Products
Crysta-Apex C1600/2000 Series coordinate measuring machines (CMMs) handle measurement of large auto body and airframe assemblies and similarly sized components.
The large, bridge-type machines incorporate four-loop control to reduce cost and maintain accuracy. The low acquisition cost makes it feasible to bring CMM capabilities to inspect large workpieces used in the manufacture of heavy equipment, marine construction, automotive powertrain, etc.
The multi-sensor system uses high-speed, non-contacting digitizing probes (two- or three-axis) and a variety of scanning, vision or conventional touch probe inputs. When equipped with the SP80 long stylus (max 500 mm), it is capable of deep hole measurement. System software compensates for temperature and surface variations to ensure quality data acquisition under varying conditions.
Mitutoyo America Corp., www.mitutoyo.com
The large, bridge-type machines incorporate four-loop control to reduce cost and maintain accuracy. The low acquisition cost makes it feasible to bring CMM capabilities to inspect large workpieces used in the manufacture of heavy equipment, marine construction, automotive powertrain, etc.
The multi-sensor system uses high-speed, non-contacting digitizing probes (two- or three-axis) and a variety of scanning, vision or conventional touch probe inputs. When equipped with the SP80 long stylus (max 500 mm), it is capable of deep hole measurement. System software compensates for temperature and surface variations to ensure quality data acquisition under varying conditions.
Mitutoyo America Corp., www.mitutoyo.com
SolderStar will use Nepcon Shanghai to launch three easy-to-use thermal profiling packages, designed for the technical and budgetary requirements of low, medium and high volume Pb-free electronics manufacturing environments – SolderStar Lite, SolderStar Plus and SolderStar Pro. Visit booth 2J25-9 at the exhibit.
The range is lead-free compliant and fulfills the need for fast, precise profiling and process control. Typically, clients can achieve an optimal thermal profile after 30 min. and perhaps two or three runs through the reflow oven.
The range is lead-free compliant and fulfills the need for fast, precise profiling and process control. Typically, clients can achieve an optimal thermal profile after 30 min. and perhaps two or three runs through the reflow oven.
Incorporating up-to-date battery technology, the instruments are said to have a higher working temperature than most alternatives, and they incorporate heat shielding, which keeps them cool even at higher processing temperatures. Measure just 20 to 25 mm thick. This makes them ideal for use in modern reflow ovens with limited tunnel height, typically used in the manufacture of miniaturised products, such as mobile phones.
SolderStar Lite works for the small manufacturer or as an entry-level or second system. It includes four-channel Neptune datalogger, a Pb-free capable heat-barrier and a standard software suite including a solderpaste thermal profile library, and analysis and control capabilities.
SolderStar Plus offers a six-channel Neptune datalogger with a high-performance heat barrier, and simulation software for ultra-fast profile set-up.
SolderStar Pro includes the Neptune SL datalogger with up to 12 channels for demanding processes and PCBs, as well as full-feature software that includes SPC capabilities. It can be used with accessories to optimize wave soldering processes and profiles, and is ideal for medium to large manufacturers who profile continuously as part of an ongoing quality control strategy.
SolderStar Ltd., solderstar.com
SolderStar Lite works for the small manufacturer or as an entry-level or second system. It includes four-channel Neptune datalogger, a Pb-free capable heat-barrier and a standard software suite including a solderpaste thermal profile library, and analysis and control capabilities.
SolderStar Plus offers a six-channel Neptune datalogger with a high-performance heat barrier, and simulation software for ultra-fast profile set-up.
SolderStar Pro includes the Neptune SL datalogger with up to 12 channels for demanding processes and PCBs, as well as full-feature software that includes SPC capabilities. It can be used with accessories to optimize wave soldering processes and profiles, and is ideal for medium to large manufacturers who profile continuously as part of an ongoing quality control strategy.
SolderStar Ltd., solderstar.com
Digitaltest GmbH will exhibit at the Nepcon Shanghai show with its distributor, Wacky International (Booth E1 B02), showing test systems and software suited for Asian electronics manufacturing needs.
MTS 300 SIGMA In-Circuit Tester offers flexibility, high fault coverage and easy programming. Features a modular design and range of test methods. Can be optimally configured for current needs without limiting the possibilities of future expansion. Future changes to individual test methods, as well as to the number of test pins, can be easily performed. Incorporates analog and digital in-circuit test capabilities, vectorless testing, functional test, Boundary-Scan (optional) and on-board programming. Capacity is 1000 measurements/sec.
Can emulate existing test programs and fixtures from other platforms like Aeroflex (Marconi) GenRad, Teradyne, Agilent (HP), Rohde & Schwarz. Can also be integrated into a handling system. The press system, driven by a servomotor, allows double-sided fixturing and dual level for both ICT and functional test.
MTS 180 In-Circuit Tester for high volume production. Is equipped with a Press Down Unit and a combination of analog and hybrid in-circuit test pins. Can be equipped with functional test modules to provide fault coverage and satisfy the test requirements of a number of customers. Users can create complex fixtures with features such as double-sided board access, OpensCheck probes from both sides, etc. Can be equipped with up to 1400 analog or 1400 hybrid pins.
