The LTX1260A 3D Inspection and Measurement and TMX Profile System is designed for non-contact inspection of delicate and high-precision components. Combines a Keyence LJ-X8020 3D scanner with the TMX-5006 profile measurement platform to deliver automated inspection of surface condition and geometric profiles. Supports applications including hypodermics, catheters, stents, guidewires, micro fasteners, fuel injector nozzles, optical fibers and precision spray and inkjet components. Features dual-station operation for 3D contamination detection and profile measurement, semi-automated fixturing with rotary and linear stages, integrated data capture with CSV and Excel export, and automation-ready architecture for future production integration. 

XQuik V is for fast, accurate X-ray-based component counting and inventory control. High-resolution X-ray imaging with enhanced source power. Automatic load drawer for simplified operation. Integrated barcode camera links reel IDs to count data. Designed to reduce manual entry errors, improve material accuracy, and speed inventory verification.

Summit LT150 is for rework of large, high-density electronic assemblies and next-generation components. Supports components up to 150mm. Large field-of-view vision system with full-component visibility. Scaled top and bottom heating with dual PID control. Supports board sizes up to 24×36in, with optional larger formats. Increased clearance for tall connectors, heat sinks, and power modules. Designed to maintain uniform thermal performance while reducing thermal stress.

Photonics Systems InnoLas DP10X0 laser depaneling system is specifically designed for PCB assembly operations.