LeadCheck swabs (2515-N) are a fast method of testing components and solder joints for lead solder. Incoming components and boards, in addition to existing inventories, can be checked for RoHS compliance. This avoids mixed lead and Pb-free inventories, lead contamination in RoHS compliant work areas and potential penalties for shipping noncompliant products. Swab kits are packaged in eight-packs so every station can be equipped to prevent lead contamination from incoming and in-stock boards and components.


All Techspray branded products are RoHS compliant.

Promation has developed a small footprint line loading station that incorporates a bare PCB loader and a magazine line loader into the same work cell.

Gary Goldberg, president, said, “This new design has been developed to serve customer with limited floor space. By incorporating the two machines together, the customer also sees cost savings from shared controls without sacrificing features.”

The station may be built to handle the four most common sizes of magazine (CAB 601/701, CAB 704, CAB 706 and CAB 707). Is also compatible with NIKKO style magazines of the same dimension. The four-magazine buffer station measures 48 x 43" and the five-magazine buffer station is 64 x 43" in SL size (CAB 701).

With “One Touch” control panel, operators are offered independent control over most features of the system by depressing a button. A PCB counter is also included.

Practical Components now supplies the AIM print test board and kit designed to include printing challenges commonly encountered on manufacturers’ assemblies. In addition to BGA and microBGA pads, both have circular and square pad designs to test paste release. AIM has included the standard IPC slump test pattern to further challenge the properties of any product tested. This print pattern is more “real life” and can more accurately predict slump since individual pads are used as opposed to one pad that is common in the “thermometer” method. A number on the board indicates the distances between pads.
 
Common pad sizes were incorporated into the layout including 1206, 0805, 0402 and 0201 rectangular pads for discrete components. These pads have varying distances between them, allowing users to determine paste solder beading. Four 250 x 250 mil pads are available for use with various aperture styles to allow for wetting tests. There are also several fine-pitch QFP pads designed to check for the propensity of any given product to cause bridging, and to confirm the existence of torn prints, peaking (dog ears) or bridging.
 
Board material is FR4 170Tg with a standard ImAg finish. Digitized Gerber files are provided by Aegis Software. Available with lead-free components.

Onyx 29 semi-automated selective soldering machine provides high-performance rework of standard SMD components, but also handles problem components such as 80-mm SMD connection boards.

Has Multiple-Field-Of-View (MFOV) Vision System and an optional variable working height of up to 70 mm. Provides placement precision with standard components such as components down to 01005, flip chips, µBGA, CSP, BGA, LGA, MLF, CCGA, TCP, QFP, Fine Pitch, plug and base, RF-shields.