this partnership to significantly increase investments in SEHO, creating a top-quality, low risk partner for UK & Irish facilities who are looking for THT soldering automation.
To support the partnership, Altus has invested in additional technical training with SEHO in Germany, with three after-sales engineers and the wider sales team completing product and process training. A demonstration system is also scheduled to arrive at Altus Group’s Redditch headquarters, supporting customer evaluations and process development activities.
TORRANCE, CA — June 2026 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, will kick off its SMI 2026 Webinar Series with Session 1, “Solder Paste… Automating Preparation Practices,” focusing on the early-stage process variables that often determine print quality and overall SMT stability. The first session will be held on Wednesday, June 24, 2026 at 1 p.m. Eastern Time (US and Canada).
Webinar Registration:
Register for SMI 2026 Webinar Series Session 1
Solder paste remains one of the most sensitive materials in surface mount assembly. Even small inconsistencies in mix, temperature, or handling can shift viscosity and directly impact stencil printing performance, defect rates, and downstream reflow results.
This session will look at what actually drives those variations and why controlling solder paste condition before it reaches the printer is becoming a higher priority for many manufacturers. That includes maintaining consistent mixing practices, controlling working temperature, and standardizing how paste is brought to print-ready condition after storage.
A key part of the discussion will focus on viscosity measurement and its role in validating paste readiness. Seika will highlight its Malcom viscometer systems, which are designed to measure both static and dynamic viscosity by applying controlled shear to the material. This approach is intended to better reflect real printing conditions and provide more reliable insight into how a paste will behave on the stencil rather than relying on static-only measurements.
The webinar will also cover automation opportunities in paste preparation, particularly where manual handling can introduce variation, and how process control tools can help standardize what has traditionally been a highly operator-dependent step.
“In many SMT environments, paste issues don’t show up at the mixer, they show up at the printer,” said Michelle Ogihara, Executive VP, Seika Machinery. “The goal is to remove as much variability as possible before it gets that far.”
By tying together mixing practices, temperature control, and viscosity verification, the session is designed to give manufacturers a clearer path toward more consistent print performance and fewer downstream surprises.
The SMI 2026 Webinar Series is aimed at practical, shop-floor-focused improvements rather than theoretical discussion, with an emphasis on repeatable process control in real production environments.
For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com.
Adam Ryder (born 1985) has been appointed Managing Director of Incap Electronics UK as of June 17, 2026. He is responsible for leading the UK operations, including production, customer delivery and overall business performance. In addition, he will become a member of Incap’s extended management team.
Adam Ryder has been with Incap (formerly AWS Electronics) since 2005 and has held several roles within the company across quality, account management and commercial functions. In these positions, he has been responsible for customer relationships and business development and has developed broad experience in electronics manufacturing operations and customer delivery.
“I am pleased to appoint Adam Ryder as Managing Director of Incap UK. Adam has a long track record within the company and a strong understanding of our operations and customers. His experience provides a solid basis for further developing the UK operations and ensuring consistent execution,” says Otto Pukk, President and CEO of Incap Corporation.
“I appreciate the opportunity and look forward to continuing to develop the UK operations together with the team. My focus will be on maintaining reliable deliveries, supporting our customers’ needs and ensuring that our operations continue to run efficiently,” says Adam Ryder, Managing Director of Incap UK.
Incap UK unit, located in Newcastle-under-Lyme, provides full turn-key product supply including PCBAs, electro-mechanical assembly, cable and wire harness assembly, a dedicated standalone rapid prototyping facility (Fast Track), and maintenance, repair, and overhaul services (MRO). The factory has 4,400 square meters of total floor space and has experience in manufacturing since 1974, including over 20 years of experience in the defense, security, and aerospace markets.
San Marcos, CA – June 2026 – Metal Etch Services, Inc. has opened a new Midwest facility, Metal Etch Services Motor City, located in Detroit, Michigan, expanding its reach to better support customers across the central and eastern United States.
The move is a direct response to growing demand outside of Southern California, giving customers in the Midwest and East Coast a closer, more responsive option.
The new facility is equipped with advanced technology, including a Watt NEVIS stencil laser platform – the first of its kind installed in the US –as well as a Watt SE12PRO system for laser inspection, marking, and welding. The site will also support Metal Etch Services’ next-generation NanoPearl coating process.
To maintain the level of service customers have come to expect, CAD design and customer support will continue to be handled from the company’s California headquarters. This allows the team to expand production capacity without losing the hands-on collaboration and responsiveness that built its reputation.
Founded in 2005 by a group of industry veterans, Metal Etch Services has long focused on combining technical expertise with a strong customer-first approach. With roots in stencil and screen manufacturing dating back to 1983, the team continues to invest in new equipment, training, and process development to keep pace with evolving industry needs.
Metal Etch Services provides laser-cut stencils for PCB assembly, a full range of screen options, and precision thin metal parts used across electronics, medical, and industrial applications.
As the company grows, its approach remains the same: business is earned, not given. The new Motor City facility reflects that mindset, expanding capabilities while staying focused on service, quality, and long-term customer relationships.
For more on Metal Etch Services’ stencil solutions, visit www.metaletchservices.com.
Yamaha Robotics SMT section has supplied a complete surface-mount production line including printing, mounting, and 3D-AOI capabilities to Inter-Company, based in Goor, Netherlands, which builds specialised assemblies for high-end applications.
Among the many exciting projects the Inter-Company team has accomplished, building ultra-low-noise, high-frequency, high-precision electronic assemblies for research into quantum computers must be one of the most intriguing. Not only does this low-volume work require care and attention to detail, the engineering teams racing to scale qubits and realise quantum advantage expect a fast turnaround to evaluate their latest ideas quickly.
Among other exacting projects that call for advanced capabilities, high quality, and rapid response times, Inter-Company has produced weather stations for the Dutch meteorological office, complex control systems for battery charging applications, and advanced medical devices. Maritime equipment producers, also, put their trust in Inter-Company to ensure ruggedness, reliability, and safety.
Operating in these markets, Inter-Company needs to start production as soon as possible after receiving any new order. On the other hand, getting new product introductions (NPI) right first time without trial and error, and instantly fixing any problems that creep in during production, are vital from a commercial standpoint. When choosing their all-new SMT line, the team sought a supplier that could offer solutions to these challenges, in addition to the underlying component-placement capabilities.
Together, Yamaha’s YSP10 printer, YRM20 component mounters, and YRi-V 3D AOI system deliver such a solution by connecting through the unique Yamaha YSUP software platform that supports complex interactions between all the machines in the line. Special YSUP features include automatic program creation, component teaching, and building libraries, which help streamline typically time consuming and laborious tasks. Moreover, automatic real-time analysis of inspection data, during production, indicates any defects as they happen and pinpoints the causes, allowing fast remedial action. These are long-standing advantages of the Yamaha YSUP platform, made even more powerful in the latest software releases that introduce additional AI-based capabilities, which help production teams accelerate NPI and maximise end-of-line yield.