Digitaltest GmbH, digitaltest.net
MTS 300 SIGMA In-Circuit Tester offers flexibility, high fault coverage and easy programming. Features a modular design and range of test methods. Can be optimally configured for current needs without limiting the possibilities of future expansion. Future changes to individual test methods, as well as to the number of test pins, can be easily performed. Incorporates analog and digital in-circuit test capabilities, vectorless testing, functional test, Boundary-Scan (optional) and on-board programming. Capacity is 1000 measurements/sec.
Can emulate existing test programs and fixtures from other platforms like Aeroflex (Marconi) GenRad, Teradyne, Agilent (HP), Rohde & Schwarz. Can also be integrated into a handling system. The press system, driven by a servomotor, allows double-sided fixturing and dual level for both ICT and functional test.
MTS 180 In-Circuit Tester for high volume production. Is equipped with a Press Down Unit and a combination of analog and hybrid in-circuit test pins. Can be equipped with functional test modules to provide fault coverage and satisfy the test requirements of a number of customers. Users can create complex fixtures with features such as double-sided board access, OpensCheck probes from both sides, etc. Can be equipped with up to 1400 analog or 1400 hybrid pins.
Digitaltest GmbH, digitaltest.net
DEK has developed processes for depositing silver epoxy and B-stage adhesives for die attach applications, for higher throughput and repeatability as well as enhanced control over deposit characteristics including total thickness variation (TTV).
The process for B-stage epoxy deposition allows application of die attach adhesive at the wafer level, at high rates of throughput. This streamlines package assembly and also allows OEMs to outsource this process to a wafer specialist. The process can deposit a part-cured adhesive layer of nominal thickness 50 micron, with TTV less than ±5 micron, across the back side of the wafer.
For attaching singulated die to a lead-frame or bond pad, the process replaces dispensing to deposit silver-loaded wet epoxy ahead of die attach. Many hundreds of deposits can be made simultaneously, so epoxy deposition can match the speed of die placement. Die placement rates are 40,000 units/hr., with SMT pick-and-place technology.
“Mass imaging delivers the throughput, uniformity and repeatability that commercial producers of advanced semiconductor packages need in order to economically meet market demands for quality and price,” said Clive Ashmore, Global Applied Process Engineer at DEK. “For die attach using B-stage or wet epoxy adhesives, our mass imaging processes outgun legacy techniques in every respect, to deliver a more highly optimized, faster, more repeatable and more cost-effective solution.”
DEK, www.dek.com
The process for B-stage epoxy deposition allows application of die attach adhesive at the wafer level, at high rates of throughput. This streamlines package assembly and also allows OEMs to outsource this process to a wafer specialist. The process can deposit a part-cured adhesive layer of nominal thickness 50 micron, with TTV less than ±5 micron, across the back side of the wafer.
For attaching singulated die to a lead-frame or bond pad, the process replaces dispensing to deposit silver-loaded wet epoxy ahead of die attach. Many hundreds of deposits can be made simultaneously, so epoxy deposition can match the speed of die placement. Die placement rates are 40,000 units/hr., with SMT pick-and-place technology.
“Mass imaging delivers the throughput, uniformity and repeatability that commercial producers of advanced semiconductor packages need in order to economically meet market demands for quality and price,” said Clive Ashmore, Global Applied Process Engineer at DEK. “For die attach using B-stage or wet epoxy adhesives, our mass imaging processes outgun legacy techniques in every respect, to deliver a more highly optimized, faster, more repeatable and more cost-effective solution.”
DEK, www.dek.com
M1 AOI system was developed with enhancements to satisfy high-volume manufacturing environments in the Asian market. Has a small footprint and board handling system, is designed for maximum flexibility and can adapt to pre- or post-reflow inspection and a multitude of rework and data tracking scenarios.
Based on proprietary machine vision software, the system provides fast and easy program creation. Powerful inspection algorithms identify all visible component, lead and solder anomalies. Three mega pixel Thin
Camera and Fusion Lighting enable defect coverage and low false call
rates.
YESTech, yestechinc.com
Based on proprietary machine vision software, the system provides fast and easy program creation. Powerful inspection algorithms identify all visible component, lead and solder anomalies. Three mega pixel Thin
Camera and Fusion Lighting enable defect coverage and low false call
rates.
YESTech, yestechinc.com
Tapered dispense tips provide fast flow and minimize bubbles when dispensing thick or particle–filled fluids like epoxy, silicone and brazing paste.
Precision molded polyethylene tips feature a tapered hubless design to provide smooth, unrestricted application of thick fluids; reduces rework and rejects by preventing bubbles that could cause variations in the size of fluid deposits.
The color-coded tips are available in six sizes (0.060” to 0.010” ID) to handle a variety of fluids and applications. All sizes feature double-threaded SafetyLok design for secure attachment without the risk of tips blowing off, especially when using higher dispensing pressures for thick fluids.
Available in two styles: UV-blocking translucent tips for benchtop applications, and rigid opaque tips for automated applications or light-sensitive fluids. Both are packaged in lint-free, see-through boxes of 50 that are lot numbered to simplify process control.
EFD, efd-inc.com
EFD, efd-inc.com
Press Releases
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