BP Microsystems will showcase the latest addition to its automated device programmer family, the Helix, in Wong Kong King (WKK)’s booth 1F15 at Nepcon China/EMT China, scheduled to take place April 4-7, in Shanghai.
 
With the introduction of the Helix programming system, device programming customers can get the quality of automated device handling at a lower price point than traditionally available. 
 
The desktop automated system comes with two precision-designed tube input and output handling systems. Integrated in the handler are two BP Micro Enhanced 7^th Generation programming sites with FX4 socket module capability. This technology can program up to four devices simultaneously per site. Can handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date. 
 
The operational sequence of the machine picks the part from tube input, transfers the part to the programming socket, programs the part and returns the part to tube output. Integrated motors open and close programming sites in synchronization with the placement and retrieval of parts. The tooling head requires no vision system for handling fine-pitched parts, for an overall throughput of 800 devices/hr.  One computer and software interface controls both BPWin software and handler control operations.   
 
BP Microsystems, bpmicro.com

 
Features an Easy Test Case generation with GUI and does not require programming. It integrates easily through COM interface. It also supports a range of Firewire (IEEE-1394) and USB 2.0 cameras. Run-time version with calibration features is also available.
 
Features include unlimited maximum resolution, support for up to 254 cameras, test cases controllable with separate customer-specific applications and image processing in a computer with no extra hardware. No third-party low-level image processing libraries are needed.
 
Has tools for display location and alignment as well as for pixel defect and contrast identification. It performs the measurements for pattern matching, colour and greyscale illumination and keypad backlight. Inspects the icon presence and measures the keypad distance and size. The calibration tool uses pixel grid or checkerboard pattern method. Focus analysis tool extends usage to camera module testing.
 

Europlacer will display the Xpress 25 flexible, high-volume SMT placement system in booth 1F01 at the upcoming Nepcon China/EMT China  trade show and exhibition.
 
Claims to bring new vision to modular placement ¾ combining high-speed and fine-pitch capabilities in a compact footprint. Twin heads can place an array of devices from 0201 to 50 x 50 mm QFP (70 x 70 mm QFP and 100 mm connector optional) at a tact time of 0.144 sec. (25,000 cph). Equipped with “smart nozzles” and on-the-fly vision.
 
Benefits include intelligent feeder technology, “smart” nozzles and more.
 
Has feeder capacity of 92 x 8 mm and an accuracy of ±0.06 mm (QFP) to ±0.1 mm (chip) at 4 sigma. Features a minimum pitch of 0.4 mm (with an 0.3 mm optional) and a tape size range of 8 to 88 mm.
 
Available options include: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent vibratory feeders, intelligent internal matrix tray, intelligent matrix tray sequencer, passive tape trolley, offline storage trolley, component verification, barcode reader, fixed upward vision camera and software.
 
Europlacer, europlacer.com

At SMT/Hybrid/Packaging on May 30-June 1, in Nuremberg, Germany, GÖPEL will exhibit products for AOI and JTAG/Boundary Scan.  Visitors can see the OptiCon AOI platform, the JTAG/Boundary Scan hardware architecture Scanflex and the latest version of the Integrated Boundary Scan Development Environment  System Cascon in stand 339, hall 4.
 
The OptiCon system’s core element is a modularly extendable camera. This camera allows the alternative selection between a one- and four- MegaPixel camera module. For even higher test coverage, the user can install additional camera options for THT components, color inspection or 3-D measurement as well as angled view inspection. The platform is said to offer high test speed, reduced debug times, minimal false call rate and high fault coverage.