EPIQx SMT platform integrates device-level data intelligence with high-speed placement performance to support factory-wide process control and predictive maintenance. Features modular MicroModule architecture with dual-beam linear motor system delivering up to 93,000cph and 25µm placement accuracy. Supports high feeder density and board sizes up to 508mm × 610mm. Delta also introduced cyber-physical integration smart equipment designed to connect machine, line and factory systems for real-time data exchange, adaptive process control and connected manufacturing environments.

EPIQx is a high-speed SMT placement platform designed to deliver device-level data visibility across machine, line and factory operations. Incorporates MicroModule technology that monitors more than 50 production attributes to support predictive maintenance and process control. Provides 25µm placement accuracy at full speed using closed-loop Z-axis control and image-at-placement height measurement. Dual-beam linear motor system with >2.5G acceleration delivers up to 93,000cph in a compact footprint. Supports up to 128 feeder inputs and board sizes up to 508mm × 610mm, with component capability up to 8mm square. Modular carriage design accommodates 10 MicroModules with two spindles each, with module exchange in less than 5min and self-calibration functionality.

Vishay Intertechnology has released the CRCW0201-AT e3 Series AEC-Q200 qualified thick film chip resistors in an ultra-compact 0201 case size. Measuring 0.6mm × 0.3mm × 0.23mm, the devices are designed to reduce PCB space requirements by approximately 50% compared to 0402 components. Offers a power rating of 0.05W at +70°C, a maximum operating voltage of 30V and an operating temperature range of -55°C to +155°C. Resistance values range from 10Ω to 1MΩ, including a 0Ω jumper option, with tolerances of ±1% and ±5% and a temperature coefficient of ±200ppm/K.

Henkel has expanded its conformal coating portfolio with Loctite Stycast UV 7998, a solvent-free formulation designed to deliver UL 94 V-0 flame retardancy. Engineered to protect printed circuit boards and components from moisture, dust, chemicals and other contaminants that can degrade long-term reliability. Offers self-leveling behavior, strong wetting and uniform coverage without voiding. It cures within seconds under UV light, followed by a secondary moisture cure. The solvent-free, VOC-free formulation supports environmental and operator safety objectives and can reduce CO₂ emissions by up to 40% compared with solvent-containing alternatives.