Products
Hirose's BK11 Series multi-power hybrid FPC-to-board connector delivers a footprint up to 46% smaller than conventional designs. Supporting two main power contacts at 4A per pin, four sub-power contacts at 2.5A per pin and 10 signal contacts.
YINCAE's TM 150LM is a Liquid Metal Thermal Interface Material (TIM). Delivers improved printability, thermal stability and reliability in high-power electronics.
ViTrox launched three Smart 3D AOI platforms – V510Ai DST, V510Ai ST and V510Ai R – designed to advance back-end PCB assembly inspection through dual-sided, AI-powered and robotic vision technology.
Indium WS-910 water-soluble flip-chip dipping flux is said to be compatible with molded and capillary underfill.
Metcal BH-4000 and BH-8000 board holders provide adjustable support systems for PCB positioning during rework and assembly. Designed for directional flexibility and three height levels. BH-4000 holds boards up to 10" x 10" (258 x 258mm). BH-8000 supports sizes up to 15" x 16.5" (378 x 418mm). Both models feature 3.3lb. (1.5kg) of clamping force, integrated locking mechanisms and compatibility with PT4-series preheaters. Suitable for PCB thicknesses between 0.02" and 0.12" (0.5–3mm), each unit ships with a screwdriver and grounding wire.
Kyocera AVX 6780-000 Series IP20 T1 industrial single-pair ethernet (SPE) connectors and cable assemblies enable data and power transmission over a single twisted pair via PoDL technology. Compact design reduces wiring and saves 45% board space compared to RJ45 connectors. Rated for 1Gb/s at 40m and 10Mb/s at 1,000m. Meet IEC 63171-6 and IEEE 802.3 standards. Applications include industrial automation, smart grids and transportation systems. Come in standard and custom cable lengths with IDC technology for assembly.
